CA2016716A1 - Shield gas wave soldering - Google Patents
Shield gas wave solderingInfo
- Publication number
- CA2016716A1 CA2016716A1 CA2016716A CA2016716A CA2016716A1 CA 2016716 A1 CA2016716 A1 CA 2016716A1 CA 2016716 A CA2016716 A CA 2016716A CA 2016716 A CA2016716 A CA 2016716A CA 2016716 A1 CA2016716 A1 CA 2016716A1
- Authority
- CA
- Canada
- Prior art keywords
- shield gas
- solder
- wave
- wave soldering
- gas wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0661—Oscillating baths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A wave soldering apparatus and process occurs in an atmosphere which substantially excludes oxygen. By providing a pressurized effect on an element to be soldered while passing through a solder wave, fluxless soldering is accomplished avoiding the necessity to remove flux residues.
The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.
The element is preheated in a shield gas atmosphere substantially excluding oxygen, moved in a predetermined path so that at least a portion of the element passes through the solder wave which is oscillated while the element is in the solder wave and maintained in the shield gas until solder on the element has solidified.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/441,009 US5044542A (en) | 1989-11-22 | 1989-11-22 | Shield gas wave soldering |
US441,009 | 1989-11-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2016716A1 true CA2016716A1 (en) | 1991-05-22 |
CA2016716C CA2016716C (en) | 1997-06-17 |
Family
ID=23751121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002016716A Expired - Fee Related CA2016716C (en) | 1989-11-22 | 1990-05-14 | Shield gas wave soldering |
Country Status (4)
Country | Link |
---|---|
US (1) | US5044542A (en) |
AU (1) | AU6716790A (en) |
CA (1) | CA2016716C (en) |
WO (1) | WO1991007248A1 (en) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5121874A (en) * | 1989-11-22 | 1992-06-16 | Electrovert Ltd. | Shield gas wave soldering |
US5230460A (en) * | 1990-06-13 | 1993-07-27 | Electrovert Ltd. | High volume convection preheater for wave soldering |
US5228614A (en) * | 1990-07-09 | 1993-07-20 | Electrovert Ltd. | Solder nozzle with gas knife jet |
FR2670986B1 (en) * | 1990-12-20 | 1996-08-02 | Air Liquide | WELDING BATH INERTAGE DEVICE OF A WAVE WELDING MACHINE. |
US5176307A (en) * | 1991-02-22 | 1993-01-05 | Praxair Technology, Inc. | Wave soldering in a protective atmosphere enclosure over a solder pot |
NL9101383A (en) * | 1991-08-13 | 1993-03-01 | Soltec Bv | SOLDERING DEVICE WITH LOW OXYGEN GAS BLANKET. |
DE4136806A1 (en) * | 1991-11-08 | 1993-05-13 | Ernst Hohnerlein | Soldering tunnel - has gas flow into the soldering zone enhanced using nozzles with slit-shaped outlet |
US5240169A (en) * | 1991-12-06 | 1993-08-31 | Electrovert Ltd. | Gas shrouded wave soldering with gas knife |
US5292055A (en) * | 1991-12-06 | 1994-03-08 | Electrovert Ltd. | Gas shrouded wave improvement |
US5397049A (en) * | 1991-12-06 | 1995-03-14 | Electrovert Ltd. | Gas shrouded solder wave with reduced solder splatter |
FR2700779B1 (en) * | 1993-01-22 | 1995-03-10 | Lorraine Laminage | Method for purifying a coating bath of metallurgical products with a metal alloy, and installation for implementing this method. |
WO1994023888A1 (en) * | 1993-02-05 | 1994-10-27 | Electrovert Ltd. | Non lead soldering in a substantially oxygen free atmosphere |
JP2567336B2 (en) * | 1993-04-23 | 1996-12-25 | 一郎 川勝 | Soldering equipment in an inert atmosphere |
WO1994027737A1 (en) * | 1993-05-27 | 1994-12-08 | Dai Nippon Printing Co., Ltd. | Method of and apparatus for application of liquid |
US5568894A (en) * | 1993-06-04 | 1996-10-29 | Electrovert Ltd. | Applying flux to a solder wave for wave soldering an element |
TW332007U (en) * | 1993-06-22 | 1998-05-11 | Ciba Geigy Corp | Continuous drier for board-shaped Continuous piece material and coating installation comprising such a continuous drier |
US5364007A (en) * | 1993-10-12 | 1994-11-15 | Air Products And Chemicals, Inc. | Inert gas delivery for reflow solder furnaces |
US5409159A (en) * | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
US5720815A (en) * | 1996-03-01 | 1998-02-24 | Xerox Corporation | Dip coating apparatus having solution displacement apparatus |
US5725667A (en) * | 1996-03-01 | 1998-03-10 | Xerox Corporation | Dip coating apparatus having a single coating vessel |
DE19749184B4 (en) * | 1997-11-07 | 2007-03-01 | Air Liquide Deutschland Gmbh | soldering device |
DE19749187A1 (en) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Soldering device |
DE19749185A1 (en) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Gas distribution that can be connected to a gas supply |
NL1009615C2 (en) * | 1998-07-10 | 2000-01-28 | Soltec Bv | Method and device for separating solder-floating dross. |
US6315189B1 (en) * | 1998-10-13 | 2001-11-13 | Texas Instruments Incorporated | Semiconductor package lead plating method and apparatus |
US6234380B1 (en) | 1998-10-29 | 2001-05-22 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and method for inerting a wave soldering installation |
DE19912718C1 (en) * | 1999-03-20 | 2000-02-03 | Messer Griesheim Gmbh | Soldering device for flat component group e.g. ball grid array components |
JP2001251047A (en) * | 2000-03-07 | 2001-09-14 | Senju Metal Ind Co Ltd | Method of soldering printed board and automatic soldering apparatus |
JP2001267733A (en) * | 2000-03-17 | 2001-09-28 | Mitsumi Electric Co Ltd | Soldering method |
EP1259101A4 (en) * | 2000-09-26 | 2003-04-09 | Matsushita Electric Ind Co Ltd | Method and device for flow soldering |
JP3942623B2 (en) * | 2005-12-12 | 2007-07-11 | 富士通テン株式会社 | Flat dip device and method of soldering flat dip device |
DE502007006711D1 (en) * | 2006-05-23 | 2011-04-28 | Linde Ag | Apparatus and method for wave soldering |
ES2331294B2 (en) * | 2006-12-08 | 2010-09-14 | Fujitsu Ten Limited | APPARATUS AND METHOD FOR WELDING A FLAT WORK PIECE. |
JP5343566B2 (en) * | 2009-01-08 | 2013-11-13 | 富士通株式会社 | Joining method and reflow apparatus |
DE102011106762A1 (en) * | 2011-07-05 | 2013-01-10 | Sensor-Technik Wiedemann Gmbh | Method for wave soldering of e.g. printed circuit boards in wave soldering station to connect cooling bodies, involves preheating products for even heat distribution via solder masks, which consist of infrared transparent material portions |
DE102012022669B4 (en) | 2012-11-21 | 2022-10-13 | Illinois Tool Works Inc. | selective soldering system |
US9370838B2 (en) | 2014-08-21 | 2016-06-21 | Illinois Tool Works Inc. | Wave soldering nozzle system and method of wave soldering |
JP6666071B2 (en) * | 2015-04-03 | 2020-03-13 | セイテック株式会社 | Local soldering method |
US10029326B2 (en) | 2016-10-26 | 2018-07-24 | Illinois Tool Works Inc. | Wave soldering nozzle having automatic adjustable throat width |
US10780516B2 (en) | 2018-06-14 | 2020-09-22 | Illinois Tool Works Inc. | Wave solder nozzle with automated adjustable sliding plate to vary solder wave width |
US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA648531A (en) * | 1962-09-11 | M. Fox William | Fabrication of semiconductor devices | |
CA1002391A (en) * | 1974-10-07 | 1976-12-28 | Electrovert Ltd. - Electrovert Ltee | Wave-soldering of printed circuits |
JPS5395854A (en) * | 1977-02-02 | 1978-08-22 | Asahi Glass Co Ltd | Method and apparatus for soldering with no flux |
JPS5927771A (en) * | 1982-08-09 | 1984-02-14 | Hitachi Ltd | Soldering device |
DE3309648A1 (en) * | 1983-03-15 | 1984-09-20 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR SOLDERING PLATE-SHAPED CIRCUIT CARRIERS WITHIN A PROTECTIVE GAS SOLDERING DEVICE |
US4538757A (en) * | 1983-08-01 | 1985-09-03 | Motorola, Inc. | Wave soldering in a reducing atmosphere |
US4580716A (en) * | 1984-10-17 | 1986-04-08 | Rca Corporation | Apparatus and method for vapor phase solder reflow |
US4684056A (en) * | 1985-05-03 | 1987-08-04 | Electrovert Limited | Vibratory wave soldering |
DE8520254U1 (en) * | 1985-07-11 | 1985-10-31 | Siemens AG, 1000 Berlin und 8000 München | Soldering device for soldering electronic flat assemblies in a soldering chamber filled with inert gas |
JPS6224859A (en) * | 1985-07-24 | 1987-02-02 | Kenji Kondo | Soldering device |
US4697230A (en) * | 1986-06-23 | 1987-09-29 | Westinghouse Electric Corp. | AC power supplied static switching apparatus having energy recovery capability |
US4696226A (en) * | 1986-08-28 | 1987-09-29 | Witmer Warner H | Fluid barrier curtain system |
JPS63174778A (en) * | 1987-01-11 | 1988-07-19 | Daiichi Tsusho:Kk | Automatic soldering method and its device |
KR920008948B1 (en) * | 1987-02-12 | 1992-10-12 | 니혼 덴네쯔 게이기 가부시끼가이샤 | Soldering apparatus |
NL8701237A (en) * | 1987-05-22 | 1988-12-16 | Soltec Bv | Apparatus for applying conductive adhesive, such as solder, to a printed circuit board. |
DE3737563A1 (en) * | 1987-11-05 | 1989-05-18 | Ernst Hohnerlein | SOLDERING MACHINE |
US4821947A (en) * | 1988-02-08 | 1989-04-18 | Union Carbide Corporation | Fluxless application of a metal-comprising coating |
DE3813931C2 (en) * | 1988-04-25 | 1995-05-04 | Resma Gmbh Fuegetechnik Indust | Inert gas soldering method and device for carrying out this method |
-
1989
- 1989-11-22 US US07/441,009 patent/US5044542A/en not_active Expired - Lifetime
-
1990
- 1990-05-14 CA CA002016716A patent/CA2016716C/en not_active Expired - Fee Related
- 1990-11-15 AU AU67167/90A patent/AU6716790A/en not_active Abandoned
- 1990-11-15 WO PCT/CA1990/000387 patent/WO1991007248A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU6716790A (en) | 1991-06-13 |
WO1991007248A1 (en) | 1991-05-30 |
CA2016716C (en) | 1997-06-17 |
US5044542A (en) | 1991-09-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |