JPS53109477A - Mounting method of semiconductor element - Google Patents

Mounting method of semiconductor element

Info

Publication number
JPS53109477A
JPS53109477A JP2395377A JP2395377A JPS53109477A JP S53109477 A JPS53109477 A JP S53109477A JP 2395377 A JP2395377 A JP 2395377A JP 2395377 A JP2395377 A JP 2395377A JP S53109477 A JPS53109477 A JP S53109477A
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting method
mounting
soldering
occurrence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2395377A
Other languages
Japanese (ja)
Inventor
Katsuya Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2395377A priority Critical patent/JPS53109477A/en
Publication of JPS53109477A publication Critical patent/JPS53109477A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body

Abstract

PURPOSE: To avoid the occurrence of air bubbles in the solder used for soldering, by mounting the semiconductor element in the concave part of the metal frame under reduced pressure.
COPYRIGHT: (C)1978,JPO&Japio
JP2395377A 1977-03-07 1977-03-07 Mounting method of semiconductor element Pending JPS53109477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2395377A JPS53109477A (en) 1977-03-07 1977-03-07 Mounting method of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2395377A JPS53109477A (en) 1977-03-07 1977-03-07 Mounting method of semiconductor element

Publications (1)

Publication Number Publication Date
JPS53109477A true JPS53109477A (en) 1978-09-25

Family

ID=12124900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2395377A Pending JPS53109477A (en) 1977-03-07 1977-03-07 Mounting method of semiconductor element

Country Status (1)

Country Link
JP (1) JPS53109477A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990936A (en) * 1982-10-08 1984-05-25 ウエスターン　エレクトリック　カムパニー，インコーポレーテッド Method of bonding ultrasmall electronic chip
JPS59198727A (en) * 1983-04-26 1984-11-10 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS60177661A (en) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd Soldering method of semiconductor
JPS6365252U (en) * 1986-10-20 1988-04-30
JPH01185928A (en) * 1988-01-21 1989-07-25 Fuji Electric Co Ltd Manufacture of semiconductor device
JP2008277757A (en) * 2007-03-06 2008-11-13 Infineon Technologies Ag Solder connection section between semiconductor chip and substrate, and manufacturing process for the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990936A (en) * 1982-10-08 1984-05-25 ウエスターン　エレクトリック　カムパニー，インコーポレーテッド Method of bonding ultrasmall electronic chip
JPS59198727A (en) * 1983-04-26 1984-11-10 Nec Home Electronics Ltd Manufacture of semiconductor device
JPS60177661A (en) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd Soldering method of semiconductor
JPS6365252U (en) * 1986-10-20 1988-04-30
JPH0546283Y2 (en) * 1986-10-20 1993-12-03
JPH01185928A (en) * 1988-01-21 1989-07-25 Fuji Electric Co Ltd Manufacture of semiconductor device
JP2008277757A (en) * 2007-03-06 2008-11-13 Infineon Technologies Ag Solder connection section between semiconductor chip and substrate, and manufacturing process for the same

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