JPS53124069A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS53124069A JPS53124069A JP2510377A JP2510377A JPS53124069A JP S53124069 A JPS53124069 A JP S53124069A JP 2510377 A JP2510377 A JP 2510377A JP 2510377 A JP2510377 A JP 2510377A JP S53124069 A JPS53124069 A JP S53124069A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- enhance
- chip
- heating
- quality
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Abstract
PURPOSE: To enhance the quality of the gang bonding by heating up the chip from the back side.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2510377A JPS53124069A (en) | 1977-03-08 | 1977-03-08 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2510377A JPS53124069A (en) | 1977-03-08 | 1977-03-08 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS53124069A true JPS53124069A (en) | 1978-10-30 |
Family
ID=12156578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2510377A Pending JPS53124069A (en) | 1977-03-08 | 1977-03-08 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53124069A (en) |
-
1977
- 1977-03-08 JP JP2510377A patent/JPS53124069A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5435689A (en) | Semiconductor integrated circuit device | |
| JPS5395571A (en) | Semiconductor device | |
| JPS53113032A (en) | Immune depresants | |
| JPS5394875A (en) | Package for semiconductor element | |
| JPS525273A (en) | Transistor | |
| JPS53124069A (en) | Semiconductor device | |
| JPS5441665A (en) | Manufacture for semiconductor device | |
| JPS5210032A (en) | Construction method of semiconductor memory unit | |
| JPS53116072A (en) | Electrode forming method for semiconductor device | |
| JPS5423474A (en) | Mesa groove forming method for semiconductor element | |
| JPS5236980A (en) | Heat sink for semiconductor devices | |
| JPS544568A (en) | Semiconductor device and production of the same | |
| JPS52147065A (en) | Semiconductor device | |
| JPS53128980A (en) | Positioning device for bonding | |
| JPS5410682A (en) | Production of semiconductor elements | |
| JPS5432278A (en) | Semiconductor device | |
| JPS52134375A (en) | Semiconductor package | |
| JPS53126275A (en) | Semiconductor device | |
| JPS52141565A (en) | Manufacture of semiconductor unit | |
| JPS52103983A (en) | Semiconductor integrated circuit | |
| JPS53144671A (en) | Production of semiconductor device | |
| JPS5411671A (en) | Sealing method of semiconductor device | |
| JPS5224537A (en) | Slide preparing device | |
| JPS5252372A (en) | Semiconductor device | |
| JPS5399764A (en) | Semiconductor device having bonding pad |