JPS51130170A - Ic lead frame process - Google Patents
Ic lead frame processInfo
- Publication number
- JPS51130170A JPS51130170A JP5571775A JP5571775A JPS51130170A JP S51130170 A JPS51130170 A JP S51130170A JP 5571775 A JP5571775 A JP 5571775A JP 5571775 A JP5571775 A JP 5571775A JP S51130170 A JPS51130170 A JP S51130170A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- frame process
- gold
- economizes
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: A process for lead frames for IC devices which economizes use of gold and utilizes metal plating to substitute gold for various purposes.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50055717A JPS5854507B2 (en) | 1975-05-07 | 1975-05-07 | Lead frame manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50055717A JPS5854507B2 (en) | 1975-05-07 | 1975-05-07 | Lead frame manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51130170A true JPS51130170A (en) | 1976-11-12 |
JPS5854507B2 JPS5854507B2 (en) | 1983-12-05 |
Family
ID=13006614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50055717A Expired JPS5854507B2 (en) | 1975-05-07 | 1975-05-07 | Lead frame manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5854507B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57166058A (en) * | 1981-04-07 | 1982-10-13 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS5818947A (en) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | Lead frame |
JPS58123744A (en) * | 1982-01-18 | 1983-07-23 | Fujitsu Ltd | Manufacture of lead frame and semiconductor device |
JPS6113950U (en) * | 1984-06-29 | 1986-01-27 | 大日本印刷株式会社 | Semiconductor lead frame with metal partial coating |
JPH01223754A (en) * | 1988-03-03 | 1989-09-06 | Seikosha Co Ltd | Lead frame for wire bonding |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5047566A (en) * | 1973-07-13 | 1975-04-28 |
-
1975
- 1975-05-07 JP JP50055717A patent/JPS5854507B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5047566A (en) * | 1973-07-13 | 1975-04-28 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57166058A (en) * | 1981-04-07 | 1982-10-13 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS5818947A (en) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | Lead frame |
JPS58123744A (en) * | 1982-01-18 | 1983-07-23 | Fujitsu Ltd | Manufacture of lead frame and semiconductor device |
JPS6113950U (en) * | 1984-06-29 | 1986-01-27 | 大日本印刷株式会社 | Semiconductor lead frame with metal partial coating |
JPH01223754A (en) * | 1988-03-03 | 1989-09-06 | Seikosha Co Ltd | Lead frame for wire bonding |
Also Published As
Publication number | Publication date |
---|---|
JPS5854507B2 (en) | 1983-12-05 |
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