JPS5047566A - - Google Patents

Info

Publication number
JPS5047566A
JPS5047566A JP48078381A JP7838173A JPS5047566A JP S5047566 A JPS5047566 A JP S5047566A JP 48078381 A JP48078381 A JP 48078381A JP 7838173 A JP7838173 A JP 7838173A JP S5047566 A JPS5047566 A JP S5047566A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48078381A
Other languages
Japanese (ja)
Other versions
JPS5751741B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48078381A priority Critical patent/JPS5751741B2/ja
Publication of JPS5047566A publication Critical patent/JPS5047566A/ja
Publication of JPS5751741B2 publication Critical patent/JPS5751741B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP48078381A 1973-07-13 1973-07-13 Expired JPS5751741B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48078381A JPS5751741B2 (en) 1973-07-13 1973-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48078381A JPS5751741B2 (en) 1973-07-13 1973-07-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP4913182A Division JPS57172756A (en) 1982-03-29 1982-03-29 Resin sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5047566A true JPS5047566A (en) 1975-04-28
JPS5751741B2 JPS5751741B2 (en) 1982-11-04

Family

ID=13660425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48078381A Expired JPS5751741B2 (en) 1973-07-13 1973-07-13

Country Status (1)

Country Link
JP (1) JPS5751741B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51130170A (en) * 1975-05-07 1976-11-12 Nec Corp Ic lead frame process
JPS5221769A (en) * 1975-08-11 1977-02-18 Fujitsu Ltd Mold ic producing system
JPS5232268A (en) * 1975-09-08 1977-03-11 Hitachi Ltd Electrode lead process
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit
JPS57122558A (en) * 1981-11-30 1982-07-30 Hitachi Ltd Manufacture of lead for electrode
US5532910A (en) * 1992-04-28 1996-07-02 Nippondenso Co., Ltd. Hybrid integrated circuit and process for producing same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196019A (en) * 1985-02-27 1986-08-30 Kiso Kogyo Kk Lifting device for suspended matter in expansion bottom part
JPS626020A (en) * 1985-07-02 1987-01-13 Kiso Kogyo Kk Construction of bottom-expanded pile

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51130170A (en) * 1975-05-07 1976-11-12 Nec Corp Ic lead frame process
JPS5854507B2 (en) * 1975-05-07 1983-12-05 日本電気株式会社 Lead frame manufacturing method
JPS5221769A (en) * 1975-08-11 1977-02-18 Fujitsu Ltd Mold ic producing system
JPS5232268A (en) * 1975-09-08 1977-03-11 Hitachi Ltd Electrode lead process
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit
JPS57122558A (en) * 1981-11-30 1982-07-30 Hitachi Ltd Manufacture of lead for electrode
US5532910A (en) * 1992-04-28 1996-07-02 Nippondenso Co., Ltd. Hybrid integrated circuit and process for producing same

Also Published As

Publication number Publication date
JPS5751741B2 (en) 1982-11-04

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