JPS5246774A - Process for production of lead frame for semiconductors - Google Patents

Process for production of lead frame for semiconductors

Info

Publication number
JPS5246774A
JPS5246774A JP12273675A JP12273675A JPS5246774A JP S5246774 A JPS5246774 A JP S5246774A JP 12273675 A JP12273675 A JP 12273675A JP 12273675 A JP12273675 A JP 12273675A JP S5246774 A JPS5246774 A JP S5246774A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductors
production
leads
consumption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12273675A
Other languages
Japanese (ja)
Other versions
JPS5436072B2 (en
Inventor
Shigemasa Nakazawa
Koji Suda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP12273675A priority Critical patent/JPS5246774A/en
Publication of JPS5246774A publication Critical patent/JPS5246774A/en
Publication of JPS5436072B2 publication Critical patent/JPS5436072B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To selectively peel the bonding metal plating formed on the entire surface of a lead frame by way of a self-adhesive tape, thereby reducing the consumption of precious metal and eliminating shorting between leads.
COPYRIGHT: (C)1977,JPO&Japio
JP12273675A 1975-10-11 1975-10-11 Process for production of lead frame for semiconductors Granted JPS5246774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12273675A JPS5246774A (en) 1975-10-11 1975-10-11 Process for production of lead frame for semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12273675A JPS5246774A (en) 1975-10-11 1975-10-11 Process for production of lead frame for semiconductors

Publications (2)

Publication Number Publication Date
JPS5246774A true JPS5246774A (en) 1977-04-13
JPS5436072B2 JPS5436072B2 (en) 1979-11-07

Family

ID=14843307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12273675A Granted JPS5246774A (en) 1975-10-11 1975-10-11 Process for production of lead frame for semiconductors

Country Status (1)

Country Link
JP (1) JPS5246774A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151346A (en) * 1984-08-21 1986-03-13 Photo Composing Mach Mfg Co Ltd System for printing proof manuscript
JPH0832004A (en) * 1994-07-13 1996-02-02 Goto Seisakusho:Kk Plating method of lead frame for semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6151346A (en) * 1984-08-21 1986-03-13 Photo Composing Mach Mfg Co Ltd System for printing proof manuscript
JPH0832004A (en) * 1994-07-13 1996-02-02 Goto Seisakusho:Kk Plating method of lead frame for semiconductor device

Also Published As

Publication number Publication date
JPS5436072B2 (en) 1979-11-07

Similar Documents

Publication Publication Date Title
JPS5317265A (en) Tight adhesion method between metallic part and insulating material
JPS5246774A (en) Process for production of lead frame for semiconductors
JPS51130170A (en) Ic lead frame process
JPS5246772A (en) Process for production of lead frame for semiconductors
JPS5240083A (en) Process for production of metal tapes
JPS5261480A (en) Production of lead frame for ic
JPS5223270A (en) Method of manufacturing lead frames for semiconductors
JPS5246773A (en) Process for production of lead frame for semiconductors
JPS5310266A (en) Production of soldred semiconductor wafers
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS53140967A (en) Production of electrodes of semiconductor device
JPS53101975A (en) Treating method of semiconductor substrates
JPS5288318A (en) Magnetic head and its production
JPS5380161A (en) Electrode formation of semiconductor
JPS5223281A (en) Method of manufacturing semiconductor device
JPS51138166A (en) Production method of semiconductor device
JPS5222879A (en) Semiconductor mounting structure
JPS5347772A (en) Semiconductor device
JPS5352365A (en) Semiconductor device
JPS5367620A (en) Electrolytic refining method for silver
JPS5219076A (en) Production method of semiconductor package
JPS5387166A (en) Electronic part bonding tool and its production
JPS5263674A (en) Semiconductor device
JPS5258375A (en) Production of low reflection metal mask
JPS5273675A (en) Structure of die bonding