JPS5219076A - Production method of semiconductor package - Google Patents
Production method of semiconductor packageInfo
- Publication number
- JPS5219076A JPS5219076A JP9471675A JP9471675A JPS5219076A JP S5219076 A JPS5219076 A JP S5219076A JP 9471675 A JP9471675 A JP 9471675A JP 9471675 A JP9471675 A JP 9471675A JP S5219076 A JPS5219076 A JP S5219076A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- production method
- base
- plate
- noelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: In order to simplify the process of production according to Pd noelectric field plating method, when producing a semiconductor package by forming the multilayer distribution on the surface of base-plate and the external lead use pad on the back of base-plate respectively.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9471675A JPS5219076A (en) | 1975-08-05 | 1975-08-05 | Production method of semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9471675A JPS5219076A (en) | 1975-08-05 | 1975-08-05 | Production method of semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5219076A true JPS5219076A (en) | 1977-01-14 |
JPS5731296B2 JPS5731296B2 (en) | 1982-07-03 |
Family
ID=14117850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9471675A Granted JPS5219076A (en) | 1975-08-05 | 1975-08-05 | Production method of semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5219076A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59168659A (en) * | 1983-03-15 | 1984-09-22 | Furukawa Electric Co Ltd:The | Lead frame for integrated circuit |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957371A (en) * | 1972-10-04 | 1974-06-04 |
-
1975
- 1975-08-05 JP JP9471675A patent/JPS5219076A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957371A (en) * | 1972-10-04 | 1974-06-04 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59168659A (en) * | 1983-03-15 | 1984-09-22 | Furukawa Electric Co Ltd:The | Lead frame for integrated circuit |
JPS6349382B2 (en) * | 1983-03-15 | 1988-10-04 | Furukawa Electric Co Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPS5731296B2 (en) | 1982-07-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5219076A (en) | Production method of semiconductor package | |
JPS5240968A (en) | Process for production of semiconductor device | |
JPS53120383A (en) | Production of semiconductor device | |
JPS5391577A (en) | Manufacture of semiconductor device of resinsealing type | |
JPS5363871A (en) | Production of semiconductor device | |
JPS51118391A (en) | Manufacturing process for semiconducter unit | |
JPS51126077A (en) | Manufacturing method of semi-conductor equpment | |
JPS51147286A (en) | Manufacturing process of semiconductor | |
JPS51123582A (en) | Semiconductor device production system | |
JPS51123086A (en) | Semicanductor device and its production process | |
JPS5310266A (en) | Production of soldred semiconductor wafers | |
JPS5352060A (en) | Production of semiconductor unit | |
JPS5261480A (en) | Production of lead frame for ic | |
JPS5379469A (en) | Manufacture of glass mold type semiconductor rectifying device | |
JPS5223281A (en) | Method of manufacturing semiconductor device | |
JPS535571A (en) | Circuit block and its manufacture | |
JPS5251872A (en) | Production of semiconductor device | |
JPS5294070A (en) | Process for preparing semi-conductor | |
JPS5315768A (en) | Production of semiconductor device | |
JPS5261956A (en) | Production of semiconductor device | |
JPS5313874A (en) | Production of semiconductor device | |
JPS51150286A (en) | Production method of semiconductor device | |
JPS5273675A (en) | Structure of die bonding | |
JPS5347779A (en) | Production of semiconductor device | |
JPS5273673A (en) | Production of semiconductor device |