JPH0546283Y2 - - Google Patents
Info
- Publication number
- JPH0546283Y2 JPH0546283Y2 JP1986160967U JP16096786U JPH0546283Y2 JP H0546283 Y2 JPH0546283 Y2 JP H0546283Y2 JP 1986160967 U JP1986160967 U JP 1986160967U JP 16096786 U JP16096786 U JP 16096786U JP H0546283 Y2 JPH0546283 Y2 JP H0546283Y2
- Authority
- JP
- Japan
- Prior art keywords
- filter
- vacuum
- semiconductor chip
- bonding
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000003384 imaging method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000001444 catalytic combustion detection Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
本考案は固体撮像装置の製造装置に関し、特に
は固体撮像装置を構成するフイルタと半導体チツ
プとを貼り合わせる装置に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an apparatus for manufacturing a solid-state imaging device, and more particularly to an apparatus for bonding a filter and a semiconductor chip constituting a solid-state imaging device.
〈従来の技術〉
デジタル量だけでなくアナログ量をも処理する
機能を持つ撮像素子として電荷結合素子（以下
CCD）がある。上述する機能のため、LSIの進歩
と相まつてCCDの性能は急速に発展を遂げてお
り、これらの研究成果を反映して現在、CCDは
イメージ・センサ、アナログ遅延線、メモリ等に
幅広く応用されている。<Conventional technology> Charge-coupled devices (hereinafter referred to as
CCD). Because of the above-mentioned functions, the performance of CCDs has been rapidly developing along with advances in LSI, and as a result of these research results, CCDs are now being widely applied to image sensors, analog delay lines, memories, etc. ing.
さて、上述のイメージ・センサ等の固体撮像装
置として応用されるCCDを備えた半導体チツプ
は同一半導体チツプ上に光電変換部をも備えてな
る。固体撮像装置は該半導体チツプに分解フイル
タを貼り合わせることにより、光電変換部にて受
光する光線を選択する。この半導体チツプと分解
フイルタを貼り合わせる装置は以下の如き構造を
もつ。即ち、該装置基盤に、半導体チツプを積載
したパツケージを載置すべきエコライジング軸が
設けられ、また該エコライジング軸はパツケージ
吸引口を内蔵しており、この吸引口に依りパツケ
ージをエコライジング軸に真空吸着する。該エコ
ライジング軸上部に該エコライジング軸に対向し
てフイルタを真空吸着すべきフイルタチヤツクが
具備され、また該フイルタチヤツクはフイルタ吸
引口を内蔵しており、この吸引口に依りフイルタ
を真空吸着する。 Now, a semiconductor chip equipped with a CCD, which is applied as a solid-state imaging device such as the above-mentioned image sensor, also includes a photoelectric conversion section on the same semiconductor chip. A solid-state imaging device selects a light beam to be received by a photoelectric conversion section by bonding a separation filter to the semiconductor chip. This apparatus for bonding a semiconductor chip and a decomposition filter has the following structure. That is, the equipment base is provided with an equalizing shaft on which a package loaded with semiconductor chips is placed, and the equalizing shaft has a built-in package suction port, which allows the package to be placed on the equalizing shaft. Vacuum adsorption to. A filter chuck for vacuum suction of the filter is provided on the upper part of the equalizing shaft and facing the equalizing shaft, and the filter chuck has a built-in filter suction port, and the filter is vacuum suctioned by the suction port.
上述する構造をもつフイルタ貼合せ装置を稼動
させてフイルタを貼合せる場合、エコライジング
軸上に半導体チツプを積載したパツケージを真空
吸着した後、該半導体チツプに接着剤を塗布し、
一方フイルタはフイルタチヤツクに真空吸着す
る。次に上記エコライジング軸を上昇させてフイ
ルタチヤツクと衝合させることにより、半導体チ
ツプとフイルタとを貼り合わせる。 When a filter is bonded by operating a filter bonding device having the above-described structure, a package loaded with semiconductor chips is vacuum suctioned onto an equalizing shaft, and then an adhesive is applied to the semiconductor chips.
On the other hand, the filter is vacuum-adsorbed onto the filter chuck. Next, the equalizing shaft is raised and brought into contact with the filter chuck, thereby bonding the semiconductor chip and the filter together.
〈考案が解決しようとする問題点〉
上記従来のフイルタ貼合せ装置は常圧下で用い
るものである。このため、半導体チツプに塗布し
た接着剤中に気泡が残存し、接着剤中に気泡が残
存したままで半導体チツプとフイルタとが貼り合
わされてしまい、気泡により、均一な入力光が乱
され固体撮像装置の特性に悪影響を及ぼすという
問題がある。<Problems to be solved by the invention> The conventional filter bonding apparatus described above is used under normal pressure. For this reason, air bubbles remain in the adhesive applied to the semiconductor chip, and the semiconductor chip and filter are bonded together with the air bubbles remaining in the adhesive.The air bubbles disturb the uniform input light and solid-state imaging. There is a problem that the characteristics of the device are adversely affected.
〈問題点を解決するための手段〉
本考案のフイルタ貼合せ装置は、上述する問題
を解決するためになされたもので、固体撮像装置
製造工程下で、フイルタと半導体チツプとを貼り
合わせるフイルタ貼合せ装置において、上記半導
体チツプを積載したパツケージを真空吸着するエ
コライジング軸と、上記エコライジング軸を囲む
チヤンバ側壁と、上記エコライジング軸の上部に
あつて上記フイルタを真空吸着するフイルタチヤ
ツクと、該フイルタチヤツクと上記チヤンバ側壁
とをつなぐゴムシールとを有し、且つ、上記フイ
ルタを真空吸着した上記フイルタチヤツクと上記
半導体チツプを真空吸着した上記エコライジング
軸と上記チヤンバ側壁と上記ゴムシールとにより
形成される空間を減圧する減圧機構を備えたこと
を特徴とするものである。<Means for Solving the Problems> The filter bonding device of the present invention was developed to solve the above-mentioned problems, and is a filter bonding device for bonding filters and semiconductor chips together during the manufacturing process of solid-state imaging devices. The matching device includes: an equalizing shaft for vacuum suctioning the package loaded with the semiconductor chips; a chamber side wall surrounding the equalizing shaft; a filter chuck located above the equalizing shaft for vacuum suctioning the filter; and a rubber seal that connects the filter chuck to the filter chuck, the equalizing shaft to which the semiconductor chip is vacuum suctioned, the chamber side wall, and the rubber seal to reduce pressure. It is characterized by being equipped with a pressure reducing mechanism.
〈作用〉
減圧することが可能なチヤンバを備えたフイル
タ貼合せ装置を用いて、減圧状態下でフイルタと
半導体チツプとの貼り合わせを行なうことによ
り、半導体チツプに塗布した接着剤中に含まれる
気泡を除去してから貼り合わせを行なえるため、
半導体チツプ表面に均一な入力光が得られる。<Function> By bonding the filter and the semiconductor chip under reduced pressure using a filter bonding device equipped with a chamber capable of reducing pressure, air bubbles contained in the adhesive applied to the semiconductor chip can be removed. can be pasted after removing the
Uniform input light can be obtained on the surface of the semiconductor chip.
〈実施例〉
第１図は本発明の一実施例を示す断面図であ
る。即ち、装置基盤Ａにエコライジング軸１が挿
着されており、該エコライジング軸１はパツケー
ジ吸引口を内蔵し、該パツケージ吸引口は真空装
置に結合される。また、該エコライジング軸１は
チヤンバ側壁４に囲まれる。上記エコライジング
軸１上部にはフイルタチヤツク５が設けられ、該
フイルタチヤツク５は上記チヤンバ側壁４とで減
圧チヤンバ９内を減圧状態に保持する。該フイル
タチヤツク５と上記チヤンバ側壁４とはゴムシー
ル８を介してつながれる。上記フイルタチヤツク
５の上記エコライジング軸１に対向する位置には
フイルタ吸引口７が貫通し、該フイルタ吸引口７
は真空装置に結合される。また、上記チヤンバ側
壁４、フイルタチヤツク５及びゴムシール８とか
ら成る減圧チヤンバ９は減圧チヤンバ吸引口１０
により減圧される。<Embodiment> FIG. 1 is a sectional view showing an embodiment of the present invention. That is, an equalizing shaft 1 is inserted into the device base A, and the equalizing shaft 1 has a package suction port built therein, and the package suction port is connected to a vacuum device. Further, the equalizing axis 1 is surrounded by a chamber side wall 4. A filter chuck 5 is provided above the equalizing shaft 1, and the filter chuck 5 maintains the inside of the vacuum chamber 9 in a reduced pressure state in conjunction with the chamber side wall 4. The filter chuck 5 and the chamber side wall 4 are connected via a rubber seal 8. A filter suction port 7 passes through the filter chuck 5 at a position facing the equalizing shaft 1.
is coupled to a vacuum device. Further, the vacuum chamber 9 consisting of the chamber side wall 4, filter chuck 5 and rubber seal 8 has a vacuum chamber suction port 10.
The pressure is reduced by
上記エコライジング軸１上に半導体チツプ３を
積載したパツケージ２を載置し、真空装置を作動
させてエコライジング軸１に真空吸着した後、該
半導体チツプ３に接着剤（図示せず）を塗布す
る。一方、フイルタ６は真空装置の作用によりフ
イルタチヤツク５のフイルタ吸引口７に真空吸着
される。該フイルタ６を真空吸着したフイルタチ
ヤツク５を、パツケージ２を真空吸着したエコラ
イジング軸１上の所定の位置まで移動させた後、
減圧チヤンバ９内を減圧チヤンバ吸引口１０によ
り減圧状態にし、上記エコライジング軸１を上昇
させて上記フイルタチヤツク５と衝合させること
によりフイルタ６と半導体チツプ３とを貼り合わ
せる。 The package 2 loaded with the semiconductor chip 3 is placed on the equalizing shaft 1, and the vacuum device is activated to vacuum-adsorb the semiconductor chip 3 onto the equalizing shaft 1. Then, adhesive (not shown) is applied to the semiconductor chip 3. do. On the other hand, the filter 6 is vacuum-adsorbed to the filter suction port 7 of the filter chuck 5 by the action of a vacuum device. After moving the filter chuck 5 that vacuum-chucks the filter 6 to a predetermined position on the equalizing shaft 1 that vacuum-chucks the package 2,
The pressure inside the vacuum chamber 9 is reduced by the vacuum chamber suction port 10, and the equalizing shaft 1 is raised to abut against the filter chuck 5, thereby bonding the filter 6 and the semiconductor chip 3 together.
第２図ａ，ｂに示す如く接着剤１１を介して上
記貼合せ装置により半導体チツプ３とフイルタ６
とが貼り合わされた後、ガラスシールを行ない、
固体撮像装置が完成する。 As shown in FIGS. 2a and 2b, the semiconductor chip 3 and the filter 6 are bonded together by the bonding device using the adhesive 11.
After the two are pasted together, a glass seal is applied,
A solid-state imaging device is completed.
こうして半導体チツプとフイルタとの貼り合わ
せを減圧状態下で行なうことにより、半導体チツ
プに塗布した接着剤中に含まれる気泡が除去され
てから貼り合わせが行なわれるため半導体チツプ
３表面に均一な入力光が得られる。 By bonding the semiconductor chip and the filter under reduced pressure in this way, the air bubbles contained in the adhesive applied to the semiconductor chip are removed before the bonding is performed, so that uniform input light is applied to the surface of the semiconductor chip 3. is obtained.
〈効果〉
フイルタ貼合せ装置にチヤンバを設けて該チヤ
ンバ内を減圧できる構造にすることにより、半導
体チツプ表面を被うフイルタを半導体チツプ上に
貼合わせる際接着剤の脱泡が可能になり、半導体
チツプ表面に均一な入力光が得られ、光電変換
部、CCD等からなる固体撮像装置の特性が向上
する。したがつて本考案により固体撮像装置の品
質及び信頼性の向上が図れるものである。<Effects> By providing a chamber in the filter bonding device and creating a structure that can reduce the pressure inside the chamber, it is possible to degas the adhesive when bonding the filter covering the surface of the semiconductor chip onto the semiconductor chip. Uniform input light can be obtained on the chip surface, improving the characteristics of solid-state imaging devices consisting of photoelectric conversion units, CCDs, etc. Therefore, the present invention can improve the quality and reliability of solid-state imaging devices.
第１図は本考案の一実施例を示す断面図、第２
図ａは固体撮像装置の斜視図、第２図ｂは固体撮
像装置の断面図である。
１……エコライジング軸、２……パツケージ、
３……半導体チツプ、４……チヤンバ側壁、５…
…フイルタチヤツク、６……フイルタ、７……フ
イルタ吸引口、８……ゴムシール、９……減圧チ
ヤンバ、１０……減圧チヤンバ吸引口、１１……
接着剤、Ａ……基盤。
Fig. 1 is a sectional view showing one embodiment of the present invention;
Figure a is a perspective view of the solid-state imaging device, and Figure 2b is a sectional view of the solid-state imaging device. 1...Eco-rising axis, 2...Package,
3...Semiconductor chip, 4...Chamber side wall, 5...
...Filter chuck, 6... Filter, 7... Filter suction port, 8... Rubber seal, 9... Vacuum chamber, 10... Vacuum chamber suction port, 11...
Adhesive, A...base.
Claims (1)
チツプとを貼り合わせるフイルタ貼合せ装置にお
いて、 上記半導体チツプを積載したパツケージを真空
吸着するエコライジング軸と、 上記エコライジング軸を囲むチヤンバ側壁と、 上記エコライジング軸の上部にあつて上記フイ
ルタを真空吸着するフイルタチヤツクと、 該フイルタチヤツクと上記チヤンバ側壁とをつ
なぐゴムシールとを有し、且つ、 上記フイルタを真空吸着した上記フイルタチヤ
ツクと上記半導体チツプを真空吸着した上記エコ
ライジング軸と上記チヤンバ側壁と上記ゴムシー
ルとにより形成される空間を減圧する減圧機構を
備えたことを特徴とするフイルタ貼合せ装置。[Scope of Claim for Utility Model Registration] In a filter bonding device for bonding a filter and a semiconductor chip during the manufacturing process of a solid-state imaging device, an equalizing shaft for vacuum suctioning a package loaded with the semiconductor chip, and an equalizing shaft as described above. a chamber side wall surrounding the chamber, a filter chuck located above the equalizing shaft and vacuum-chucking the filter, and a rubber seal connecting the filter chuck and the chamber side wall, and the filter chuck vacuum-chucking the filter; A filter bonding apparatus comprising a pressure reducing mechanism for reducing the pressure in a space formed by the equalizing shaft, the chamber side wall, and the rubber seal that vacuum-adsorbs the semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986160967U JPH0546283Y2 (en) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986160967U JPH0546283Y2 (en) | 1986-10-20 | 1986-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6365252U JPS6365252U (en) | 1988-04-30 |
| JPH0546283Y2 true JPH0546283Y2 (en) | 1993-12-03 |
Family
ID=31086849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986160967U Expired - Lifetime JPH0546283Y2 (en) | 1986-10-20 | 1986-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546283Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53109477A (en) * | 1977-03-07 | 1978-09-25 | Toshiba Corp | Mounting method of semiconductor element |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6026100Y2 (en) * | 1980-04-30 | 1985-08-06 | 日本電気株式会社 | Adhesive jig |
-
1986
- 1986-10-20 JP JP1986160967U patent/JPH0546283Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53109477A (en) * | 1977-03-07 | 1978-09-25 | Toshiba Corp | Mounting method of semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6365252U (en) | 1988-04-30 |
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