TW508818B - Solid imaging device and method of fabricating the same - Google Patents

Abstract

Disclosded a solid imaging device and method of fabricating the same for preventing the contamination due to the particles or dust during the dicing and bonding processes by providing a cover glass adhesively attached directly onto the wafer, and for handling the device with ease during and after the dicing processes. The solid imaging device is characterized by the cover means directly formed on the periphery of the solid imaging element. The cover means is optically transparent and physically rigid. The method of fabricating the solid imaging device comprises etching a plate means, wherein the plate means is optically transparent and physically rigid, and eliminating a portion of said plate means corresponding to a pad portion by sandblasting, matching and attaching the boundary of the etched side of the plate means to a periphery of a image sensor on the wafer, dicing the image sensor from the wafer, die bonding the diced image sensor to a ceramic package or PCB, and wire bonding the pad portion of the image sensor to the package or PCB and molding the image sensor. Accordingly, the contamination of the image sensor area due to the wafer particles created during the dicing process and dust from the external environment can be prevented, so that the throughput is improved.

Description

Δ δ V. Description of the invention (1) = The invention relates to: · directly attaching a cover on a dry film = or pollution caused by dust and dust generated during adhesion, and a solid-state imaging device and a manufacturing method that are easy to use. Use closer cameras, especially high-performance = convex-carrying cameras. Consumers are particularly demanding for more full-fledged: fine details such as high-definition requirements are increasingly "" especially the so-called camera The heart part, that is, the solid / electrical coupling. ^) Or the daytime prime expansion of the CM0S is also the most concerned part. This is quite similar to the one shown in Figure 1, which has become the mainstream in the past. Example cross-section view. The ceramic packaging of the reference net conductor ⑴ in the figure 丨 is shown in the center, and its center is “concave table 2 ° 丄”. The electrode plate (6) of the present three-wire simple chip is fixed to the groove portion (3) by wire bonding with a conductive bonding agent, and the metal plate (2) is made of a metal wire (7). Also, reference numeral (8) is a guide terminal attached to the cut surface of the metal mesh conductor (2) exposed on the side surface of the ceramic package (1). What is not shown in FIG. 2 is a cross section of a conventional solid-state imaging device using a resin package. Figure. The resin package includes a lead socket (11) formed by an inner lead (9) and an outer lead (10), and a groove (丨 3) is provided in the center portion thereof, and a conductive adhesive is used in the groove (13). A CCD or a CMOS wafer is bonded to the mold. The electrode plate (6) on the CCD * CM0s wafer is wire-bonded to the inner lead (9) using a metal wire (7). As mentioned above, the manufacturing process of a conventional solid-state imaging device As shown in Figure 3 Page 6 508818

=, As shown in Figure 3-like, in the process?之后 After drying, cry for sensory image separation * / ^ 诼 口 诼 片 I

In the step P Π 0 _, a mold process (f) J mode (p) i0) processing is performed. When the film is separated, at the PTM & t position, the image sensor and the adhesive are placed in the ceramic packaging or PCB in the sequence 20 into the room made for the P coat, and then pass through the process pi3〇, at pu〇. Sensing H (or bare wafer) die bonding during casting process

Ceramic packaging or PCB. U The electrode plate (6) of the bare wafer bonded to the package through the process P1 to 30, and the wire is bonded to the package or the PCB in the process of P140. After the wire bonding process in the process P1 40 is completed, to protect the bare wafer and the bonding portion, "in the process P160", the cover glass is drilled on the cover. The cover glass is inspected for quality and condition of the glass through step P1 50, and is cut to a certain size after step pi60. Fig. 4 is a sectional view of the solid-state imaging device completed through the above steps. The cross-section of the solid-state imaging device shown in FIG. 4 is a cross-sectional state after virtually all the processes shown in FIG. 3 are completed. The cross-section of the conventional solid-state imaging device shown in FIGS. There is no substantial difference. However, the difference between the cross-section shown in FIG. 4 and the cross-section of the conventional solid-state imaging device shown in FIG. 1 and FIG. 2 is the cover glass (5) portion, which is used to protect the bare wafer. . That is, because the bare chip is formed by converting the number of images formed by several hundred thousand = several lenses into a set of sensors such as an electrified photodiode, the image sensing area of the sensor is affected by dust or the like. The stained Ichigo I will become an unqualified quality, and a cover glass is arranged to prevent the phenomenon. 508818 V. Description of the invention (3) _ However, because dust and impurities I occur during transportation as well as wire bonding, processing and die bonding or dots lead to the phenomenon of zeta dyeing dry film under the quality of solid-state imaging devices. The purpose of the invention is to solve the problems of the bare wafer portion of the solid-state imaging device and to provide a solution to the problems such as low yield. The residues such as impurities in the glue are used to prevent impurities and chips in the mold. Easy solid-state imaging device and manufacturing method thereof. In order to achieve the above-mentioned purpose, the wood of known wood is treated as a cover member with a clear, high-hardness feature in the central part of the imager using a conductive desiccant. Another feature of the invention that is formed directly on the surface and is transparent is that the cover surface of the flat glass is etched, the etched glass is etched, and the glass is surrounded by the solid-state imaging device. The etched side is fixed on the board or the material of the cover member is organically fixed on the peripheral surface of the solid-state imaging device. The edge of the groove is intact and solid. The order of the device manufacturing process is: ; Around the flat part of the glass part of the dry film that was treated with sandblasting, the adhesive parts were bonded through the first process to separate the image sensors. Binding the loose film on the combined dry film; passing the binding process through the third process

Page 8

:) Round IS V. Description of the invention (4) The image sensor of the principle is die-bonded to the package I or the PCB in the fourth step; after the package or PCB is passed, it is cast. The characteristics of the plate of the 4 tester are wire-welded to the following: the solid-state video camera chopsticks at the center of the guide are installed, and the σ is fixed on the upper surface of the package sensing area. A transparent high-hardness cover part J ... is formed on the wall of the image. The side wall of the present invention is formed on the above side. The additional special bunny rabbit of the present invention is molded to form a four-cornered pie cake as a whole. The side wall is made of plastic or organic plate. Another additional glass, organic plate or plastic, 1 is: the material of the cover component can be glass 4th, and both sides are flat. The solid-state photographed material according to the present invention is formed with a f system, and the sequence is as follows: the quality of the support surface of the stent that is formed in an easy-to-order manner, the shape of the support, and Adhesion to Tuomou: The state of f hardness and high hardness will be used for the molding process; the fourth process will be used to package the fourth process packaging or PCB for mold bonding; and the through packaging or PCB will be shown in Figure H. The 4: 2 to which the plate part of the sensor is wire-welded! The sign lies in:. The electric compound is fixed on the packaging metal green film as an image; the state of the image device electrode plate is used in the image # = solid-state imaging device, and the image sensing area of the solid-state imaging device is described above. Transparent, high-stiffness, flat-plate cover 508818 V. Description of the invention (5) The upper part of the image sensor according to the present invention; processed by the first ICBC mold; praying for the image sensor connected to the ceramic package . The well-known persons of the present invention are referred to plus. Refer to the attached description below. The surface of the solid-state imaging device is made in a transparent and sticky process. The wafer and high-hardness flat plate parts combined in the adhesive sequence are cast in the second process; # 'Fork image sensor, # or PCB special, will use the advantages of the first pull and each machine ^ ^ ^ advantages, for the relevant drawings in this technical field and the correct examples described later, master and Fig. 5 is a detailed diagram of the present invention in combination with the examples of the present invention after detailed wire welding of the sheet material to the package; etc .; FIG. 5 shows a manufacturing sequence of the solid-state imaging device according to the present invention. As shown in FIG. 5, in the step p200, when the film is placed on the sensor, the film is placed in the room ', and in the step p21, a mold process is performed to separate the sensors.

In step P210, a cover glass is adhered around the wafer in order to protect the wafer with a dry adhesive surface before the mold processing. This cover glass was tested for quality and condition of glass through P220. Through the process? In the step E240, the cover glass f 'is bonded to the sheet material portion with a metal wire in step P240, and the glass corresponding to the material is subjected to sandblasting treatment. Thereafter, a mold process is performed in the above-mentioned step P210. Each image sensor (or wafer) that has been subjected to a mold process through the above-mentioned process P2 10 is separated from the dry film, and the process

508818

The ceramic packaging or pCB, etc., which are subjected to the casting process of P260, are placed in the room. v Through the P270 process, the sheet portion of the wafer adhered to the package is dried on the package or pCB with silk. After the wire bonding process is completed in the above-mentioned step p27〇, a casting process is performed in step P280. In process? 290 completes the assembly of the solid-state imaging device. As with the above process, the large-scale manufacturing process of the solid-state imaging device according to the present invention and referring to the sectional view of the completed solid-state imaging device shown in FIG. 6 shows the following features.

Referring to the sectional example of the solid-state imaging device completed according to the present invention, FIG. 6 ′ is provided with a recessed portion (3) at the center of a ceramic package formed by a metal mesh conductor (2). A wafer (4) is fixed in the groove (3) with a conductive adhesive wire. The electrode plate (6) of the wafer (4) is bonded to the metal mesh conductor (2) with a metal wire (7) wire. The reference symbol (8) is a conductive terminal soldered to the cross section of the metal mesh conductor (2) exposed on the outer surface of the ceramic package (1). At this percentage, a transparent, high-hardness integral part (15b) is formed around the sheet (4). The cover member (15b) has a structure in which a concave and convex groove is formed by etching the side of the flat plate through step P230, and the periphery of the groove formed by the etching process is bonded and fixed around the wafer (4).

In addition, the material of the cover member (1 5 b) may be glass, organic plate, or plastic. Fig. 7 shows another manufacturing process example different from the example shown in Fig. 6 and a sectional example view of the completed solid-state imaging device. Refer to FIG. 7 for a sectional example of a solid-state imaging device completed according to the present invention. FIG.

Page 11 508818 V. Description of the invention (7) Installation (1) A metal mesh conductor (2) is provided on the upper surface, and a groove portion (3) is provided at the center. The recessed part (3) is used to fix the wafer (4) with a conductive adhesive wire. The electrode plate (6) of the wafer (4) will stagnate to the metal mesh conductor (2) through the metal wire (7). Also, reference numeral (8) is a conductive terminal of a cross section of a metal mesh conductor (2) welded to the outer surface of the bare ceramic package (1). A certain height side wall () is formed around the wafer (4), and a transparent, high-hardness cover member (i5b) is formed on the side wall (17a). The side wall (17a) is made of a plastic or organic plate and other easily moldable materials, and is provided. There is a square-shaped cake-shaped bracket to support the cover member (15b), and a transparent, high-hardness integrated cover member is formed on the bracket upper surface, that is, on the side wall. The above example is different, and it is on the wafer (4). An example of a transparent, high-hardness flat-type cover member (glass, organic board, plastic, etc.) for wire bonding can be used, and has a cross-sectional structure as shown in FIG. 8.

The manufacturing process according to the example of the present invention shown in FIG. 8 is as shown in FIG. 9. In step P300, the image sensor wafer is put into the room, and at the same time, the quality of the cover glass is detected through the process of step P310. Then, the cover glass is adhered with transparent glue on the upper surface of the above-mentioned dry film through step P320 '. That is, in step P330, a mold process is performed to separate the various image sensors in the above-mentioned dry film. Various image sensors (or wafers) that are molded through the above-mentioned process P330 are placed in the room from process P34O 'and the wafer is bonded to a ceramic package or pcB, etc. through process P35. Plate part of the wafer bonded to the package through step P350 Page 12 508818

Dry silk treatment is performed on the surface. Casting is performed in the above process through the process P280. V. Description of the invention (8) The process is completed after the wire bonding process is finished in the packaging or PCB process P 3 6 through the process P360. . As shown in FIG. 10, it is shown in FIG. 7, and reference numeral 18 is an epoxy resin conversion process using epoxy resin to check the casting state as shown in FIG. 1Q. The surrounding process can strengthen the metal wire such as W according to the deadening process, and prevent the decrease in yield due to impurities. Method, the solid-state imaging device according to the present invention, and its manufacturing method. Dust / L1: Comparison ’can prevent mold processing? The pollution of the realm of the field: can be reduced; the image sensing collar caused by dust, etc. is illustrated as an example, but the idea of the invention and the field of the invention that are not shown in the super-tax environment are not as long as possible. Make multiple improvements and changes. m

Page 13 508818 Brief Description of Drawings Figure 1 is a sectional view of a conventional solid-state imaging device; Figure 2 is a sectional view of another conventional solid-state imaging device; Figure 3 is a flow chart of a manufacturing process of a conventional solid-state imaging device; Figure 4 3 is a sectional example view of the solid-state imaging device manufactured through the process of FIG. 3; FIG. 5 is a flow chart of the manufacturing process of the solid-state imaging device according to the present invention; And a sectional example view of the completed solid-state imaging device; FIG. 7 is a manufacturing process example different from the example shown in FIG. 6 and an example sectional view of the completed solid-state imaging device; FIG. 8 is a view similar to FIG. 6 and FIG. The example shown is different, and a sectional example of a solid-state imaging device according to another example is shown; FIG. 9 is a flow chart of the manufacturing process of the solid-state imaging device shown in FIG. 8; FIG. 10 is a view of the solid-state imaging device shown in FIG. An example of a cross-section of a solid-state imaging device with a streamlined manufacturing process and an end of the casting process. [Illustration of figure number] 1 ------ Tauman packing 2 ------ Metal mesh conductor 3 ------ Groove part 4 Chip 6 Chip electrode 7 ------ metallic line

Page 14 508818 Brief description of the drawing 8 ------ Reference symbol 9 ------ Inner bow | 10 ------ Outer bow | 11 ------ Bow 丨 Thread stand 13- ----- Groove 15 ------ Cover slide 15b ------ Cover member 17a ------ Sidewall II ·· Page 15

Claims (1)

/, 'Scope of patent application 1 into two kinds of solid-state imaging devices', which is characterized by: Including the use of, · mold combination fixed in the center of the package ^ · using conductive dry; image sensing area of the solid-state imaging device = A solid-state camera device with the first range of the patent scope of the patent is set directly on the upper surface of the surrounding area of the cover with transparent and high hardness features. The material of the 1 part is broken glass and flat glass. The eight features are: the side of the temple A that is etched is etched, and 3. the periphery of the second solid-state r-image device such as the scope of the patent application. The material f4 A of the cover member and the solid and evil camera device are characterized in that: a concave plate or a plastic plate is provided on the surface,-the surface is a flat plate type, and the other side. The edge is fixed to the periphery of the solid-state imaging device. 4. A solid-state imaging device is used to inspect the quality and appearance of the symptoms. It includes: To bond the plate with a metal wire: 4 'Etching transparent flat hardness flat parts, sandblasting First process. · Knife, the flat part corresponding to the glass part of the plate part is treated; the first process is used to engrav the second process, and the second process is from the recognition system, and the third process of the mold is a separation diagram. Image sensor, through the third process through the third process to ceramic packaging or pCB, etc., the fourth process of the image sensor, die bonding and wire welding through the fourth process' p'M image sensor board on the package 5. A solid-state imaging device. After that, the fifth step of casting is performed. " One feature is: using a conductive adhesive casting mold 6. Applying for a patent application H Like crying it ΐ @ State camera device in the central part of the package, on the wall; in the upper and lower areas of the ammonia region The upper surface of the joint is formed, such as δ, a transparent high-hard cover member is formed on the wall of Shenxin 1. In the case of the solid-state imaging device described in Item 5 of the zeta patent, the side wall of the shaped cake is formed of plastic or organic plate, etc., as a whole, as described in Item 5 of the patent scope. The material of the present piece can be glass, organic plate or plastic. As described in item 6, the solid-state imaging device of the patent scope, the material of the components can be glass, and the organic plate or surface is flat. 9 · A method for manufacturing a solid-state image pickup device, characterized in that: a step is formed using a material that is easy to mold to have a square-shaped pie shape. The third step of combining the lid member formed by the second step with the periphery of the adhesive sensor in the dry rack; '> The fourth step of separating the image sensor step in the dry film combined with the third step; ... will pass The fourth step is the fifth step of mold bonding of each image sensor of the casting mold and the ceramic PCB. The side of the high-resolution image is characterized in that the corners are formed by daggers. The characteristics are on both sides. The characteristics on both sides are plastic. Two including the first amount of the bracket and the image of the second work piece above the state to be molded porcelain packaging or 508818 Six 'patent application scope ----- one--and will be bonded through the fourth process. A part of the material is wire-welded to the board of the image sensor on the clothing such as packaging or PCB. A solid-state imaging device, which has a sixth process of manufacturing. The solid image fixed to the center of the package was captured at the image sensing area on the top of the image sensor with a conductive compound, with a solid-state photographic cover-type cover member. A transparent, high-hardness flat η · transparent transparent film. A method for manufacturing a solid-state image pickup device. On a dry film image sensor, the special features include: the first process including a flat plate component of hardness; The second step of mold processing is to glue the transparent, high-quality dry film combined through the first step. The saber is separated from the image sensor, and the third step is to process the ceramic packaging or PCB through the second step through the mold: image After the sensor, the mold is bonded to the pottery and the fourth step is bonded to the packaging wire and welded to the packaging or PCB, etc., the plate part of the image sensor is subjected to the fourth step of casting.