JPS5434679A - Bonding method and apparatus for semiconductor chip - Google Patents

Bonding method and apparatus for semiconductor chip

Info

Publication number
JPS5434679A
JPS5434679A JP10079277A JP10079277A JPS5434679A JP S5434679 A JPS5434679 A JP S5434679A JP 10079277 A JP10079277 A JP 10079277A JP 10079277 A JP10079277 A JP 10079277A JP S5434679 A JPS5434679 A JP S5434679A
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonding method
chip
dicollet
spraying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10079277A
Other languages
Japanese (ja)
Inventor
Mitsuharu Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP10079277A priority Critical patent/JPS5434679A/en
Publication of JPS5434679A publication Critical patent/JPS5434679A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To carry out the heat pressure bonding with no pressure application nor vibration due to the dicollet, by spraying the inactive gas to the chip.
COPYRIGHT: (C)1979,JPO&Japio
JP10079277A 1977-08-23 1977-08-23 Bonding method and apparatus for semiconductor chip Pending JPS5434679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10079277A JPS5434679A (en) 1977-08-23 1977-08-23 Bonding method and apparatus for semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10079277A JPS5434679A (en) 1977-08-23 1977-08-23 Bonding method and apparatus for semiconductor chip

Publications (1)

Publication Number Publication Date
JPS5434679A true JPS5434679A (en) 1979-03-14

Family

ID=14283274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10079277A Pending JPS5434679A (en) 1977-08-23 1977-08-23 Bonding method and apparatus for semiconductor chip

Country Status (1)

Country Link
JP (1) JPS5434679A (en)

Similar Documents

Publication Publication Date Title
JPS5434679A (en) Bonding method and apparatus for semiconductor chip
JPS53116072A (en) Electrode forming method for semiconductor device
JPS5210032A (en) Construction method of semiconductor memory unit
JPS5393780A (en) Production of semiconductor device
JPS5384876A (en) Regenerating method for adsorpting tower
JPS5419624A (en) Adhering method of adhesive tape
JPS53135579A (en) Liquid sealing semiconductor device
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS542069A (en) Semiconductor device
JPS5419656A (en) Bonding tool
JPS544568A (en) Semiconductor device and production of the same
JPS53136484A (en) Wafer continuous machining method and unit used for the same
JPS52147065A (en) Semiconductor device
JPS5232140A (en) Heat absorbing device
JPS547869A (en) Lead bending method of semiconductor device
JPS5432155A (en) Thermo compression bonding apparatus
JPS52143186A (en) Taping device
JPS53128055A (en) Attaching method for heat insulator and its apparatus
JPS5232149A (en) Method of jointing pipes with heat absorbing plate
JPS5411671A (en) Sealing method of semiconductor device
JPS5419364A (en) Semiconductor device
JPS5214290A (en) Vibration frequency fixing method and its apparatus
JPS5394874A (en) Connecting method for semiconductor device
JPS5355960A (en) Breaking method for semiconductor wafer
JPS5396760A (en) Case for semiconductor device and production of the same