JPS53145473A - Lead frame for electronic parts - Google Patents
Lead frame for electronic partsInfo
- Publication number
- JPS53145473A JPS53145473A JP6061977A JP6061977A JPS53145473A JP S53145473 A JPS53145473 A JP S53145473A JP 6061977 A JP6061977 A JP 6061977A JP 6061977 A JP6061977 A JP 6061977A JP S53145473 A JPS53145473 A JP S53145473A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- electronic parts
- lead
- holding parts
- tin plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent rust formation of lead frames by providing tin plating boundary ends between lead holding parts and seating planes in the lead frame.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6061977A JPS53145473A (en) | 1977-05-24 | 1977-05-24 | Lead frame for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6061977A JPS53145473A (en) | 1977-05-24 | 1977-05-24 | Lead frame for electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53145473A true JPS53145473A (en) | 1978-12-18 |
Family
ID=13147466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6061977A Pending JPS53145473A (en) | 1977-05-24 | 1977-05-24 | Lead frame for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53145473A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5761851U (en) * | 1980-09-30 | 1982-04-13 | ||
US4942455A (en) * | 1986-10-13 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame |
-
1977
- 1977-05-24 JP JP6061977A patent/JPS53145473A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5761851U (en) * | 1980-09-30 | 1982-04-13 | ||
US4942455A (en) * | 1986-10-13 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame |
US5026669A (en) * | 1986-10-13 | 1991-06-25 | Mitsubishi Denki Kabushiki Kaisha | Method of eliminating burrs on a lead frame with a thin metal coating |
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