JPS53106572A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS53106572A
JPS53106572A JP2124977A JP2124977A JPS53106572A JP S53106572 A JPS53106572 A JP S53106572A JP 2124977 A JP2124977 A JP 2124977A JP 2124977 A JP2124977 A JP 2124977A JP S53106572 A JPS53106572 A JP S53106572A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead frame
cutting
frames
lead frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2124977A
Other languages
Japanese (ja)
Other versions
JPS6029226B2 (en
Inventor
Toshinori Tanaka
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2124977A priority Critical patent/JPS6029226B2/en
Publication of JPS53106572A publication Critical patent/JPS53106572A/en
Publication of JPS6029226B2 publication Critical patent/JPS6029226B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the formation of protrusios and enable automatic feeding to be smoothly performed by cutting lead frames on the side inner than the side of the frames at the time of cutting the lead frames from their outer frame.
COPYRIGHT: (C)1978,JPO&Japio
JP2124977A 1977-02-28 1977-02-28 Lead frame for semiconductor devices Expired JPS6029226B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2124977A JPS6029226B2 (en) 1977-02-28 1977-02-28 Lead frame for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2124977A JPS6029226B2 (en) 1977-02-28 1977-02-28 Lead frame for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS53106572A true JPS53106572A (en) 1978-09-16
JPS6029226B2 JPS6029226B2 (en) 1985-07-09

Family

ID=12049780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2124977A Expired JPS6029226B2 (en) 1977-02-28 1977-02-28 Lead frame for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6029226B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56150843A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Manufacture of lead frame and semiconductor using lead frame
JPS62162346A (en) * 1986-11-21 1987-07-18 Hitachi Ltd Manufacture of semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367259B2 (en) * 2007-12-27 2013-12-11 新光電気工業株式会社 Bridge cutting method and lead frame strip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56150843A (en) * 1980-04-25 1981-11-21 Hitachi Ltd Manufacture of lead frame and semiconductor using lead frame
JPS634355B2 (en) * 1980-04-25 1988-01-28 Hitachi Ltd
JPS62162346A (en) * 1986-11-21 1987-07-18 Hitachi Ltd Manufacture of semiconductor device
JPH0369173B2 (en) * 1986-11-21 1991-10-31 Hitachi Ltd

Also Published As

Publication number Publication date
JPS6029226B2 (en) 1985-07-09

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