JPS53106572A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS53106572A JPS53106572A JP2124977A JP2124977A JPS53106572A JP S53106572 A JPS53106572 A JP S53106572A JP 2124977 A JP2124977 A JP 2124977A JP 2124977 A JP2124977 A JP 2124977A JP S53106572 A JPS53106572 A JP S53106572A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead frame
- cutting
- frames
- lead frames
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent the formation of protrusios and enable automatic feeding to be smoothly performed by cutting lead frames on the side inner than the side of the frames at the time of cutting the lead frames from their outer frame.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2124977A JPS6029226B2 (en) | 1977-02-28 | 1977-02-28 | Lead frame for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2124977A JPS6029226B2 (en) | 1977-02-28 | 1977-02-28 | Lead frame for semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53106572A true JPS53106572A (en) | 1978-09-16 |
JPS6029226B2 JPS6029226B2 (en) | 1985-07-09 |
Family
ID=12049780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2124977A Expired JPS6029226B2 (en) | 1977-02-28 | 1977-02-28 | Lead frame for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6029226B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56150843A (en) * | 1980-04-25 | 1981-11-21 | Hitachi Ltd | Manufacture of lead frame and semiconductor using lead frame |
JPS62162346A (en) * | 1986-11-21 | 1987-07-18 | Hitachi Ltd | Manufacture of semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5367259B2 (en) * | 2007-12-27 | 2013-12-11 | 新光電気工業株式会社 | Bridge cutting method and lead frame strip |
-
1977
- 1977-02-28 JP JP2124977A patent/JPS6029226B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56150843A (en) * | 1980-04-25 | 1981-11-21 | Hitachi Ltd | Manufacture of lead frame and semiconductor using lead frame |
JPS634355B2 (en) * | 1980-04-25 | 1988-01-28 | Hitachi Ltd | |
JPS62162346A (en) * | 1986-11-21 | 1987-07-18 | Hitachi Ltd | Manufacture of semiconductor device |
JPH0369173B2 (en) * | 1986-11-21 | 1991-10-31 | Hitachi Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPS6029226B2 (en) | 1985-07-09 |
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