JPS5437574A - Fabrication method of semiconductor pellet - Google Patents

Fabrication method of semiconductor pellet

Info

Publication number
JPS5437574A
JPS5437574A JP10388977A JP10388977A JPS5437574A JP S5437574 A JPS5437574 A JP S5437574A JP 10388977 A JP10388977 A JP 10388977A JP 10388977 A JP10388977 A JP 10388977A JP S5437574 A JPS5437574 A JP S5437574A
Authority
JP
Japan
Prior art keywords
fabrication method
semiconductor pellet
pellet
filting
definitely
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10388977A
Other languages
Japanese (ja)
Inventor
Koichi Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP10388977A priority Critical patent/JPS5437574A/en
Publication of JPS5437574A publication Critical patent/JPS5437574A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To attain tight and appropriate soldering while limiting the amount of solder definitely by providing a concave part to a pellet-filting body.
COPYRIGHT: (C)1979,JPO&Japio
JP10388977A 1977-08-29 1977-08-29 Fabrication method of semiconductor pellet Pending JPS5437574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10388977A JPS5437574A (en) 1977-08-29 1977-08-29 Fabrication method of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10388977A JPS5437574A (en) 1977-08-29 1977-08-29 Fabrication method of semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS5437574A true JPS5437574A (en) 1979-03-20

Family

ID=14365984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10388977A Pending JPS5437574A (en) 1977-08-29 1977-08-29 Fabrication method of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS5437574A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4995576A (en) * 1973-01-12 1974-09-10
JPS49124975A (en) * 1973-04-02 1974-11-29
JPS5037358A (en) * 1973-08-06 1975-04-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4995576A (en) * 1973-01-12 1974-09-10
JPS49124975A (en) * 1973-04-02 1974-11-29
JPS5037358A (en) * 1973-08-06 1975-04-08

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