JPS63116159U - - Google Patents
Info
- Publication number
- JPS63116159U JPS63116159U JP483287U JP483287U JPS63116159U JP S63116159 U JPS63116159 U JP S63116159U JP 483287 U JP483287 U JP 483287U JP 483287 U JP483287 U JP 483287U JP S63116159 U JPS63116159 U JP S63116159U
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- brush
- rear end
- work
- movable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係わる自動半田付装置の一実
施例を示す概略構成図、第２図は従来の自動半田
付装置を示す概略構成図である。
１…プリント基板、２…傾斜式コンベア、３…
フラツクス塗布装置、４…予熱乾燥装置、５…噴
流傾斜式半田槽、８…ブラシ、１０…エアシリン
ダ、１２…位置センサ、１３…制御装置。
FIG. 1 is a schematic diagram showing an embodiment of an automatic soldering device according to the present invention, and FIG. 2 is a schematic diagram showing a conventional automatic soldering device. 1... Printed circuit board, 2... Inclined conveyor, 3...
Flux coating device, 4... Preheating drying device, 5... Inclined jet soldering tank, 8... Brush, 10... Air cylinder, 12... Position sensor, 13... Control device.
Claims (1)
間に、該被半田付部材下面にフラツクスの発泡粒
を塗布する作業、予熱乾燥する作業及び溶融半田
中に浸漬させる作業とを順に自動的に行うように
した自動半田付装置において、前記フラツクス塗
布後の被半田付部材後端通過位置に設けられて余
剰のフラツクスを除去するブラシを、被半田付部
材後端下面に接触する位置と該位置から外れる下
方位置とに選択的に移動し得るように可動式に構
成すると共に、前記被半田付部材の後端下面がブ
ラシ位置に来たことを検出して前記可動式ブラシ
を該被半田付部材後端下面に接触する位置に移動
するブラシ移動装置を設けたことを特徴とする自
動半田付装置。 While the component to be soldered is held and conveyed from a low position to a high position, the work of applying foamed flux particles to the lower surface of the part to be soldered, the work of preheating and drying the work, and the work of immersing it in molten solder are automatically performed in order. In the automatic soldering apparatus, a brush that is provided at a position where the rear end of the soldered member passes through after application of the flux and removes excess flux is placed at a position where it contacts the lower surface of the rear end of the soldered member and at the same position. The movable brush is configured to be movable so as to be able to selectively move to a lower position where it is removed from the soldering target, and when it detects that the rear end lower surface of the member to be soldered has come to the brush position, the movable brush is moved to a lower position away from the soldered member. An automatic soldering device characterized by being provided with a brush moving device that moves to a position where it comes into contact with the lower surface of the rear end of the member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP483287U JPH0329007Y2 (en) | 1987-01-19 | 1987-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP483287U JPH0329007Y2 (en) | 1987-01-19 | 1987-01-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63116159U true JPS63116159U (en) | 1988-07-27 |
| JPH0329007Y2 JPH0329007Y2 (en) | 1991-06-20 |
Family
ID=30785861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP483287U Expired JPH0329007Y2 (en) | 1987-01-19 | 1987-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0329007Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124332A (en) * | 2006-11-14 | 2008-05-29 | Nihon Dennetsu Keiki Co Ltd | Soldering method, soldering system, and fluxing coating system |
-
1987
- 1987-01-19 JP JP483287U patent/JPH0329007Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008124332A (en) * | 2006-11-14 | 2008-05-29 | Nihon Dennetsu Keiki Co Ltd | Soldering method, soldering system, and fluxing coating system |
| JP4746520B2 (en) * | 2006-11-14 | 2011-08-10 | 日本電熱ホールディングス株式会社 | Soldering method, soldering system and flux application system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0329007Y2 (en) | 1991-06-20 |
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