JPS6433371U - - Google Patents
Info
- Publication number
- JPS6433371U JPS6433371U JP12745687U JP12745687U JPS6433371U JP S6433371 U JPS6433371 U JP S6433371U JP 12745687 U JP12745687 U JP 12745687U JP 12745687 U JP12745687 U JP 12745687U JP S6433371 U JPS6433371 U JP S6433371U
- Authority
- JP
- Japan
- Prior art keywords
- holder
- circuit board
- printed circuit
- automatic soldering
- soldering machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図aおよびbは本考案に係る自動半田付け
機を示す正面図と斜視図、第2図は従来の自動半
田付け機を示す正面図である。
12……ベースフレーム、14……搬送装置、
15……モータ、16……ボールねじ、17……
ホルダー、18……シリンダ、19……キヤリア
、20……テーブル、23……半田付け装置、2
4……洗浄装置、27……フラツクス付け装置、
29……プリヒート装置。
1A and 1B are a front view and a perspective view of an automatic soldering machine according to the present invention, and FIG. 2 is a front view of a conventional automatic soldering machine. 12...Base frame, 14...Transportation device,
15...Motor, 16...Ball screw, 17...
Holder, 18... Cylinder, 19... Carrier, 20... Table, 23... Soldering device, 2
4...Cleaning device, 27...Fluxing device,
29...Preheating device.
Claims (1)
ヒート装置および半田付け装置を経て洗浄装置に
搬送されるプリント基板に対して電子部品を半田
付けする自動半田付け機であつて、前記搬送装置
に前記プリント基板を進退かつ昇降自在に搬送す
るホルダーを設けると共に、このホルダーの駆動
動作および停止時間を制御するコントローラを接
続したことを特徴とする自動半田付け機。 An automatic soldering machine that solders electronic components to a printed circuit board that is conveyed from a fluxing device to a cleaning device via a preheating device and a soldering device by a conveying device, the printed circuit board being transferred to the conveying device. An automatic soldering machine characterized by being provided with a holder that can be moved forward and backward and up and down, and connected to a controller that controls the driving operation and stopping time of this holder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12745687U JPS6433371U (en) | 1987-08-24 | 1987-08-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12745687U JPS6433371U (en) | 1987-08-24 | 1987-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6433371U true JPS6433371U (en) | 1989-03-01 |
Family
ID=31379905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12745687U Pending JPS6433371U (en) | 1987-08-24 | 1987-08-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6433371U (en) |
-
1987
- 1987-08-24 JP JP12745687U patent/JPS6433371U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6433371U (en) | ||
JPS6325259U (en) | ||
JPS61177770U (en) | ||
JPH01135165U (en) | ||
JPS61200657U (en) | ||
JPS63134599U (en) | ||
EP0305696A3 (en) | Process for desoldering glued smd components | |
JPS63147866U (en) | ||
JPS63137976U (en) | ||
JPS63116159U (en) | ||
JPS62141423U (en) | ||
JPS62118668U (en) | ||
JPS61200647U (en) | ||
JPS6172898U (en) | ||
JPS59155798U (en) | wire bonder | |
JPH0447862U (en) | ||
JPS63101165U (en) | ||
JPS58150409U (en) | Machine tool step feed device | |
JPS5961565U (en) | automatic soldering equipment | |
JPH04199800A (en) | Lead inserting device for component | |
JPS59132717U (en) | Work supply device | |
JPS63170070U (en) | ||
JPH0253865U (en) | ||
JPS6256270U (en) | ||
JPS59148169U (en) | Lead frame soldering equipment |