JPS63147866U - - Google Patents
Info
- Publication number
- JPS63147866U JPS63147866U JP3890987U JP3890987U JPS63147866U JP S63147866 U JPS63147866 U JP S63147866U JP 3890987 U JP3890987 U JP 3890987U JP 3890987 U JP3890987 U JP 3890987U JP S63147866 U JPS63147866 U JP S63147866U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- suction
- nozzle part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は従来方法装置の１例を示す図である。
第２図は本考案になる電子部品装着装置の正面図
、第３図は本考案になる電子部品装着装置の側面
図、第４図は本考案に係る電子部品吸着ノズルと
接着剤（クリーム半田）デイスペンサーの動きを
説明する図で有る。第５図は本考案に係る吸着ノ
ズル位置決め装置、Ｘ―Ｙテーブル、部品供給部
を示す図である。
１……吸着ノズル、２……吸着ノズル前後駆動
モーター、３……部品供給部、４……プリント基
板、５……チツプ状電子部品（装着）、６……吸
着されたチツプ状電子部品、７……位置決め装置
、８……接着剤（クリーム半田）デイスペンサー
。
FIG. 1 is a diagram showing an example of a conventional method apparatus.
Fig. 2 is a front view of the electronic component mounting device according to the present invention, Fig. 3 is a side view of the electronic component mounting device according to the present invention, and Fig. 4 is an electronic component suction nozzle and adhesive (cream solder) according to the present invention. ) This is a diagram explaining the movement of the dispenser. FIG. 5 is a diagram showing a suction nozzle positioning device, an XY table, and a component supply section according to the present invention. 1... Suction nozzle, 2... Suction nozzle front and back drive motor, 3... Component supply section, 4... Printed circuit board, 5... Chip-shaped electronic component (mounted), 6... Chip-shaped electronic component sucked, 7... Positioning device, 8... Adhesive (cream solder) dispenser.
Claims (1)
る為の電子部品装着装置において、中心位置に、
接着剤及びクリーム半田等のデイスペンサーの、
ノズルを設け該ノズル部の左右に前後に移動可能
な摺動レールを傾斜させて設け、該レールの可動
部に吸着ノズル部を設け、該吸着ノズル部は、電
子部品供給部と吸着部品の位置決め手段と装着プ
リント基板面を往復移動し尚かつ相対位置関係を
電子部品供給部を、最上段とし中段に吸着部品の
位置決め手段を配し最下段に装着プリント基板図
が設けられていることを特徴とする電子部品装着
装置。 In an electronic component mounting device for mounting electronic components in a predetermined position on a printed circuit board, etc., a
Dispensers for adhesives, cream solders, etc.
A nozzle is provided, and a sliding rail that can be moved back and forth to the left and right of the nozzle part is provided at an angle, and a suction nozzle part is provided on the movable part of the rail, and the suction nozzle part is used for positioning the electronic component supply part and the suction part. It is characterized by reciprocating the means and the surface of the mounted printed circuit board, and the relative positional relationship is such that the electronic component supply section is on the top stage, the positioning means for the suction component is arranged in the middle stage, and the mounted printed circuit board diagram is provided on the bottom stage. Electronic component mounting equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3890987U JPS63147866U (en) | 1987-03-17 | 1987-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3890987U JPS63147866U (en) | 1987-03-17 | 1987-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63147866U true JPS63147866U (en) | 1988-09-29 |
Family
ID=30851588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3890987U Pending JPS63147866U (en) | 1987-03-17 | 1987-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63147866U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5735161B1 (en) * | 2014-07-08 | 2015-06-17 | 中外炉工業株式会社 | Coating apparatus and method for improving the same |
-
1987
- 1987-03-17 JP JP3890987U patent/JPS63147866U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5735161B1 (en) * | 2014-07-08 | 2015-06-17 | 中外炉工業株式会社 | Coating apparatus and method for improving the same |
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