JP3366013B2 - Component mounting device and component mounting method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component mounting method for transferring and mounting components (mainly electronic components) on a printed circuit board.

[0002]

2. Description of the Related Art The operation of a conventional component mounting apparatus will be described with reference to the drawings. FIG. 4 is a perspective view of a main part of the component mounting apparatus. In FIG. 4, 1 is an electronic component to be mounted, and 2 is a suction nozzle, which performs vertical movement when the electronic component 1 is vacuum-sucked and mounted. 3 is a component supply unit, 4 is a printed circuit board, 5 is a recognition camera which is a recognition means fixed to the main body, and 6 is an X-.
This is the Y table section.

In the component mounting apparatus having the above structure, the component supply section 3 is provided with the suction nozzle 2 raised to the upper limit in the Z direction.
To move onto the electronic parts of the above, and thus operates in the XY directions. Next, the suction nozzle 2 descends to the lower limit in the Z direction by a certain stroke value and comes into contact with the electronic component 1, and the electronic component 1 is vacuum-sucked and raised to the upper limit in the Z direction while the electronic component 1 is sucked. Next, the suction nozzle 2 is moved to the position of the recognition camera 5 fixed to the main body, and the electronic component recognition process is performed. After the recognition process is completed, the suction nozzle 2 moves to the component mounting position on the printed circuit board 5 and mounts the electronic component.

[0004]

However, in the component mounting apparatus as described above, as shown in FIG.
In the nozzle movement path from the suction position to the mounting position on the printed circuit board 4, the actual movement path indicated by the solid line has a problem that the movement distance becomes longer than the shortest path indicated by the broken line, and the takt time becomes longer. Was there.

The present invention is intended to solve the above problems, and provides a component mounting apparatus and a component mounting method in which a moving distance does not become long even if a nozzle passes over a component recognition camera because of the component recognition processing by the recognition camera. The purpose is to provide.

[0006]

In order to achieve the above object, a component mounting apparatus according to claim 1 of the present invention comprises a component supply section for supplying a component and a suction position of the component supply section by a suction nozzle. The head part for adsorbing the component of the above, moving to the mounting position of the board and mounting the component, and the component supply part and the head part are provided as separate bodies, and are driven by a shaft to move the head part in the horizontal direction. And a component recognition unit that recognizes a component sucked by the suction nozzle in the middle of a substantially linear movement path, the component recognition unit moving the head unit from the suction position to the mounting position. Horizontal
And recognizes the part from the positional relationship of the up and down movement in the middle of the direction of the substantially straight travel path.

In the component mounting method according to the second aspect, the component is sucked from the suction position of the component supply unit by the suction nozzle provided in the head unit, and the component sucked by the suction nozzle is attached to the component supply unit and the head unit. A component mounting method of recognizing by a movably provided component recognizing means as a separate body, and mounting the component at a mounting position of a substrate, wherein the component recognizing means is mounted from the suction position by the head portion. in the horizontal direction of movement to a position moved in the middle of the substantially straight travel path, characterized in that allowed to recognize the components adsorbed on the suction nozzle from the vertical positional relationship.

[0008]

According to the above-mentioned means, since the component recognizing means, for example, the component recognizing camera is provided movably as a separate body from the component supply section and the head section, the head section is located at the suction position of the component supply section. Horizontal connecting the mounting positions on the printed circuit board
When moving the shortest movement route which is a direction substantially linear also moves the component recognition camera in the middle of its movement path,
Since the parts can be recognized, as a result, the head portion can be moved along the shortest path, and the movement time of the head portion can be minimized.

Further, since the recognition of the component is performed in the vertical positional relationship between the component recognition means and the component sucked by the suction nozzle, the head is moved to the component recognition position on the substantially linear movement path in the horizontal direction. Therefore, the moving time of the head portion is further shortened.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the component mounting apparatus and component mounting method of the present invention will be described below with reference to the drawings. Figure 1
FIG. 3 is a perspective view showing a component mounting apparatus configured to be able to carry out the component mounting method according to the embodiment of the present invention. In FIG. 1, 3 is a component supply unit that supplies the electronic component 8, 5 is a component recognition camera that recognizes the electronic component 8,
Reference numeral 7 denotes a table portion for loading / unloading and holding the printed circuit board 4, 9 denotes a head portion for adsorbing the electronic component 8 and mounting the electronic component 8 on the printed circuit board 4, and 10 denotes an X-position for arbitrarily positioning the head portion 9.
A Y robot, 11 is an axis that enables the movement of the component recognition camera 5, and 12 is a controller that controls the entire apparatus.

FIG. 3 is a flow chart showing the operation of the component mounting apparatus and component mounting method of the present invention, in which the head portion 9 equipped with a suction nozzle moves to the position of the component supply portion 3 (step 16). Next, the electronic component 8 is sucked by the head portion 9 which is vertically movable and has a suction nozzle (step 17), and the component recognition camera 5 is moved so that the suction position and the mounting position are on a straight line (step 18). After sucking the electronic component 8, the head unit 9 moves from the component supply unit 3 to the recognition camera 5 while keeping the electronic component 8 sucked (step 19), and recognizes the electronic component 8 (step 20). Further, the recognition camera 5 is moved to the mounting position (step 21), and the suction nozzle is lowered to mount the electronic component 8 on the printed circuit board 4 (step 22). By performing the above operation, the movement paths of the suction position of the component supply unit 3, the recognition camera 5, and the suction position of the printed circuit board 4 are aligned as shown in FIG. 2, and the tact time of the apparatus can be shortened.

[0012]

As is apparent from the above description, according to the component mounting apparatus and the component mounting method of the present invention, the component recognizing means, for example, the component recognizing camera is moved separately from the component supplying section and the head section. since capable provided, when the head unit is moved the shortest movement route to be substantially straight in the horizontal direction connecting the mounting position on the suction position and the printed circuit board of the component supply unit is also the middle of the path of movement thereof It is possible to move the part recognition camera to
As a result, the head portion can be moved along the shortest path, and the movement time of the head portion can be minimized.

Further, since the parts are recognized in the vertical positional relationship between the parts recognition means and the parts sucked by the suction nozzles, the heads are moved to the parts recognition position on the substantially linear movement path in the horizontal direction. Therefore, the moving time of the head portion is further shortened, the takt time of the apparatus is shortened, and the productivity can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of an embodiment of a component mounting apparatus and a component mounting method of the present invention.

FIG. 2 is a schematic diagram showing a movement path of a nozzle of a head unit.

FIG. 3 is a flowchart showing the operation of the component mounting apparatus and component mounting method of the present invention.

FIG. 4 is a perspective view showing a configuration of a main part of a conventional component mounting apparatus.

[Explanation of symbols]

3 parts supply department 4 printed circuit boards 5 Parts recognition camera 8 electronic components 9 head 10 XY robot 11 axes

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kenichi Sato, Kenji Sato 1006, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Ryoji Inuzuka, 1006, Kadoma, Kadoma, Osaka (56) Reference JP-A-2-234499 (JP, A) JP-A-3-76299 (JP, A) JP-A-5-102696 (JP, A) Patent 2811899 (JP, B2) (58) Survey Fields (Int.Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. A component supply unit for supplying a component, a head unit for sucking a component at a suction position of the component supply unit by a suction nozzle and moving the component to a mounting position of a board to mount the component, and the component supply unit. Part, which is provided separately from the head part, is driven by a shaft to move in the horizontal direction of the head part .
And a component recognizing means for recognizing a component sucked by the suction nozzle, which moves in the middle of a substantially linear movement path,
The component recognition unit recognizes the component mounting apparatus components than the position relationship between vertically moved to the middle of the horizontal direction substantially linear movement path of the head unit is moved to the mounting position from the suction position. 2. A suction nozzle provided in a head portion sucks a component from a suction position of a component supply portion, and the component sucked by the suction nozzle can be moved separately from the component supply portion and the head portion. Recognized by the provided component recognition means,
The component mounting method for mounting the component to the mounting position of the substrate, moved the component recognition unit, in the middle of the substantially straight travel path in the horizontal direction in which the head unit is moved to the mounting position from the suction position , A component mounting method for recognizing a component picked up by a suction nozzle based on a vertical positional relationship.