JPH04199800A - Lead inserting device for component - Google Patents

Abstract

PURPOSE:To stably solder a lead without fluctuation by driving a chuck by 3-axis moving means, and inserting the lead of a held component to a printed board from its lower surface side. CONSTITUTION:A chuck 7 for holding a component 5 with leads is vertically turned by a turning mechanism 8. The chuck is driven by 3-axis moving means 9, and the leads of the held component are inserted into the hole of a printed board 3 from its lower surface. Accordingly, the leads of the component can protrude to the upper surface side of the board 3, and can be soldered to the board 3 directly from the upper surface side of the board 3. Since the component is held directly by the chuck 7 at the lower side of the board, previous adherence in the case of soldering, bending of the leads for preventing them from being removed, are not required, no fluctuation of the leads occurs, and stable soldering can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a component lead insertion device used for inserting component leads into holes in a printed circuit board.

BACKGROUND OF THE INVENTION FIG. 7 shows the structure of a conventional component lead insertion device. In FIG. 7, 51 is a belt conveyor for conveying printed circuit boards, and 52 is a printed circuit board conveyed by the belt conveyor 51. Reference numeral 53 indicates a component supply unit, 54 indicates a chuck for holding components, and 55 indicates a 3-axis moving means (3-axis robot) for transferring and inserting components that moves the chuck 54 in 3 axes orthogonal to each other, including an X-axis moving means. 56, Y-axis moving means 57, and Z-axis moving means 58.

In the above configuration, the operation of inserting the leads of the components into the holes of the printed circuit board and soldering them will be described below with reference to the work process explanatory diagram shown in FIG.

As shown in FIG. 8, first, an adhesive 59 is applied to a desired location on the printed circuit board 52 being conveyed on the belt conveyor 51, and then the chuck 54 is driven by the three-axis moving means 55 to supply parts. Part 6 is removed from part 53 by chuck 54.
0, the chuck 54 is driven by the 3-axis moving means 55, the lead 60a of the component 6° is inserted into the hole of the printed circuit board 52 which is positioned and stopped on the belt conveyor 51, and the component 60 is glued. Printed circuit board 52 by 59
Glue to. Thereafter, the printed circuit board 52 is conveyed by the belt conveyor 51, during which time the adhesive 59 is dried by the drying means 61, the printed circuit board 52 is turned over together with the component 60, and the leads 60a of the component 60 are connected to the printed circuit board 52.
On the other hand, soldering is performed using a soldering iron 62. Alternatively, without using the adhesive 59, insert the lead 60a of the component 6o into the hole of the printed circuit board 52 using the chuck 54, bend the lead 60a using the bending member 63 to prevent it from coming out, and then do the same as above. printed circuit board 52
is inverted together with the component 60, and the leads 60a are soldered to the printed circuit board 52.

Problems to be Solved by the Invention However, the conventional component lead insertion device described above has the following problems:
When a component whose leads are inserted into a printed circuit board is being transported to the next process such as a soldering machine, it may lift up or fall out of the printed circuit board, or when the component lead is soldered to the printed circuit board. To prevent the parts from falling off due to their own weight when the printed circuit board is turned over, the parts are glued to the printed circuit board.
Alternatively, many work steps were required, such as bending the leads to prevent them from being pulled out.

The present invention solves such conventional problems, and prevents components whose leads are inserted into holes in a printed circuit board from falling out, allowing soldering, etc., to be performed in a stable state, and also improves work efficiency. We have developed a component lead insertion device that can shorten the process, improve quality, improve work efficiency, and downsize the device. The purpose is to provide

Means for Solving the Problems In order to achieve the above object, the present invention provides a chuck for holding a leaded component, a turning mechanism for vertically turning the chuck, and a rotating mechanism for moving the chuck and the turning mechanism in three axes perpendicular to each other. It is equipped with a three-axis moving means for moving the object.

Therefore, according to the present invention, the chuck holding the leaded component is vertically rotated by the rotating mechanism, the chuck is driven by the three-axis moving means, and the lead of the component being held is inserted into the hole of the printed circuit board from the bottom surface thereof. By inserting
The leads of the components can be made to protrude from the upper surface of the printed circuit board, and the leads can be soldered to the printed circuit board directly from the upper surface of the printed circuit board. In addition, since the components are held directly on the underside of the printed circuit board with a chuck, pre-adhesion during soldering, etc.
There is no need to bend the leads to prevent parts from being removed.
Moreover, there is no looseness of the leads, and stable soldering can be performed.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

First, a first embodiment of the present invention will be described.

1 and 2 show a component lead insertion device according to a first embodiment of the present invention, FIG. 1 is a schematic perspective view, and FIG.
The figure is a schematic side view.

1 and 2, 1 is a frame, 2 is a belt conveyor for conveying a printed circuit board, and this belt conveyor 2 conveys a printed circuit board 3. In FIG. 4 is a belt conveyor for conveying parts, and this belt conveyor 4
The leaded component 5 is mounted on the pallet 6 and transported. Reference numeral 7 denotes a chuck that holds the leaded component 5, 8 a turning mechanism for vertically turning the chuck 7, and 9 a 3-axis moving means (3-axis robot) for moving the chuck 7 and the turning mechanism 8 in 3-axis directions perpendicular to each other. There is an X-axis moving means 11 provided on the pedestal 10, a two-axis moving means 12 provided on this X-axis moving means 11, and this Z-axis moving means 1.
The chuck 7 and the turning mechanism 8 are provided in the Y-axis moving means 13. 14 is a soldering work robot, which is mounted on the frame 1.゛A controller 〇-15 is housed in the mount 10.

The operation of the second configuration will be explained below.

First, the chuck 7 is driven in three axes by the three-axis moving means 9, and the chuck 7 holds the leaded component 5 mounted on the pallet 6. Next, by vertically rotating the chuck 7 by the vertical rotation mechanism 8 and driving the chuck 7 in three axes by the three-axis moving means 9, the lead of the leaded component 5 is inserted into the hole of the printed circuit board 3 from the bottom side. insert. Next, in this state, the soldering work robot 14 operates to solder the leads of the component 5 to the printed circuit board 3.

In this way, according to the above embodiment, by inserting the leads of the component 5 into the holes of the printed circuit board 3 from the bottom side,
The leads of the component 5 can be made to protrude to the upper surface of the printed circuit board 5, and in this state, the leads are soldered to the printed circuit board 3 directly from the upper surface of the printed circuit board 3 by the soldering robot 14. It has the advantage of being able to

Next, a second embodiment of the present invention will be described.

3 and 4 show a component lead insertion device according to a second embodiment of the present invention, FIG. 3 is a schematic perspective view, and FIG.
The figure is a schematic front view.

In this embodiment, the same components as those in the first embodiment are given the same reference numerals, and the explanation thereof will be omitted, and the different configuration will be explained.

The feature of this embodiment is that, as shown in FIGS. 3 and 4, the printed circuit board 3 and the pallet 6 are formed so that their width dimensions are the same, and are alternately fed into the conveyor belt 2. The point is that it is configured to be

According to this embodiment, the belt conveyor 4 exclusively used for pallets in the first embodiment is not required.

Next, a third embodiment of the present invention will be described.

5 and 6 show a component lead insertion device according to a third embodiment of the present invention, FIG. 5 is a schematic perspective view, and FIG.
The figure is a schematic side view.

In this embodiment, the same components as those in the first embodiment are given the same reference numerals, and the explanation thereof will be omitted, and the different configuration will be explained.

The feature of this embodiment is that, as shown in FIGS. 5 and 6, a supply device 16 for the leaded component 5 is provided.

According to this embodiment, the belt conveyor 4 and pallet 6 dedicated to pallets in the first embodiment are unnecessary.

DETAILED DESCRIPTION OF THE INVENTION According to the present invention, as described above, the chuck holding the leaded component is vertically rotated by the rotating mechanism, the chuck is driven by the three-axis moving means, and the lead of the component being held is attached to the printed circuit board. By inserting from the bottom surface side, the leads of the component can be made to protrude to the top surface side of the printed circuit board, and work such as soldering of the leads to the printed circuit board can be performed directly from the top surface side of the printed circuit board.

In addition, since the parts are held directly under the printed circuit board by a chuck, there is no need for pre-adhesion during soldering or bending of leads to prevent parts from being removed.
Therefore, the quality can be improved, the work process can be shortened, and the equipment can be made smaller. can be achieved.

[Brief explanation of the drawing]

1 and 2 show a component lead insertion device according to a first embodiment of the present invention, FIG. 1 is a schematic perspective view, and FIG.
3 and 4 show a component lead insertion device according to a second embodiment of the present invention, FIG. 3 is a schematic perspective view, FIG. 4 is a schematic front view, and FIG. 5 is a schematic side view. 6 shows a component lead insertion device according to a third embodiment of the present invention, FIG. 5 is a schematic perspective view, FIG. 6 is a schematic side view, and FIG. 7 is a conventional component lead insertion device. a schematic perspective view showing;
FIG. 8 is an explanatory diagram of the conventional work process from inserting leads to soldering of components. 2... Belt conveyor, 3... Printed circuit board, 4...
... Belt conveyor, 5... Parts with leads, 6...
Pallet, 7... Chuck, 8... Vertical rotation mechanism,
9...3-axis moving means (3-axis robot), 11...X
Axis moving means, 12... Two-axis moving means, 13... Y-axis moving means, 14... Soldering work robot, 16...
・Feeding device for parts with leads.

Claims (1)

[Claims] A component comprising a chuck that holds a leaded component, a turning mechanism that vertically turns the chuck, and a three-axis moving means that moves the chuck and the turning mechanism in three axes orthogonal to each other. Lead insertion device.