JP2646082B2 - Semiconductor chip pickup device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention mainly relates to a pickup device of a die bonding device.

<Prior Art> Conventionally, as an example of a die bonding apparatus, a second bonding apparatus has been used.
FIG. 1 shows a schematic arrangement shown in a plan view. The die bonding apparatus includes a pickup unit 33 for transferring the chip 30 from a chip tray 31 on which the semiconductor chip 30 is loaded to a chip positioning unit 32, and the support base 34 provided in the pickup unit 33 applies the vacuum to the chip 30. A holding head 35 for suction is provided. On the chip tray 31, a number of semiconductor chips 30, which have been determined as non-defective products in the inspection process, are stacked in a certain direction, and the holding head 35 of the pickup unit 33 holds these chips 30 in a certain direction. The pieces are held one by one while facing and transported to the positioning part 32.

Reference numeral 36 in this figure is a supply table for supplying a printed circuit board 37 to which the chip 30 is bonded, and reference numeral 38 is an extraction table for taking out the printed circuit board 37 on which bonding has been completed, and between these two tables 36, 38. A board XY table 39 for transferring the printed board 37 is provided. Reference numeral 40 denotes a bonding section for transferring and bonding the chip 30 placed on the chip positioning section 32 to the printed board 37 on the board XY table 39, and reference numeral 41 denotes a bonding section disposed before the bonding section 40 and attached to the printed board 37. A pace supply unit to which a chip mount paste is attached.

<Problems to be Solved by the Invention> In the above-described die bonding apparatus, the semiconductor chip 30 in a state where the holding head 35 of the pickup unit 33 is directed in a certain direction (positive direction) is transferred as it is. Therefore, in the bonding section 40, any of the chips 30 is bonded to the printed circuit board 37 in the forward direction. Therefore, when bonding the chips 30 in the forward direction and the reverse direction on the same printed circuit board 37 like the substrate 45 for a thermal printer head shown in FIG. 3, there are the following problems.

That is, in the case of such a board 45, first, only the chip 30 in the normal direction is bonded to the printed board 37, and then the front and rear directions of the printed board 37 itself are reversed by a manual operation of an operator, and the supply table is again provided. After feeding to 36, the chip 30 in the opposite direction must be rebonded. Therefore, when bonding the chip 30 in both the forward and reverse directions on the same printed circuit board 37, not only the work of reversing the printed circuit board 37 is required, but also the transfer of the printed circuit board 37 and the bonding to the same twice. It had to be repeated, and the production work was laborious and time-consuming, resulting in low production efficiency.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described conventional problems, and has as its object to provide a semiconductor chip pickup device that can reduce unnecessary work required for repetitive work, reduce the work time, and improve production efficiency.

<Means for Solving the Problems> In order to achieve such an object, the present invention provides a support plate arranged in a horizontal direction and a support plate having upper and lower ends protruding from the support plate. In the direction substantially perpendicular to, and is rotatably supported and provided,
A holding head having a lower end portion as a holding portion of the semiconductor chip, a first power transmission body mounted in an externally fitted state on a portion located on the upper end side of the holding head near the upper surface of the support plate, A second power transmission unit engaged with the first power transmission unit and transmitting a rotational force to the first power transmission unit; and a driving unit for driving the second power transmission unit; Provided is a semiconductor chip pickup device in which the horizontal position of the semiconductor chip can be changed by rotating a head.

<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings.

FIG. 1 is a perspective view showing a reversing mechanism of a semiconductor chip. In FIG. 1, reference numeral 10 denotes a support base on the front surface of a pickup unit 33, 11 denotes a holding head of the semiconductor chip, and 12 denotes air as driving means of the holding head 11. It is a cylinder. In addition,
The configuration and operation of the entire die bonding apparatus are the same as those of the conventional example shown in FIG.

The support base 10 is formed in a substantially "L" shape, and is disposed on the front surface of the above-described pickup unit 33 by its fixed end 10a. The protruding end 10b of the support base 10 includes
A bracket (support plate) 13 as an extension member of a support base 10 that supports the holding head 11 of the semiconductor chip 30 and the air cylinder 12 is attached. In the drawing, the bracket 13 is divided into two parts, but may be formed integrally.

The holding head 11 is composed of a cylindrical main body 14 and a tube 15 made of silicon or the like protruding therethrough and rotated at least 180 degrees by a through hole (not shown) formed in the bracket 13. It is supported to be able to. The upper end of the tube 15 is connected to a vacuum exhaust device (not shown), and the lower end of the tube 15 is
Is held by suction.

On the other hand, an interlocking mechanism between the holding head 11 and the air cylinder 12 includes a pinion (first power transmission body) 16 and a rack (second power transmission body) 17. Pinion 16
Is attached to the outer periphery of the main body 14 of the holding head 11. The air cylinder 12 is disposed on the other end side of the bracket 13 and a rack 17 is connected to the tip of the rod 12a.
Meshes with 16. Reference numeral 18 in the figure is a support member that supports the rod 12a of the air cylinder 12. In addition, this interlocking mechanism is used for such a pinion 16 and a rack.
The mechanism is not limited to the mechanism composed of 17, and for example, another mechanism such as a link mechanism can be used. Also,
As the driving means, a stepping motor may be used.

Next, the operation of the semiconductor chip reversing mechanism configured as described above will be described.

First, the semiconductor chip 30 oriented in a certain direction (positive direction) is sucked and held at the lower end of the tube 15 of the holding head 11. When the tip 30 needs to be turned in the opposite direction, the rack 17 connected to the rod 12a is moved forward or backward by expanding and contracting the rod 12a of the cylinder 2,
By this operation, the holding head 11 is rotated via the pinion 16 meshing with the rack 17. At this time, the holding head 11 of the extension stroke of the cylinder rod 12a is
By setting the stroke corresponding to the degree rotation, the holding head 11 can be rotated half a turn, and the chip 30 held by the holding head 11 can be turned in the opposite direction.

In the above description, the present invention is applied to the pickup unit 33 of the die bonding apparatus shown in FIG. 2, but such a semiconductor chip reversing mechanism can be applied to the bonding unit 40. . That is, the reversing mechanism of the present invention may be provided in the semiconductor chip holding head 42 of the bonding section 40 so that the chip 30 is directed in the reverse direction.

<Effect of the Invention> As described above, according to the present invention, the direction of the chip is reversed by rotating the holding head of the semiconductor chip by half its driving means, so that the chip in both the forward and reverse directions is bonded to the printed circuit board. Even if
There is no need to manually reverse the printed circuit board or repeat the transfer and bonding of the printed circuit board. Therefore, extra labor and time conventionally required for such a substrate production operation can be omitted, and the production efficiency can be improved.

In particular, in the present invention, the interlock between the holding head and the driving means is performed by the engagement between the first power transmission body and the second power transmission body, and the vicinity of the position where the holding head projects above the support plate. To reduce the distance between the rotation support portion of the holding head and the first power transmission body, thereby reducing the moment of inertia of the first power transmission body. Therefore, power transmission from the driving means to the holding head is performed with high accuracy, whereby the holding head is always rotated at an accurate angle, and the horizontal position of the semiconductor chip is accurately changed by the holding head.

In addition, in the present invention, since the engagement position between the first power transmission body and the second power transmission body is set on the support plate, even if abrasion powder, lubricant, or the like due to the engagement falls from the engagement part, The semiconductor chip falls on the support plate and does not reach the semiconductor chip portion, so that the horizontal position of the semiconductor chip can be changed without any trouble.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a semiconductor chip reversing mechanism according to the present invention, FIG. 2 is a plan view showing a schematic arrangement of a die bonding apparatus, and FIG. 3 is a substrate for a thermal printer head. 10 ... Support base, 11 ... Head for holding semiconductor chip,
12 Air cylinder (drive means).

Claims (1)

(57) [Claims] A support plate disposed in a horizontal direction, and rotatably supported substantially vertically and rotatably with respect to the support plate so that upper and lower ends protrude from the support plate. A holding head having a lower end portion as a holding portion of the semiconductor chip, and a first power transmission body mounted in an externally fitted state on a portion located on the upper end side of the holding head near the upper surface of the support plate. A second power transmission body engaged with the first power transmission body and transmitting a rotational force to the first power transmission body; and a driving unit for driving the second power transmission body; A semiconductor chip pickup device in which a horizontal position of the semiconductor chip can be changed by rotating a holding head.