CN219612168U - SMT paster reflow soldering anchor clamps - Google Patents

Abstract

The utility model relates to the field of clamping equipment, in particular to an SMT patch reflow soldering clamp which comprises a support and an operating platform arranged above the support; the four sliding plates A are respectively arranged at the inner sides of the four sliding holes in a sliding way, and each sliding plate A is provided with a linear driving mechanism; a sliding groove is formed in the inner side wall of each sliding hole, a sliding plate B is installed in the sliding groove in a sliding mode, and a pressure sensor is installed on the side face, adjacent to the corresponding side sliding plate A, of the sliding plate B. The utility model only needs to correct the position of the pressure sensor for the first time, and the automatic clamping function can be realized only by placing the substrate on the operation table in the subsequent step, so that the utility model has high automation degree, can adapt to the clamping work of substrates with different sizes, has strong adaptability, and is convenient for operators to take out the substrates on the operation table by arranging the sliding holes.

Description

SMT paster reflow soldering anchor clamps

Technical Field

The utility model relates to the field of clamping equipment, in particular to an SMT patch reflow soldering clamp.

Background

The reflow soldering technology is not unfamiliar in the field of electronic manufacturing, and components on various boards used in a computer are soldered to a circuit board by the technology, and a heating circuit is arranged in the equipment, so that air or nitrogen is heated to a high enough temperature and then blown to the circuit board on which the components are already stuck, and solder on two sides of the components is melted and then bonded with the main board. The process has the advantages that the temperature is easy to control, oxidation can be avoided in the welding process, the manufacturing cost is easy to control, reflow soldering is a complex and key process in the SMT process, various science such as automatic control, materials, hydrodynamics and metallurgy are involved, the aspects of the welding process must be deeply studied to obtain excellent welding quality, the reflow soldering is one of the key processes of the SMT paster, and the quality of surface assembly is directly reflected in the reflow soldering result, so that factors which clearly influence the reflow soldering quality are needed to be known.

The Chinese patent with the publication number of CN214921221U discloses an SMT patch reflow soldering clamp, which comprises a housin, the casing below is equipped with the cross support, the intermediate position department of cross support runs through fixedly to inlay and is equipped with nut seat one, nut seat one internal thread rotates and inlays and is equipped with adjusting screw one, the bottom intermediate position department of casing be fixed be equipped with adjusting screw one assorted bearing frame one, the top symmetry of cross support is fixed and is equipped with branch one, the top of branch one all runs through the bottom of casing extends to in the casing and fixedly connected with backup pad, the equal symmetrical slip of both sides of casing is inlayed and is equipped with branch two, the branch two is close to the one end of backup pad all extends to in the casing and fixedly connected with riser, the bottom of riser is all fixed and is equipped with the lower plate, the riser is close to one side upper portion of backup pad all slide be equipped with lower plate assorted punch holder.

The above-disclosed patents still suffer from the following drawbacks: after the substrate is placed on the supporting plate, the clamping mechanism needs to be manually adjusted, so that the operation is complex, and the processing efficiency is affected.

Disclosure of Invention

The utility model aims to solve the technical problems in the background art and provides an SMT patch reflow soldering clamp.

The technical scheme of the utility model is as follows: an SMT patch reflow soldering clamp comprises a support and an operating platform arranged above the support; a plurality of support legs are fixed between the support and the operation table; the four sliding plates A are respectively arranged at the inner sides of the four sliding holes in a sliding way, and each sliding plate A is provided with a linear driving mechanism; the center of the upper end surface of the operating platform is provided with a mounting groove, and the inner side of the mounting groove is provided with a proximity sensor; the sliding groove is formed in the inner side wall of each sliding hole, a sliding plate B is mounted in the sliding groove in a sliding mode, a driving assembly for driving the sliding plate B to move is mounted on the operating platform, a pressure sensor is mounted on the side face, adjacent to the sliding plate A on the corresponding side, of the sliding plate B, and a control module is mounted on the operating platform.

Preferably, two scale strips are arranged on the upper end face of the operation table, and the two scale strips are mutually perpendicular.

Preferably, the linear driving mechanism comprises a servo motor and a threaded rod A, the servo motor is arranged on the support, the threaded rod A is connected with an output shaft of the servo motor, and the sliding plate A is in threaded connection with the threaded rod A.

Preferably, the drive assembly comprises a threaded rod B and a rotary table, the threaded rod B is rotatably arranged on the inner side of the sliding groove, the sliding plate B is in threaded connection with the threaded rod B, and the end part of the threaded rod B extends to the outer side of the operating platform and is connected with the rotary table.

Preferably, the extending directions of the four sliding holes are respectively perpendicular to the four side edges of the operating platform.

Compared with the prior art, the technical scheme provided by the utility model has the following beneficial technical effects: when the substrate is placed on the next place, the substrate is sensed by the proximity sensor, signals are fed back to the control module, then the control module controls and starts a plurality of servo motors to work, the servo motors can drive the sliding plate A to move towards the center of the operation platform, and then the positioning plates are driven to move, when the sliding plate A contacts with the corresponding side of the pressure sensor, the driving of the sliding plate A is stopped, and the substrate is fixedly clamped on the operation platform; in summary, the utility model only needs to correct the position of the pressure sensor for the first time, and the automatic clamping function can be realized only by placing the substrate on the operation table in the subsequent step, so that the utility model has high automation degree, can adapt to the clamping work of substrates with different sizes, has strong adaptability, and can bring convenience for operators to take out the substrate on the operation table by arranging the slide holes.

Drawings

Fig. 1 is a schematic structural view of the present utility model.

Fig. 2 is an exploded view of the present utility model.

Reference numerals: 1. an operation table; 101. a slide hole; 102. a mounting groove; 103. a chute; 2. a support; 3. a positioning plate; 4. a proximity sensor; 5. a scale bar; 6. a support leg; 7. a control module; 8. a servo motor; 9. a threaded rod A; 10. a sliding plate A; 11. a threaded rod B; 12. a sliding plate B; 13. a pressure sensor; 14. a turntable.

Detailed Description

As shown in fig. 1-2, the SMT patch reflow soldering fixture provided by the utility model comprises a support 2 and an operating platform 1 arranged above the support 2; a plurality of support legs 6 are fixed between the support 2 and the operating platform 1; the four sides of the operation table 1 are respectively perpendicular to the extending directions of the four sliding holes 101, the four sliding plates A10 are respectively arranged on the inner sides of the four sliding holes 101 in a sliding manner, each sliding plate A10 is provided with a linear driving mechanism, each linear driving mechanism comprises a servo motor 8 and a threaded rod A9, the servo motor 8 is arranged on the support 2, the threaded rod A9 is connected with an output shaft of the servo motor 8, and the sliding plates A10 are in threaded connection with the threaded rods A9; a mounting groove 102 is formed in the center of the upper end face of the operating platform 1, and a proximity sensor 4 is mounted on the inner side of the mounting groove 102; a sliding groove 103 is formed in the inner side wall of each sliding hole 101, a sliding plate B12 is arranged in the sliding groove 103 in a sliding manner, a driving component for driving the sliding plate B12 to move is arranged on the operating platform 1, the driving component comprises a threaded rod B11 and a rotary table 14, the threaded rod B11 is rotatably arranged on the inner side of the sliding groove 103, the sliding plate B12 is in threaded connection with the threaded rod B11, the end part of the threaded rod B11 extends to the outer side of the operating platform 1 and is connected with the rotary table 14, a pressure sensor 13 is arranged on the side surface, adjacent to the sliding plate A10 on the corresponding side, of the sliding plate B12, and a control module 7 is arranged on the operating platform 1; two scale strips 5 are arranged on the upper end face of the operating platform 1, and the two scale strips 5 are mutually perpendicular.

In this embodiment, the substrate to be clamped is placed on the upper end surface of the operation table 1 during operation, then the substrate is aligned, so that the substrate is placed between the four positioning plates 3, the threaded rod B11 is driven to rotate by the turntable 14, the sliding plate B12 is driven to move inside the chute 103 by the rotation of the threaded rod B11, the pressure sensor 13 is driven to move, so that the pressure sensor 13 is aligned with a corresponding side edge on the substrate, the positions of the other pressure sensors 13 are adjusted according to the method, thereby completing the calibration operation of the pressure sensors 13 (the power supply of the servo motor 8 is turned off before the calibration operation), the proximity sensor 4 senses the substrate during the next placement of the substrate, and feeds back signals to the control module 7, the control module 7 controls the start of the operation of the servo motors 8, the servo motor 8 can drive the sliding plate a10 to move towards the center of the operation table 1, the positioning plate 3 is driven to move, and the sliding plate a10 stops driving the sliding plate a10 to be contacted with the pressure sensor 13 on the corresponding side, and the substrate is clamped on the operation table 1 fixedly at this time; in summary, the utility model only needs to correct the position of the pressure sensor 13 for the first time, and the automatic clamping function can be realized only by placing the substrate on the operation table 1 in the subsequent steps, so that the utility model has high automation degree, can adapt to the clamping work of substrates with different sizes, has strong adaptability, and is convenient for operators to take out the substrate on the operation table 1 by arranging the slide holes 101.

The embodiments of the present utility model have been described in detail with reference to the drawings, but the present utility model is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present utility model.

Claims (5)

1. The SMT patch reflow soldering clamp is characterized by comprising a support (2) and an operating table (1) arranged above the support (2); a plurality of support legs (6) are fixed between the support (2) and the operating table (1); positioning plates (3) are arranged around the upper end face of the operation table (1), sliding plates A (10) are vertically connected to the bottom ends of the four positioning plates (3), four sliding holes (101) are formed in the operation table (1), the four sliding plates A (10) are respectively arranged on the inner sides of the four sliding holes (101) in a sliding mode, and a linear driving mechanism is arranged on each sliding plate A (10); a mounting groove (102) is formed in the center of the upper end surface of the operating platform (1), and a proximity sensor (4) is mounted on the inner side of the mounting groove (102); a sliding groove (103) is formed in the inner side wall of each sliding hole (101), a sliding plate B (12) is mounted in the sliding groove (103), a driving assembly for driving the sliding plate B (12) to move is mounted on the operating platform (1), a pressure sensor (13) is mounted on the side face, adjacent to the corresponding side sliding plate A (10), of the sliding plate B (12), and a control module (7) is mounted on the operating platform (1).

2. The SMT chip reflow soldering fixture according to claim 1, wherein two scale strips (5) are arranged on the upper end face of the operating table (1), and the two scale strips (5) are mutually perpendicular.

3. An SMT patch reflow soldering fixture according to claim 1, wherein the linear driving mechanism comprises a servo motor (8) and a threaded rod a (9), the servo motor (8) is mounted on the support (2), the threaded rod a (9) is connected with an output shaft of the servo motor (8), and the sliding plate a (10) is in threaded connection with the threaded rod a (9).

4. An SMT patch reflow soldering jig according to claim 1, wherein the driving assembly comprises a threaded rod B (11) and a turntable (14), the threaded rod B (11) is rotatably mounted inside the chute (103), the sliding plate B (12) is in threaded connection with the threaded rod B (11), and the end of the threaded rod B (11) extends to the outside of the console (1) and is connected with the turntable (14).

5. An SMT patch reflow soldering jig according to claim 1, wherein the four slide holes (101) extend in directions perpendicular to the four sides of the console (1), respectively.