CN218447851U

CN218447851U - Wafer carrying device

Info

Publication number: CN218447851U
Application number: CN202222382435.XU
Authority: CN
Inventors: 钱朋
Original assignee: Suzhou Luster Vision Intelligent Device Co Ltd
Current assignee: Suzhou Luster Vision Intelligent Device Co Ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-02-03
Anticipated expiration: 2032-09-08

Abstract

The utility model discloses a handling device of wafer relates to wafer production technical field. The wafer is provided with a plurality of screens, each screen all corresponds and is provided with the wiring end, and this handling device includes supporting platform, bears mechanism and crimping mechanism. The supporting platform is provided with a first sliding rail; the bearing mechanism is arranged on the first sliding rail in a sliding manner and can bear the wafer; the crimping mechanism comprises a support and a crimping component, the support is arranged on the first sliding rail in a sliding mode, the crimping component is arranged on the support in a sliding mode along the vertical direction, and the crimping component can abut against the wafer and light the screen. The wafer carrying device can eliminate errors in the moving process, greatly improves the detection accuracy and reduces the production and manufacturing cost.

Description

Wafer carrying device

Technical Field

The utility model relates to a wafer production technical field especially relates to a handling device of wafer.

Background

The intelligent watch is a multifunctional watch which is provided with an intelligent system in the watch and can be operated by touching a screen, and can synchronize a telephone, a short message, a mail, a photo, music and the like in a mobile phone. In the production process of the screen of the intelligent watch, screen display defect detection is one of important links, whether the screen has defects or not is detected through a screen detection process, and therefore the defect products are prevented from flowing into the market.

In the production process, a wafer is generally used as a substrate, and a plurality of screens are arranged on the wafer at intervals, and the wafer is provided with a terminal corresponding to each screen. In many processing devices, the pressure welding and the bearing table moving wafers are separated to act at different positions, in the carrying process of the bearing table, the moving error can cause the increase of the pressure welding error, and the improvement of the precision of the device can greatly improve the manufacturing cost of the device and simultaneously improve the debugging difficulty of the device.

In view of the above problems, it is necessary to develop a wafer transfer apparatus to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a handling device of wafer can eliminate the error of removing the in-process, has improved the accuracy that detects greatly, reduces production manufacturing cost.

To achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a handling device of wafer, is provided with a plurality of screens on the wafer, every the screen all corresponds and is provided with the wiring end, includes:

the supporting platform is provided with a first sliding rail;

the bearing mechanism is arranged on the first sliding rail in a sliding mode and can bear the wafer;

the crimping mechanism comprises a support and a crimping component, wherein the support is arranged on the first sliding rail in a sliding mode, the crimping component is arranged on the support in a sliding mode along the vertical direction, and the crimping component can abut against the wafer and light the screen.

Preferably, the crimping component comprises a crimping piece and a plurality of crimping heads, wherein the crimping piece is arranged on the bracket in a sliding mode along the vertical direction, the plurality of crimping heads are arranged on the crimping piece, and each crimping head can be correspondingly crimped to the terminal of one screen to light the screen.

Preferably, the crimping part comprises a crimping part, a connecting part and a sliding part which are connected in sequence, the connecting part inclines towards the bearing mechanism along the direction from bottom to top, and the sliding part is arranged on the bracket in a sliding mode along the vertical direction.

Preferably, the crimping member includes an adjustment groove, and the crimping head is movable in a length direction of the adjustment groove.

Preferably, the adjusting grooves are provided with a plurality of strips at intervals along the width direction of the adjusting grooves, the crimping head is provided with a plurality of fixing pieces, and each fixing piece penetrates through one corresponding adjusting groove and fixes the crimping head.

Preferably, the bearing mechanism comprises a base and a bearing platform arranged on the base, the base is slidably arranged on the first sliding rail, and the bearing platform is provided with an adsorption hole.

Preferably, the bearing mechanism further comprises a plurality of positioning pieces, the positioning pieces are arranged on the bearing table, and the positioning pieces can abut against the edge of the wafer to position the wafer.

Preferably, the base is provided with a second slide rail, the plummer slide set up in the second slide rail, the second slide rail with first slide rail is the contained angle setting.

Preferably, the bearing mechanism further comprises a driving member, the driving member is disposed on the base, and the driving member can drive the bearing table to rotate relative to the base.

Preferably, still include the third slide rail, the third slide rail with first slide rail is the contained angle setting, supporting platform slide set up in the third slide rail.

The utility model has the advantages that:

the utility model provides a handling device of wafer. In the carrying device, the bearing mechanism and the crimping mechanism are both arranged on the first sliding rail of the supporting platform, so that after the crimping mechanism is used for crimping the wafer on the bearing mechanism, the supporting platform is moved to enable the bearing mechanism and the crimping mechanism to move synchronously, errors in the moving process are eliminated, the detection accuracy is greatly improved, and the production and manufacturing cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a wafer according to the present invention;

fig. 2 is a schematic structural view of a wafer handling apparatus provided in the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

fig. 4 is a schematic structural diagram of the crimping mechanism provided by the present invention;

fig. 5 is a schematic structural diagram of the carrying mechanism provided by the present invention.

In the figure:

100. a wafer; 101. a screen; 102. a terminal;

1. a support platform; 2. a carrying mechanism; 3. a crimping mechanism; 4. a third slide rail;

11. a first slide rail; 21. a base; 22. a bearing table; 23. a positioning member; 24. a second slide rail; 25. a drive member; 26. a slider; 31. a support; 32. a crimping assembly;

221. a threaded hole; 321. a crimping member; 322. a crimping head;

3211. a crimping part; 3212. a connecting portion; 3213. a sliding part;

32111. and adjusting the groove.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "secured" are to be construed broadly and encompass, for example, both fixed and removable connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in direct contact with the second feature but being in contact with the second feature by another feature therebetween. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical solution of the present invention is further explained by the following embodiments with reference to the drawings.

The intelligent watch is a multifunctional watch which is provided with an intelligent system in the watch and can be operated by touching a screen, and can synchronize a telephone, a short message, a mail, a photo, music and the like in a mobile phone. In the production process of the screen of the intelligent watch, screen display defect detection is one of important links, and whether the screen has defects or not is detected through a screen detection process, so that defective products are prevented from flowing into the market.

As shown in fig. 1, in order to improve production efficiency, a whole wafer 100 is generally used as a substrate, a plurality of screens 101 are spaced on the wafer 100, and each screen 101 is provided with a terminal 102. The corresponding screen 101 may be lighted by supplying power to the terminals 102, and then the color, brightness, stability, etc. of the screen 101 may be checked by the detection means, thereby determining whether the screen 101 is qualified. After the detection is completed, the wafer 100 is cut to form a plurality of screens 101, and the screens 101 qualified in the detection are installed in the smart watch.

In the prior art, the whole wafer 100 is generally moved to the pressing mechanism 3 by the carrier mechanism 2, the pressing mechanism 3 presses the wafer 100 against the terminals 102, the terminals 102 supply power to the corresponding screen 101 to light up the screen 101, and the detection device detects the screen 101. During the transportation process of the carrier mechanism 2, no matter the wafer 100 moves during the movement process or the error of the equipment itself, the position of the wafer 100 may be deviated when the wafer 100 moves to the pressure welding mechanism 3, so that the pressure welding mechanism 3 may not be accurately connected to the terminal 102, or the connection may be poor, thereby affecting the detection result of the screen 101. And improving the precision of the equipment can greatly improve the manufacturing cost of the equipment and simultaneously improve the debugging difficulty of the equipment.

The embodiment provides a wafer carrying device. As shown in fig. 2, the carrying device includes a support platform 1, a carrying mechanism 2, and a pressing mechanism 3. The supporting platform 1 is provided with a first slide rail 11, the bearing mechanism 2 is slidably disposed on the first slide rail 11, the bearing mechanism 2 can bear the wafer 100, the crimping mechanism 3 includes a bracket 31 and a crimping component 32, the bracket 31 is slidably disposed on the first slide rail 11, the crimping component 32 is slidably disposed on the bracket 31 along a vertical direction, and the crimping component 32 can abut against the wafer 100 and light the screen 101.

For convenience of description, in the present embodiment, the extending direction of the first slide rail 11 is a first direction (X direction in the figure), a direction perpendicular to the first direction is a second direction (Y direction in the figure), and both the first direction and the second direction are perpendicular to the vertical direction.

In the carrying device, the bearing mechanism 2 and the crimping mechanism 3 are both arranged on the first slide rail 11 of the supporting platform 1, so that after the wafer 100 is placed on the bearing mechanism 2 and positioned at each time, the crimping mechanism 3 can be accurately connected with the wiring terminal 102 when the wafer 100 is crimped, and the supporting platform 1 can enable the bearing mechanism 2 and the crimping mechanism 3 to move synchronously, so that errors in the moving process are eliminated, the screen 101 on the wafer 100 can be detected when the supporting platform 1 moves to the detection device, the detection accuracy is greatly improved, and the production and manufacturing cost is reduced.

As shown in fig. 2 and 3, the crimping assembly 32 includes a crimping member 321 and a plurality of crimping heads 322, the crimping member 321 is slidably disposed on the bracket 31 in a vertical direction, the plurality of crimping heads 322 are disposed on the crimping member 321, and each crimping head 322 can be correspondingly crimped to the terminal 102 of one screen 101 to light up the screen 101. The crimp head 322 is actuated to be crimped to the corresponding terminal 102 by sliding the crimp member 321, thereby supplying power to the terminal 102 to light the screen 101. The plurality of crimping heads 322 can simultaneously supply power to the plurality of screens 101 on the wafer 100, so that the plurality of screens 101 can be simultaneously detected during detection, and the detection efficiency is greatly improved.

As shown in fig. 4, the pressing member 321 includes a pressing portion 3211, a connecting portion 3212 and a sliding portion 3213, which are sequentially connected, the connecting portion 3212 inclines toward the supporting mechanism 2 from bottom to top, and the sliding portion 3213 is vertically slidably disposed on the bracket 31. The inclined connection portion 3212 enables the pressure-bonding portion 3211 to be close to the carrier mechanism 2 in the horizontal direction and to be away from the sliding portion 3213, so that when the pressure-bonding portion 3211 is in pressure-bonding with the wafer 100, other structures of the pressure-bonding mechanism 3 are spaced from the carrier mechanism 2 to avoid the carrier mechanism 2, and the pressure-bonding mechanism 3 is prevented from colliding with the carrier mechanism 2.

It can be understood that, for different smartwatches, the size of the screen 101 is different, and the corresponding size of the wafer 100 and the position of the screen 101 on the wafer 100 are also different. As shown in fig. 2 to 4, in order to improve the applicability of the conveying apparatus, the pressure contact member 321 includes an adjustment groove 32111, and the pressure contact head 322 is movable in the longitudinal direction of the adjustment groove 32111. The positions of the crimping heads 322 can be adjusted by the adjusting grooves 32111 to change the size of the gap between the crimping heads 322, so that the crimping mechanism 3 can crimp different wafers 100. Since the bearing mechanism 2 and the crimping mechanism 3 can adjust positions on the first slide rail 11 along the first direction, the adjusting groove 32111 extends along the second direction, so that multi-dimensional adjustment can be performed to ensure that the crimping head 322 can be crimped onto the terminal 102 accurately.

As shown in fig. 2 to 4, the adjusting grooves 32111 are spaced apart from each other in a width direction thereof, and the crimping head 322 is provided with a plurality of fixing members, each of which passes through a corresponding one of the adjusting grooves 32111 and fixes the crimping head 322. The fixing member can fix the position of the crimping head 322 after the crimping head 322 is adjusted in place, and the plurality of adjustment grooves 32111 can ensure that the crimping head 322 cannot rotate, thereby further ensuring the accuracy. Specifically, the fixing member is a screw, which is threaded to the crimp head 322 after passing through one of the adjustment grooves 32111, and the screw can both slide the crimp head 322 along the adjustment groove 32111 and fix the crimp head 322 by tightening.

As shown in fig. 2 and fig. 5, the carrying mechanism 2 includes a base 21 and a carrying platform 22 disposed on the base 21, the base 21 is slidably disposed on the first slide rail 11, and the carrying platform 22 is provided with an absorption hole. After the wafer 100 is placed on the susceptor 22, the wafer 100 needs to be fixed to prevent the wafer 100 from being displaced before the pressure welding head 322 presses the wafer 100, so that the wafer 100 can be fixed by sucking the wafer 100 through the suction holes, and the wafer 100 can be prevented from being damaged by mechanical fixing.

Preferably, the carrier mechanism 2 further includes a plurality of positioning members 23, the positioning members 23 are disposed on the carrier table 22, and the positioning members 23 can abut against the edge of the wafer 100 to position the wafer 100. The positioning element 23 can limit the initial position of the wafer 100, the outer contours of the wafers 100 with the same size are the same, before the wafer 100 is placed, the position of the positioning element 23 is determined and fixed, and then the wafer 100 is placed on the bearing table 22 each time, the positioning element 23 can be used as a reference, so that the accuracy of the position of the wafer 100 can be ensured, and the efficiency can be improved.

In this embodiment, a total of three positioning elements 23 are provided, and the three positioning elements 23 are respectively disposed on three sides of the susceptor 22, each side of the susceptor 22 is provided with a plurality of threaded holes 221 at intervals, and the positioning elements 23 can be fixed in different threaded holes 221 by screws to correspond to different wafers 100.

As shown in fig. 2 and fig. 5, the base 21 is provided with a second slide rail 24, the plummer 22 is slidably disposed on the second slide rail 24, and the second slide rail 24 and the first slide rail 11 form an included angle. By sliding the base 21 on the second slide rail 24, the relative position between the carrier table 22 and the crimping piece 321 can be adjusted in a direction different from the first direction, which further facilitates the adjustment of the accuracy of the crimping head 322. For ease of operation, second slide track 24 extends in a second direction.

As shown in fig. 5, the carrying mechanism 2 further includes a driving member 25, the driving member 25 is disposed on the base 21, and the driving member 25 can drive the carrying platform 22 to rotate relative to the base 21. The driving member 25 can drive the carrying table 22 to rotate, so as to adjust the angle of the wafer 100 relative to the pressing mechanism 3, although the outer contour of the wafer 100 is circular, the screen 101 on the wafer 100 can change position along with the rotation of the wafer 100, so that the arrangement direction of the screens 101 to be detected is the same as that of the pressing heads 322, and the pressing heads 322 can simultaneously supply power to the corresponding screens 101 through the terminals 102 to light the screens 101. In this embodiment, the driving member 25 is a motor, and the rotation angle of the bearing platform 22 is adjusted by changing the rotation angle of the motor rotor.

However, at this time, the sliding and the rotating of the carrying platform 22 cannot be realized at the same time, and in order to improve the adjustment dimension of the carrying mechanism 2, as shown in fig. 2 and fig. 5, the carrying mechanism 2 further includes a sliding block 26, the sliding block 26 is slidably disposed on the second sliding rail 24, the driving element 25 is disposed on the sliding block 26, and the carrying platform 22 is rotatably disposed on the sliding block 26 and is in transmission connection with the driving shaft of the driving element 25. The traverse of the carrier table 22 can be achieved by moving the slide 26 along the second slide rail 24, and the adjustment of the angle of the wafer 100 can be achieved by driving the carrier table 22 to rotate by the driving member 25.

As shown in fig. 2, the carrying device further includes a third slide rail 4, the third slide rail 4 and the first slide rail 11 form an included angle, and the supporting platform 1 is slidably disposed on the third slide rail 4. The third slide rail 4 can be translated as a whole after the pressure bonding mechanism 3 is in pressure contact with the wafer 100 on the carrier mechanism 2, so as to move the wafer 100 to the position of the detection device for detection. In the moving process, as the crimping mechanism 3 and the bearing mechanism 2 are kept static relative to the supporting platform 1, the relative precision is greatly improved, the problem of poor connection between the crimping piece 321 and the terminal 102 is avoided, and the accuracy of detection is ensured.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and it is to be understood that the present invention is not limited to the above embodiments, but may be modified within the scope of the present invention.

Claims

1. A handling device of wafer, a plurality of screens (101) are arranged on wafer (100), each screen (101) is correspondingly provided with a terminal (102), and the handling device is characterized by comprising:

the supporting platform (1), wherein the supporting platform (1) is provided with a first sliding rail (11);

the bearing mechanism (2) is arranged on the first sliding rail (11) in a sliding mode, and the bearing mechanism (2) can bear the wafer (100);

crimping mechanism (3), including support (31) and crimping subassembly (32), support (31) slide set up in first slide rail (11), crimping subassembly (32) along vertical direction slide set up in support (31), crimping subassembly (32) can support press in wafer (100) and light screen (101).

2. The wafer handling device according to claim 1, wherein the crimping assembly (32) comprises a crimping piece (321) and a plurality of crimping heads (322), the crimping piece (321) is slidably arranged on the bracket (31) along a vertical direction, the plurality of crimping heads (322) are arranged on the crimping piece (321), and each crimping head (322) can be correspondingly crimped to the terminal (102) of one screen (101) to light the screen (101).

3. The wafer conveying apparatus according to claim 2, wherein the pressing member (321) includes a pressing portion (3211), a connecting portion (3212) and a sliding portion (3213) connected in sequence, the connecting portion (3212) is inclined toward the carrying mechanism (2) from bottom to top, and the sliding portion (3213) is vertically slidably disposed on the bracket (31).

4. The wafer conveying apparatus according to claim 2, wherein the crimping member (321) includes an adjustment groove (32111), and the crimping head (322) is movable in a longitudinal direction of the adjustment groove (32111).

5. The wafer conveying apparatus according to claim 4, wherein the adjusting grooves (32111) are provided with a plurality of pieces at intervals in a width direction thereof, and the crimping head (322) is provided with a plurality of fixing pieces, each of which passes through a corresponding one of the adjusting grooves (32111) and fixes the crimping head (322).

6. The wafer conveying apparatus according to any one of claims 1 to 5, wherein the carrying mechanism (2) includes a base (21) and a carrying platform (22) disposed on the base (21), the base (21) is slidably disposed on the first slide rail (11), and the carrying platform (22) is provided with an absorption hole.

7. The wafer handling device according to claim 6, wherein the carrying mechanism (2) further comprises a plurality of positioning members (23), the positioning members (23) are disposed on the carrying stage (22), and the positioning members (23) can abut against the edge of the wafer (100) to position the wafer (100).

8. The wafer conveying apparatus according to claim 6, wherein the base (21) is provided with a second slide rail (24), the plummer (22) is slidably disposed on the second slide rail (24), and the second slide rail (24) and the first slide rail (11) are disposed at an included angle.

9. The wafer handling device according to claim 6, wherein the carrying mechanism (2) further comprises a driving member (25), the driving member (25) is disposed on the base (21), and the driving member (25) can drive the carrying stage (22) to rotate relative to the base (21).

10. The wafer conveying device according to any one of claims 1 to 5, further comprising a third slide rail (4), wherein the third slide rail (4) and the first slide rail (11) are arranged at an included angle, and the support platform (1) is slidably arranged on the third slide rail (4).