CN110582171A - Automatic chip mounting device and automatic chip mounting method - Google Patents
Automatic chip mounting device and automatic chip mounting method Download PDFInfo
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- CN110582171A CN110582171A CN201810581883.8A CN201810581883A CN110582171A CN 110582171 A CN110582171 A CN 110582171A CN 201810581883 A CN201810581883 A CN 201810581883A CN 110582171 A CN110582171 A CN 110582171A
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- material taking
- fine adjustment
- sliding
- mounting
- coarse
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an automatic chip mounting device, comprising: a work table; the coarse positioning mechanism is arranged on the workbench and comprises a material tray bearing table, a coarse movement system and a coarse visual feedback system; the rough adjusting motion system adjusts the position of the tray bearing table according to the feedback information of the rough adjusting visual feedback system, and performs primary positioning on the material to be pasted on the tray bearing table; the mounting mechanism is arranged on the workbench and comprises a mounting objective table, a material taking system, a fine adjustment motion system and a fine adjustment visual feedback system; the material taking system is used for carrying the materials to be pasted, which are preliminarily positioned on the tray bearing table, onto or above the pasting object table; and the fine adjustment motion system adjusts the position of the mounting object stage according to the feedback information of the fine adjustment visual feedback system, and the material to be mounted is accurately aligned. The coarse positioning mechanism is arranged, so that the materials to be mounted are eliminated with visual errors compared with a coarse-adjustment visual feedback system before being carried to the mounting object stage, and the production efficiency and the mounting precision are improved.
Description
Technical Field
The invention relates to an automatic chip mounting device and an automatic chip mounting method.
Background
since the 21 st century, the electronic information product manufacturing industry in China has rapidly developed and gradually becomes one of the national economic support industries.
the chip is used as a core device of electronic communication products such as an optical module and the like, and the mounting of the chip is an important process content in the manufacturing of the electronic communication products. Because the chip is small in size, the requirement on position precision is high during mounting, and the mounting is difficult to finish by pure hands, the automation requirement on chip mounting is huge.
the manufacturing precision and the production efficiency of the automatic or semi-automatic patch are directly related to the performance and the manufacturing cost of the product. The mounting process of most of the surface mounting devices in the current market is to visually acquire the position and mount the surface mounting device in place at one time, and because the mounting operation of a workpiece is completed under the monitoring of a visual system, the manufacturing precision and the working efficiency are relatively high. However, the process cannot effectively eliminate the accumulated error between the workpiece and the vision system, so that the position precision is low when the product is assembled and complicated, and the product is poor in mounting and even scrapped.
in view of the above, a new automatic sheet mounting device and a method for using the same are needed to solve the above problems.
disclosure of Invention
the invention aims to provide a novel automatic chip mounting device, aiming at introducing a coarse positioning mechanism in the chip mounting process, and performing coarse adjustment, fine adjustment and chip mounting in a cooperative manner so as to improve the manufacturing precision and the production efficiency of the chip mounting process.
in order to achieve the purpose, the invention adopts the following technical scheme: an automated patch device comprising:
A work table;
The coarse positioning mechanism is arranged on the workbench and comprises a material tray bearing table, a coarse movement system and a coarse visual feedback system; the rough adjusting motion system adjusts the position of the tray bearing table according to the feedback information of the rough adjusting visual feedback system, and performs primary positioning on the material to be pasted on the tray bearing table;
The mounting mechanism is arranged on the workbench and comprises a mounting objective table, a material taking system, a fine adjustment motion system and a fine adjustment visual feedback system; the material taking system is used for carrying the materials to be mounted which are preliminarily positioned on the tray bearing table to the mounting object table or above the mounting object table; and the fine adjustment motion system adjusts the position of the mounting object stage according to the feedback information of the fine adjustment visual feedback system, and the material to be mounted is accurately aligned.
As one technical scheme of the invention, the coarse movement system comprises a linear sliding module and a rotary alignment module; the tray bearing table, the linear sliding module and the rotary alignment module are sequentially superposed from top to bottom; the linear sliding module drives the material tray bearing table to move in a plane parallel to the table surface of the working table, and the position of a material to be pasted on the material tray bearing table is preliminarily adjusted; the rotary alignment module is arranged on the workbench and drives the linear sliding module and the material tray bearing table to rotate in a plane parallel to the workbench surface, and the angle of the material to be pasted on the material tray bearing table is preliminarily adjusted.
As one technical solution of the present invention, a rotation axis of the rotation alignment module and a center of a field of view of the coarse visual feedback system are on the same axis.
as one technical solution of the present invention, the linear sliding module includes two linear sliding table structures, and sliding directions of the two linear sliding table structures are perpendicular to each other in a plane perpendicular to the rotation axis.
As one technical scheme of the invention, the material taking system comprises a material taking arm group and a material taking sliding group; the material taking sliding group drives the material taking arm group to slide between the mounting objective table and the material disc bearing table, and materials which are roughly adjusted and aligned on the material disc bearing table are conveyed to the mounting objective table or above the mounting objective table and below the fine adjustment visual feedback system.
as one technical scheme of the invention, the material taking sliding group comprises a horizontal sliding group and a vertical sliding group; the material taking arm set comprises a sliding block arranged on the vertical sliding set, a stress sensor arranged on the sliding block and a material taking suction nozzle arranged below the stress sensor.
As one technical scheme of the invention, the coarse positioning mechanism comprises a first tray bearing table, a first coarse movement system, a first coarse visual feedback system, a second tray bearing table, a second coarse movement system and a second coarse visual feedback system;
The first tray bearing table is used for containing a tray filled with a first material, and the second tray bearing table is used for containing a tray filled with a second material;
The first rough adjusting movement system is matched with the first rough adjusting visual feedback system to realize the primary positioning of the first material to be pasted on the first material tray bearing table;
The second rough adjusting movement system is matched with the second rough adjusting visual feedback system to realize the primary positioning of a second material to be pasted on the second material tray bearing table;
The material taking system comprises a first material taking arm group, a first material taking sliding group, a second material taking arm group and a second material taking sliding group;
the first material taking sliding group drives the first material taking arm group to slide between the mounting objective table and the first material disc bearing table, and the first material which is roughly adjusted and aligned on the first material disc bearing table is conveyed to the mounting objective table;
The second material taking sliding group drives the second material taking arm group to slide between the surface mounting object table and the second material disc bearing table, and the second material which is roughly aligned on the second material disc bearing table is conveyed to the position above the surface mounting object table and below the fine adjustment visual feedback system.
As one technical scheme of the invention, the fine adjustment movement system comprises a fine adjustment sliding table and a fine adjustment rotating table; the fine adjustment sliding table is arranged on the workbench, and the fine adjustment rotating table is arranged on the fine adjustment sliding table; the fine tuning slip table drives fine tuning revolving stage and subsides dress objective table and removes, the fine tuning revolving stage drives the dress objective table rotates, to locate in material and the dress objective table top on the dress objective table material on the material taking module carries out the accurate counterpoint.
As one technical scheme of the invention, the fine adjustment sliding table comprises two linear fine adjustment sliding table structures with mutually vertical sliding directions.
the invention also provides an automatic patch attaching method, which comprises the following steps:
Providing an automated patch device as described above;
primary positioning: the coarse positioning mechanism is used for performing preliminary positioning on a chip substrate and a silicon substrate to be pasted respectively;
Taking materials: the material taking system respectively conveys the silicon substrate roughly aligned to the mounting objective table, and sucks the chip substrate to the position above the silicon substrate placed on the mounting objective table and below the fine-adjustment visual feedback system;
Fine adjustment: keeping the position and the direction of the chip substrate still, providing feedback of the position of the silicon substrate and the relative position between the silicon substrate and the chip substrate by the fine adjustment visual feedback system, and controlling the fine adjustment movement system to finely adjust the position and the angle of the silicon substrate so as to accurately align the silicon substrate and the chip substrate;
Mounting: and the material taking system presses the chip substrate downwards to mount the chip substrate on the silicon substrate to finish mounting.
The invention has the beneficial effects that: compared with the prior art, the automatic chip mounting device provided by the invention is additionally provided with the coarse positioning mechanism, on one hand, the to-be-mounted material is preliminarily positioned in advance, and the efficiency of fine adjustment and alignment of the to-be-mounted material by the mounting mechanism is improved; on the other hand, when the mounting mechanism carries out material fine adjustment and mounting work, the coarse positioning mechanism can carry out coarse adjustment positioning on the next material to be mounted, and the two work in cooperation, so that the production efficiency is greatly improved; the visual feedback system is matched to conduct coarse adjustment and fine adjustment alignment on the materials, and the mounting precision is effectively improved.
drawings
FIG. 1 is a schematic view of an assembled structure of an automatic sheet attaching apparatus according to a preferred embodiment of the present invention;
FIG. 2 is an exploded view of the first coarse positioning mechanism and the material take-out system of the automated placement machine shown in FIG. 1;
FIG. 3 is an exploded view of a second coarse positioning mechanism and a reclaiming system of the automated placement machine shown in FIG. 1;
Fig. 4 is a schematic structural view of a mounting mechanism of the automatic sheet mounting apparatus shown in fig. 1.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.
terms such as "upper," "above," "lower," "below," and the like, used herein to denote relative spatial positions, are used for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. Also, it should be understood that, although the terms first, second, etc. may be used herein to describe various elements or structures, these described elements should not be limited by these terms. These terms are only used to distinguish these descriptive objects from one another.
Referring to fig. 1 to 4, a preferred embodiment of the present invention provides an automatic sheet attaching device including: a work table 3; the rough positioning mechanism 1 is arranged on the workbench 3, and the rough positioning mechanism 1 comprises a material tray bearing table 11, a rough movement system 12 and a rough adjustment visual feedback system 13; the rough movement system 12 adjusts the position of the tray bearing table 11 according to the feedback information of the rough visual feedback system 13, and performs primary positioning on the material to be mounted on the tray bearing table 11; the mounting mechanism is arranged on the workbench 3 and comprises a mounting objective table 5, a material taking system 4, a fine adjustment motion system 6 and a fine adjustment visual feedback system 7; the material taking system 4 is used for conveying the materials to be mounted, which are preliminarily positioned on the tray bearing table 11, onto the mounting object table 5 or above the mounting object table 5; and the fine adjustment motion system 6 adjusts the position of the mounting object table 5 according to the feedback information of the fine adjustment visual feedback system 7, and the material to be mounted is accurately aligned.
The automatic chip mounting device disclosed by the invention is provided with the coarse positioning mechanism 1, the coarse positioning mechanism 1 can be used for preliminarily positioning a material to be mounted, and adjusting the material to be mounted to a preset position and angle in advance, so that the material taking system 4 can obtain the material to be mounted from the material disc bearing table 11 only by moving between the mounting object table 5 and the material disc bearing table 11 according to a preset fixed stroke, and the stroke of the material taking system 4 is not required to be adjusted according to the position or angle of the material to be mounted, thereby greatly simplifying the working mode of the material taking system 4, reducing the material taking time and improving the mounting efficiency. Moreover, after the material to be pasted which is preliminarily positioned is carried to the pasting object stage 5 or above the pasting object stage 5 by the material taking system 4, the material to be pasted is preliminarily positioned by the rough positioning mechanism 1, and the accurate alignment of the material to be pasted can be completed only by fine adjustment of the fine adjustment movement system 6, so that the time for accurately aligning the material to be pasted on the pasting mechanism is greatly saved, and the pasting efficiency is effectively improved. On the other hand, the visual feedback system is matched to conduct coarse adjustment and fine adjustment alignment on the materials, and the mounting precision is effectively improved. The time for a single material mounting process is less than or equal to 45 seconds, and the mounting precision is less than or equal to +/-3 microns.
specifically, with continued reference to fig. 1, the work table 3 includes a table top disposed along a horizontal direction, the table top is preferably made of marble, and a mounting portion is fixed on the table top, and the mounting portion includes a vertical plate 31 extending along a vertical direction and a cross beam 32 disposed at an end of the vertical plate 31 and extending along the horizontal direction. The bottom of the workbench 3 is also provided with a damping column 8, and the damping column 8 is a four-point support type air flotation damping column 8 and is used for damping and cushioning.
The coarse positioning mechanism 1 is arranged on the workbench 3, wherein the coarse movement system 12 is arranged on the table top, the material tray bearing table 11 is arranged on the coarse movement system 12, and the coarse adjustment visual feedback system 13 is arranged on the cross beam 32 and is positioned above the material tray bearing table 11. In addition, the mounting mechanism is also arranged on the workbench 3, specifically, the material taking system 4 and the fine adjustment movement system 6 are arranged on the table surface, the mounting object table 5 is arranged on the fine adjustment movement system 6, and the fine adjustment visual feedback system 7 is arranged on the cross beam 32 and is positioned above the mounting object table 5.
The take-out system 4 moves between the tray stage 11 and the mounting stage 5. In the present embodiment, the automatic chip mounter includes two sets of coarse positioning mechanisms 1 and 1 ', wherein one set of coarse positioning mechanism 1 is used for preliminary positioning of the silicon substrate 14, and the other set of coarse positioning mechanism 1 ' is used for preliminary positioning of the chip substrate 14 '. In other words, the automatic placement device includes the tray stage 11 of the silicon substrate 14 and the tray stage 11 ' of the chip substrate 14 ', and correspondingly, the placement device also includes the material taking system 4 of the silicon substrate 14 and the material taking system 4 of the chip substrate 14 '. For the sake of convenience of distinction, the coarse positioning mechanism 1 of the silicon substrate 14 is defined as a first coarse positioning mechanism 1, and the coarse positioning mechanism 1 of the chip substrate 14 'is defined as a second coarse positioning mechanism 1'. Correspondingly, the corresponding material taking systems 4 are respectively a first material taking system 4 and a second material taking system 4 ', the material tray bearing tables 11 are respectively a first material tray bearing table 11 and a second material tray bearing table 11', and so on. Of course, the definitions of "first" and "second" are only used to distinguish two sets of similar mechanisms, and do not constitute other limitations.
The arrangement of the two sets of coarse positioning mechanisms 1 and 1 'ensures that the positions and angles of the silicon substrate 14 and the chip substrate 14' are adjusted through preliminary positioning before mounting, is beneficial to directly finishing mounting through accurate alignment when the silicon substrate and the chip substrate are mounted, and avoids the situation that the silicon substrate and the chip substrate need to be subjected to repeated coarse adjustment and fine adjustment due to more position deviation when the silicon substrate and the chip substrate are mounted. Of course, in other embodiments, only one set of coarse positioning mechanism 1, such as the coarse positioning mechanism 1 of the chip substrate 14', may be provided, and the silicon substrate 14 may be provided on the mounting stage 5, or vice versa.
In both the coarse movement system 12 and the fine movement system 6, the position of the tray loading platform 11 or the mounting platform 5 thereof needs to be adjusted according to the feedback information of the visual feedback system. Specifically, the visual feedback system comprises a camera, a lens and a camera fixing seat, wherein the lens is arranged in the camera, the camera is arranged on the camera fixing seat, and the camera fixing seat is fixed on the cross beam 32.
in the present embodiment, a bracket 320 is connected to the end of the cross beam 32, and the bracket 320 is arranged in a right triangle and includes two right-angled sides. The camera fixing seats of the first coarse visual feedback system 13 and the second coarse visual feedback system 13' are respectively arranged on two right-angle sides of the support 320, and the camera fixing seat of the fine visual feedback system 7 is arranged at the end of the cross beam 32, in other words, the fine visual feedback system 7 is arranged at the intersection of the two right-angle sides. Thus, the line connecting the fine visual feedback system 7 and the second coarse visual feedback system 13' is perpendicular to the line connecting the fine visual feedback system 7 and the first coarse visual feedback system 13.
Referring to fig. 2 and 3, fig. 2 shows a first coarse positioning mechanism 1 and its material taking system 4, fig. 3 shows a second coarse positioning mechanism 1 ' and its material taking system 4 ', since the second coarse positioning mechanism 1 ' and the first coarse positioning mechanism 1 have substantially the same structure, the coarse movement system 12 will be described by taking the first coarse positioning mechanism 1 as an example.
As shown in FIG. 2, coarse motion system 12 includes a linear slide module 120 and a rotational alignment module 122; the tray bearing table 11, the linear sliding module 120 and the rotary alignment module 122 are sequentially stacked from top to bottom; the linear sliding module 120 drives the tray bearing table 11 to move in a plane parallel to the table surface of the workbench 3, and the position of the material to be mounted on the tray bearing table 11 is preliminarily adjusted; the rotation alignment module 122 is disposed on the worktable 3, and drives the linear sliding module 120 and the tray carrying platform 11 to rotate in a plane parallel to the table surface of the worktable 3, so as to preliminarily adjust the angle of the material to be mounted on the tray carrying platform 11. The linear sliding module 120 and the rotary alignment module 122 are arranged to facilitate the translation and rotation of the tray bearing table 11, so that the material to be mounted on the tray bearing table 11 is initially adjusted to the center of the view field of the coarse adjustment visual feedback system 13, and the material taking operation of the material taking system 4 is facilitated. Wherein, the center of the field of view of the coarse tuning visual feedback system 13 is the center of the field of view of the coarse tuning camera lens.
preferably, the rotation axis of the rotational alignment module 122 is on the same axis with the center of the field of view of the coarse visual feedback system 13. In other words, the rotation axis of the rotation alignment module 122 is on the same axis as the center of the field of view of the coarse camera lens, so that the angle of the material to be placed on the tray bearing table 11 can be adjusted conveniently, and the initial positioning efficiency can be improved.
Specifically, the rotary alignment module 122 includes a motor (not shown) and a rotary alignment structure (not shown), and the motor drives the rotary alignment structure according to the feedback information of the coarse tuning visual feedback system 13, so as to drive the linear sliding module 120 and the tray carrying platform 11 to rotate in a plane parallel to the top of the worktable 3.
In addition, the linear sliding module 120 includes two linear sliding table structures 121, sliding directions of the two linear sliding table structures 121 are perpendicular to each other in a plane perpendicular to the rotation axis, and a motor (not shown) for driving the two linear sliding table structures 121 respectively. According to the feedback information of the coarse tuning visual feedback system 13, one of the motors drives the linear sliding table structure 121, so that the tray bearing table 11 translates along the extending direction of the linear sliding table structure 121; or, after one of the linear sliding table structures 121 drives the tray carrying table 11 to translate, the other linear sliding table structure 121 further translates the tray carrying table 11 along a direction perpendicular to the previous translation direction as required.
With reference to fig. 2, specifically, one or more silicon substrates 14 are placed in a first tray 15 on the first tray bearing table 11, after the first material taking system 4 takes away the silicon substrates 14 to be mounted, which have been preliminarily positioned, the first coarse tuning motion system 12 immediately adjusts the position of the first tray bearing table 11 according to the feedback information of the first coarse tuning visual feedback system 13, preliminarily positions the next silicon substrate 14 to be mounted, and adjusts the position to a predetermined position and angle, for example, finally, the silicon substrate 14 is positioned in the center of the field of view of the first coarse tuning visual feedback system 13, thereby facilitating further operation of the first material taking system 4, simplifying the working mode of the first material taking system 4, reducing material taking time, and effectively improving material taking efficiency.
Referring to fig. 3 again, a second tray 15 ' is placed on the second tray bearing table 11 ', a plurality of chip substrates 14 ' are arranged in the second tray 15 ', and the second coarse adjustment movement system 12 ' is arranged to enable each chip substrate 14 ' on the second tray 15 ' to be moved to the center of the field of view of the second coarse adjustment visual feedback system, namely the center of the field of view of the camera lens of the second visual feedback system, from the initial position in advance when the chip substrate 14 ' is used as a material to be mounted, so as to facilitate further operation of the second material taking system 4 '.
with continued reference to fig. 2 and 3, corresponding to the second rough positioning mechanism 1 ' and the first rough positioning mechanism 1, the automatic placement device further includes a first material taking system 4 and a second material taking system 4 ', wherein the first material taking system 4 is configured to transport the preliminarily positioned silicon substrate 14 from the first tray carrying table 11 to the placement stage 5, and the second material taking system 4 ' is configured to transport the preliminarily positioned chip substrate 14 ' from the second tray carrying table 11 ' to the position above the placement stage 5 and below the fine-tuning visual feedback system 7.
Continuing with the example of the first reclaiming system 4 in fig. 2, the reclaiming system 4 includes a reclaiming arm set 41 and a reclaiming sliding set 42; the material taking sliding group 42 drives the material taking arm group 41 to slide between the mounting object table 5 and the material tray bearing table 11, and the material roughly aligned on the material tray bearing table 11 is conveyed to the mounting object table 5, or the material above the mounting object table 5 and below the fine adjustment visual feedback system 7.
Further, the material taking sliding group 42 includes a horizontal sliding group and a vertical sliding group; the take-out arm assembly 41 includes a slide 410 mounted on the vertical slide assembly, a stress sensor 412 '(see fig. 3) mounted on the slide 410, and a take-out nozzle 411 mounted below the stress sensor 412'. The material taking arm set 41 moves in the vertical direction under the driving of the vertical sliding set of the material taking sliding set 42 and moves in the horizontal direction under the driving of the horizontal sliding set of the material taking sliding set 42, so as to suck the material to be mounted on the tray bearing table 11 through the material taking suction nozzle 411 and convey the material to be mounted onto the mounting object table 5 or above the mounting object table 5. The stress sensor 412 ″ arranged on the material taking arm set 41 can detect and feed back pressure in real time, and when the material taking nozzle 411 is pressed to a material, the device is informed to start vacuum negative pressure to tightly suck the material, so that the defect that the material to be pasted is damaged when the pressure is too high or the material taking nozzle 411 leaks due to too low pressure caused by incapability of sensing the pressure is overcome.
Referring to fig. 3, the visual feedback system further includes a light source (not shown), the second material taking suction nozzle 411 'includes a light hole (not shown), the second coarse adjustment visual feedback system 13' penetrates through the light hole to turn on the light source for image pickup, so as to facilitate accurate suction of the chip on the chip substrate 14 'through the second material taking suction nozzle 411'. In this embodiment, the first material taking nozzle 411 is not provided with a light hole, but in a modified embodiment, the first material taking nozzle 411 may also be provided with a light hole.
to sum up, the first coarse positioning mechanism 1 comprises a first tray bearing table 11, a first coarse movement system 12 and a first coarse visual feedback system 13, and the second coarse positioning mechanism 1 'comprises a second tray bearing table 11', a second coarse movement system 12 'and a second coarse visual feedback system 13'; the first tray bearing table 11 is used for containing a tray 15 filled with a first material, and the second tray bearing table 11 'is used for containing a tray 15' filled with a second material; the first rough motion system 12 and the first rough visual feedback system 13 are matched with each other to realize the primary positioning of the first material to be pasted on the first tray bearing table 11; the second coarse movement system 12 ' and the second coarse visual feedback system 13 ' are matched with each other to realize the primary positioning of the second material to be pasted on the second tray bearing table 11 '.
Corresponding to the first coarse positioning mechanism 1 and the second coarse positioning mechanism 1 ', the material taking system 4 comprises a first material taking system 4 and a second material taking system 4 ', wherein the first material taking system 4 comprises a first material taking arm group 41 and a first material taking sliding group 42, and the second material taking system 4 ' comprises a second material taking arm group 41 ' and a second material taking sliding group 42 '; the first material taking sliding group 42 drives the first material taking arm group 41 to slide between the mounting objective table 5 and the first material tray bearing table 11, and the first material roughly aligned on the first material tray bearing table 11 is conveyed to the mounting objective table 5; the second material taking sliding group 42 'drives the second material taking arm group 41' to slide between the mounting object table 5 and the second material tray bearing table 11 ', and transports the second material roughly aligned on the second material tray bearing table 11' to the position above the mounting object table 5 and below the fine adjustment visual feedback system 7.
Referring to fig. 1 and 4, after the initial positioning, the first material taking arm group 41 is driven by the first material taking sliding group 42 to move in the first horizontal direction and the vertical direction, so as to suck the silicon substrate 14 on the tray carrying table 11 through the first material taking suction nozzle 411 and convey the silicon substrate 14 onto the mounting stage 5. In addition, the second material taking arm group 41 ' is driven by the second material taking sliding group 42 ' to move along the second horizontal direction and the vertical direction, so as to suck the chip substrate 14 ' on the tray bearing table 11 through the second material taking suction nozzle 411 ', and convey the chip substrate 14 ' to the position above the mounting stage 5 and below the fine adjustment visual feedback system 7. Since the connection line of the fine visual feedback system 7 and the second coarse visual feedback system 13 'is perpendicular to the connection line of the fine visual feedback system 7 and the first coarse visual feedback system 13, and the chip substrate 14' and the silicon substrate 14 are respectively positioned at the center of the visual field of the corresponding coarse visual feedback system 13 after coarse positioning, the first horizontal sliding group and the second horizontal sliding group are arranged perpendicular to each other. Of course, the arrangement of the first material taking system 4 and the second material taking system 4' may be in other forms in consideration of the balance of the table 3, which will not be illustrated here.
The invention also provides an automatic chip mounting method, which is applied to an automatic chip mounting device and comprises the following steps: primary positioning: the rough positioning mechanism 1 respectively carries out preliminary positioning on a chip substrate 14' to be mounted and a silicon substrate 14; taking materials: the material taking system 4 respectively conveys the silicon substrate 14 roughly aligned to the mounting object stage 5, and sucks the chip substrate 14' to the position above the silicon substrate 14 placed on the mounting object stage 5 and below the fine adjustment visual feedback system 7; fine adjustment: keeping the position and the direction of the chip substrate 14 ' still, providing feedback of the position of the silicon substrate 14 and the relative position between the silicon substrate 14 and the chip substrate 14 ' by the fine adjustment visual feedback system 7, and controlling the fine adjustment movement system 6 to finely adjust the position and the angle of the silicon substrate 14 so as to accurately align the silicon substrate 14 and the chip substrate 14 '; mounting: the material taking system 4 presses down the chip substrate 14 'to mount the chip substrate 14' on the silicon substrate 14, thereby completing the mounting.
With continued reference to fig. 4, the fine adjustment movement system 6 includes a fine adjustment sliding table 61 and a fine adjustment rotating table 62; the fine adjustment sliding table 61 is mounted on the workbench 3, and the fine adjustment rotating table 62 is arranged on the fine adjustment sliding table 61; fine tuning slip table 61 drives fine tuning revolving stage 62 and subsides dress objective table 5 remove, fine tuning revolving stage 62 drives dress objective table 5 rotates, to place in material and the dress objective table 5 top on the dress objective table 5 it carries out the accurate counterpoint to get the material on the material module. Due to the special structure of the material taking suction nozzle 411, the fine adjustment visual feedback system 7 can acquire positions at different heights in real time in the mounting process, and offset is calculated by a background. The position of the silicon substrate 14 in the horizontal plane is corrected by the fine adjustment slide table 61, the angle between the silicon substrate 14 and the chip substrate 14' is adjusted by the fine adjustment rotary table 62, and the silicon substrate 14 is aligned with the reference position on the chip by the cooperation motion of the fine adjustment slide table 61 and the fine adjustment rotary table 62. Preferably, the fine adjustment sliding table 61 includes two linear fine adjustment sliding table structures with sliding directions perpendicular to each other.
In summary, the automatic placement device provided by the invention is provided with the coarse positioning mechanism 1, so that on one hand, the materials to be placed are preliminarily positioned in advance, and the efficiency of fine adjustment and alignment of the placement mechanism on the materials to be placed is improved; on the other hand, when the mounting mechanism carries out material fine adjustment and mounting work, the coarse positioning mechanism can carry out coarse adjustment alignment on the next material to be mounted, and the two work in cooperation, so that the production efficiency and the mounting precision are greatly improved; the visual feedback system is matched to conduct coarse adjustment and fine adjustment alignment on the materials, and the mounting precision is effectively improved.
Specifically, for example, through mutual matching of the coarse positioning mechanism, the fine adjustment movement system 6 and the visual feedback systems (13, 13', 7), a closed loop system capable of automatically adjusting the position is formed in the mounting process, and the mounting precision is effectively improved. Moreover, before material taking, the chip substrate 14' and the silicon substrate 14 are respectively roughly positioned, and then material taking and mounting are carried out, so that the efficiency is improved, and the adjusting time during mounting is shortened; the position adjusting process keeps the mounted product (such as the chip substrate 14') moving only in the vertical direction, the horizontal position is unchanged, the vertical direction of the silicon substrate 14 is kept fixed, and the mounting method only adjusts the position and the angle of the silicon substrate 14 to approach the final position can reduce a large amount of time for repeatedly adjusting alignment and effectively improve the mounting efficiency. Through tests, the total time of mounting each time is less than or equal to 45 seconds, and the mounting precision is less than or equal to +/-3 microns, and the method makes obvious progress compared with the prior art.
it should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. An automated patch device, comprising:
a work table;
The coarse positioning mechanism is arranged on the workbench and comprises a material tray bearing table, a coarse movement system and a coarse visual feedback system; the rough adjusting motion system adjusts the position of the tray bearing table according to the feedback information of the rough adjusting visual feedback system, and performs primary positioning on the material to be pasted on the tray bearing table;
the mounting mechanism is arranged on the workbench and comprises a mounting objective table, a material taking system, a fine adjustment motion system and a fine adjustment visual feedback system; the material taking system is used for carrying the materials to be mounted which are preliminarily positioned on the tray bearing table to the mounting object table or above the mounting object table; and the fine adjustment motion system adjusts the position of the mounting object stage according to the feedback information of the fine adjustment visual feedback system, and the material to be mounted is accurately aligned.
2. An automated patch device according to claim 1, wherein: the coarse movement system comprises a linear sliding module and a rotary alignment module; the linear sliding module drives the material tray bearing table to move in a plane parallel to the table surface of the working table, and the position of a material to be pasted on the material tray bearing table is preliminarily adjusted; the rotary alignment module is arranged on the workbench and drives the linear sliding module and the material tray bearing table to rotate in a plane parallel to the workbench surface, and the angle of the material to be pasted on the material tray bearing table is preliminarily adjusted.
3. an automated patch device according to claim 2, wherein: and the rotating shaft of the rotating alignment module and the center of the visual field of the coarse tuning visual feedback system are on the same axis.
4. An automated patch device according to claim 3, wherein: the linear sliding module comprises two linear sliding table structures, and the sliding directions of the two linear sliding table structures are perpendicular to each other in a plane perpendicular to the rotating shaft.
5. An automated patch device according to claim 1, wherein: the material taking system comprises a material taking arm group and a material taking sliding group; the material taking sliding group drives the material taking arm group to slide between the surface mounting object stage and the material disc bearing stage, and materials which are roughly adjusted and aligned on the material disc bearing stage are conveyed to the surface mounting object stage or above the surface mounting object stage.
6. an automated patch device according to claim 5, wherein: the material taking sliding group comprises a horizontal sliding group and a vertical sliding group; the material taking arm set comprises a sliding block arranged on the vertical sliding set, a stress sensor arranged on the sliding block and a material taking suction nozzle arranged below the stress sensor.
7. An automated patch device according to claim 1, wherein: the coarse positioning mechanism comprises a first material tray bearing table, a first coarse movement system, a first coarse visual feedback system, a second material tray bearing table, a second coarse movement system and a second coarse visual feedback system;
The first tray bearing table is used for containing a tray filled with a first material, and the second tray bearing table is used for containing a tray filled with a second material;
The first rough adjusting movement system is matched with the first rough adjusting visual feedback system to realize the primary positioning of the first material to be pasted on the first material tray bearing table;
the second rough adjusting movement system is matched with the second rough adjusting visual feedback system to realize the primary positioning of a second material to be pasted on the second material tray bearing table;
The material taking system comprises a first material taking arm group, a first material taking sliding group, a second material taking arm group and a second material taking sliding group;
The first material taking sliding group drives the first material taking arm group to slide between the mounting objective table and the first material disc bearing table, and the first material which is roughly adjusted and aligned on the first material disc bearing table is conveyed to the mounting objective table;
The second material taking sliding group drives the second material taking arm group to slide between the surface mounting object table and the second material disc bearing table, and the second material which is roughly aligned on the second material disc bearing table is conveyed to the position above the surface mounting object table.
8. An automated patch device according to claim 1, wherein: the fine adjustment movement system comprises a fine adjustment sliding table and a fine adjustment rotating table; the fine adjustment sliding table is arranged on the workbench, and the fine adjustment rotating table is arranged on the fine adjustment sliding table; the fine tuning slip table drives fine tuning revolving stage and subsides dress objective table and removes, the fine tuning revolving stage drives the dress objective table rotates, to locate in material and the dress objective table top on the dress objective table material on the material taking module carries out the accurate counterpoint.
9. an automated patch device according to claim 8, wherein: the fine adjustment sliding table comprises two linear fine adjustment sliding table structures with mutually vertical sliding directions.
10. an automatic pasting method, comprising:
Providing an automated patch device according to any one of claims 1-9;
primary positioning: the coarse positioning mechanism is used for performing preliminary positioning on a chip substrate and a silicon substrate to be pasted respectively;
Taking materials: the material taking system respectively conveys the silicon substrate roughly aligned to the mounting objective table and sucks the chip substrate to the position above the silicon substrate placed on the mounting objective table;
fine adjustment: keeping the position and the direction of the chip substrate still, providing feedback of the position of the silicon substrate and the relative position between the silicon substrate and the chip substrate by the fine adjustment visual feedback system, and controlling the fine adjustment movement system to finely adjust the position and the angle of the silicon substrate so as to accurately align the silicon substrate and the chip substrate;
Mounting: and the material taking system presses the chip substrate downwards to mount the chip substrate on the silicon substrate to finish mounting.
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| CN201810581883.8A CN110582171B (en) | 2018-06-07 | 2018-06-07 | Automatic chip mounting device and automatic chip mounting method |
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| CN201810581883.8A CN110582171B (en) | 2018-06-07 | 2018-06-07 | Automatic chip mounting device and automatic chip mounting method |
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| CN110582171A true CN110582171A (en) | 2019-12-17 |
| CN110582171B CN110582171B (en) | 2021-11-16 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111027340A (en) * | 2019-12-20 | 2020-04-17 | 苏州精濑光电有限公司 | Code reading mechanism of centering alignment panel |
| CN111935970A (en) * | 2020-09-09 | 2020-11-13 | 苏州鼎纳自动化技术有限公司 | Mounting mechanism for tiny components on complex product |
| CN112802788A (en) * | 2020-12-28 | 2021-05-14 | 西南技术物理研究所 | High-precision chip positioning device |
| CN113035745A (en) * | 2021-02-25 | 2021-06-25 | 东莞普莱信智能技术有限公司 | Chip mounting device |
| CN113828492A (en) * | 2020-06-24 | 2021-12-24 | 中国科学院化学研究所 | Continuous coating system and coating method |
| CN114291577A (en) * | 2022-01-21 | 2022-04-08 | 上海卫星装备研究所 | Reflective optical solar reflector plate cloth pasting equipment |
| CN114828445A (en) * | 2022-05-24 | 2022-07-29 | 苏州创阈星智能科技有限公司 | Mounting equipment |
| CN115373100A (en) * | 2022-08-23 | 2022-11-22 | 珠海光翊智能科技有限公司 | Manual mounting equipment for micro-optical device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5235407A (en) * | 1990-08-27 | 1993-08-10 | Sierra Research And Technology, Inc. | System for placement and mounting of fine pitch integrated circuit devices |
| CN1151101A (en) * | 1994-12-28 | 1997-06-04 | 大宇电子株式会社 | Process for compensating for position of camera in chip mount system and process for mounting chips using compensation method |
| KR20090080223A (en) * | 2008-01-21 | 2009-07-24 | 삼성전자주식회사 | Surface mount technology system |
| CN105120608A (en) * | 2015-08-31 | 2015-12-02 | 东莞市沃德精密机械有限公司 | Full-automatic surface-mounting machine electrically connected with controller |
| CN106112509A (en) * | 2016-07-18 | 2016-11-16 | 昆山允升吉光电科技有限公司 | A kind of full-automatic assemble method of SMT template |
| CN206212455U (en) * | 2016-12-08 | 2017-05-31 | 陈春雨 | A kind of feeding of chip mounter device |
| CN106824676A (en) * | 2017-01-25 | 2017-06-13 | 昆山希盟自动化科技有限公司 | Fingerprint recognition component point glue adhering machine |
| CN106864076A (en) * | 2017-01-20 | 2017-06-20 | 江门市金铭礼品包装材料有限公司 | A kind of automatic greeting card patch rig of vision positioning |
| CN107014291A (en) * | 2017-02-15 | 2017-08-04 | 南京航空航天大学 | A kind of vision positioning method of the accurate transfer platform of material |
| CN107404835A (en) * | 2017-08-24 | 2017-11-28 | 苏州猎奇智能设备有限公司 | A kind of automatic placement machine |
| CN107584263A (en) * | 2017-10-18 | 2018-01-16 | 上海文什数据科技有限公司 | A kind of vision positioning guide device and bootstrap technique |
-
2018
- 2018-06-07 CN CN201810581883.8A patent/CN110582171B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5235407A (en) * | 1990-08-27 | 1993-08-10 | Sierra Research And Technology, Inc. | System for placement and mounting of fine pitch integrated circuit devices |
| CN1151101A (en) * | 1994-12-28 | 1997-06-04 | 大宇电子株式会社 | Process for compensating for position of camera in chip mount system and process for mounting chips using compensation method |
| KR20090080223A (en) * | 2008-01-21 | 2009-07-24 | 삼성전자주식회사 | Surface mount technology system |
| CN105120608A (en) * | 2015-08-31 | 2015-12-02 | 东莞市沃德精密机械有限公司 | Full-automatic surface-mounting machine electrically connected with controller |
| CN106112509A (en) * | 2016-07-18 | 2016-11-16 | 昆山允升吉光电科技有限公司 | A kind of full-automatic assemble method of SMT template |
| CN206212455U (en) * | 2016-12-08 | 2017-05-31 | 陈春雨 | A kind of feeding of chip mounter device |
| CN106864076A (en) * | 2017-01-20 | 2017-06-20 | 江门市金铭礼品包装材料有限公司 | A kind of automatic greeting card patch rig of vision positioning |
| CN106824676A (en) * | 2017-01-25 | 2017-06-13 | 昆山希盟自动化科技有限公司 | Fingerprint recognition component point glue adhering machine |
| CN107014291A (en) * | 2017-02-15 | 2017-08-04 | 南京航空航天大学 | A kind of vision positioning method of the accurate transfer platform of material |
| CN107404835A (en) * | 2017-08-24 | 2017-11-28 | 苏州猎奇智能设备有限公司 | A kind of automatic placement machine |
| CN107584263A (en) * | 2017-10-18 | 2018-01-16 | 上海文什数据科技有限公司 | A kind of vision positioning guide device and bootstrap technique |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111027340A (en) * | 2019-12-20 | 2020-04-17 | 苏州精濑光电有限公司 | Code reading mechanism of centering alignment panel |
| CN113828492A (en) * | 2020-06-24 | 2021-12-24 | 中国科学院化学研究所 | Continuous coating system and coating method |
| CN111935970A (en) * | 2020-09-09 | 2020-11-13 | 苏州鼎纳自动化技术有限公司 | Mounting mechanism for tiny components on complex product |
| CN112802788A (en) * | 2020-12-28 | 2021-05-14 | 西南技术物理研究所 | High-precision chip positioning device |
| CN113035745A (en) * | 2021-02-25 | 2021-06-25 | 东莞普莱信智能技术有限公司 | Chip mounting device |
| CN113035745B (en) * | 2021-02-25 | 2022-03-18 | 东莞普莱信智能技术有限公司 | Chip mounting device |
| CN114291577A (en) * | 2022-01-21 | 2022-04-08 | 上海卫星装备研究所 | Reflective optical solar reflector plate cloth pasting equipment |
| CN114828445A (en) * | 2022-05-24 | 2022-07-29 | 苏州创阈星智能科技有限公司 | Mounting equipment |
| CN114828445B (en) * | 2022-05-24 | 2023-09-15 | 苏州创阈星智能科技有限公司 | Mounting equipment |
| CN115373100A (en) * | 2022-08-23 | 2022-11-22 | 珠海光翊智能科技有限公司 | Manual mounting equipment for micro-optical device |
| CN115373100B (en) * | 2022-08-23 | 2023-04-28 | 珠海光翊智能科技有限公司 | Manual mounting equipment for micro-optical device |
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