KR100806919B1 - In-line auto cog bonding m/c - Google Patents

Abstract

An inline automatic COG bonding apparatus is disclosed. Such an in-line automatic semiconductor bonding apparatus includes a loader in which glass is loaded, and automatically attaches an ACF on the glass supplied from the loading unit, centers the semiconductor chip, and forms the semiconductor chip on the glass by a rotary method. And an unloading unit comprising an main body unit for aligning and preliminary bonding, carrying out main bonding, and a conveyor for discharging the glass on which the semiconductor chip supplied from the main body is mounted to the outside. And a transfer unit provided between the loading unit, the main body unit, and the unloading unit to transfer chips to each section, and a control unit controlling the loading unit, the main body unit, and the unloading unit.

Bonding, Semiconductors, ACF, LCD, COG, Main, Loading, Unloading

Description

IN-LINE AUTO COG BONDING M / C}

1 is a perspective view showing the appearance of an IN LINE automatic COG bonding apparatus according to a preferred embodiment of the present invention.

FIG. 2 is a perspective view showing the internal structure of the IN LINE automatic COG bonding apparatus shown in FIG.

3 is a perspective view showing the ACF bonding portion of FIG.

FIG. 4 is a diagram schematically illustrating a process of cutting an ACF film by the cutter of the ACF bonding portion shown in FIG. 3.

FIG. 5 is a view showing a process of attaching an anisotropic conductive film (ACF) on glass by the ACF bonding portion shown in FIG.

6 is a perspective view showing a transfer for transferring the glass shown in FIG.

FIG. 7 is a partially enlarged view showing an enlarged portion "A" of FIG.

FIG. 8 is a perspective view illustrating the chip preliminary bonding portion of FIG. 7. FIG.

FIG. 9 is a detailed perspective view illustrating some of the chip preliminary bonding parts illustrated in FIG. 8.

10 is a perspective view showing in detail a rotary of the chip preliminary bonding portion shown in FIG.

FIG. 11 is a perspective view showing a chip supply unit of the COG method shown in FIG.

FIG. 12 is an enlarged view illustrating the chip inverting unit shown in FIG. 11 in an enlarged manner.

FIG. 13 is a side view schematically illustrating a process of supplying a chip from a chip supply unit illustrated in FIG. 7 to a chip preliminary bonding unit.

FIG. 14 is a plan view schematically illustrating a disposition relationship between a chip head and a vision unit provided in the rotary of the chip preliminary bonding unit illustrated in FIG. 8 to pick up a chip; FIG.

FIG. 15 is an enlarged perspective view showing the vision unit shown in FIG. 8; FIG.

FIG. 16 is a perspective view illustrating an FPC supply unit instead of a chip supply unit in a FOG operation as another COG device according to another embodiment.

FIG. 17 is a perspective view showing the main bonding part shown in FIG. 8; FIG.

The present invention relates to an in-line automatic COG bonding apparatus, and more particularly, to improve the structure, to automate the ACF attachment and chip or FPC bonding process, and to supply COG or FPC chip more efficiently An inline automatic COG bonding apparatus capable of bonding chips.

In general, in a COG bonding process, a chip on glass (COG) or film on glass (FOG) method attaches an anisotropic conductive film (ACF) to an electrode of a glass, arranges a semiconductor chip on the ACF, and applies an appropriate pressure. It is a method in which the bump and the LCD electrode are brought into contact with each other by applying pressure.

In this case, the ACF contains conductive particles, and when a predetermined pressure is applied, the insulating film is broken, and thus, electricity may be applied through the conductive particles.

The COG bonding method includes an ACF bonding process, a centering process, a preliminary bonding process of a semiconductor chip and glass, and a main bonding process.

However, this conventional COG bonding method has the following problems.

First, since ACF work and COG or FOG bonding work are performed on separate machines and each process of loading, bonding, and unloading is performed manually, bonding work may take a long time and work efficiency may decrease.

Second, in the case of the preliminary bonding head, since the preliminary bonding operation of the semiconductor chip and the glass is performed by one bonding head, it is difficult to perform the pattern recognition of the semiconductor chip or other tasks in parallel during the preliminary bonding operation.

Third, during the preliminary bonding operation, each chip is recognized by the semiconductor chip and the LCD by one camera, and thus, the pattern recognition time is increased, resulting in a long tack time, thereby decreasing productivity.

Fourth, in the case of centering the semiconductor chip, the chip is picked up by a pneumatic cylinder or a motor to be centered. In this case, the chip may collide with the centering jig by the driving force of the cylinder or the motor, and the edge may be broken, resulting in a defective chip.

Fifth, when the glass is loaded, it is transported by the flat conveyor belt, so that dust or foreign matter on the conveyor belt may adhere to the glass and cause defects.

Sixth, since the position of the bonding head is fixed at the time of main bonding, the spacing between the chips is limited when bonding a plurality of semiconductor chips.

Seventh, if it is necessary to reverse the direction of the chip seated on the chip tray because the operation to transfer to another chip tray is carried out manually, defects such as chip detachment and foreign matter attached to the chip may occur in this process.

Eighth, the pattern aligning mark during the pattern aligning operation of the semiconductor chip and the glass is not clear as two colors of black and white, and the matching ratio of the aligning mark M1 is lowered, resulting in poor pattern aligning.

Ninth, since only one semiconductor chip is attached onto the glass in one operation, productivity is low and bonding efficiency is lowered.

Tenth, in order to improve the flatness during the ACF bonding work, a rubber sheet is attached directly under the head, but it takes a long time to replace the rubber sheet.

Eleventh, although COG bonding work and FOG bonding work are similar processes in chip supplying method, it is necessary to equip separate equipment in a completely separate production line, which requires a lot of equipment investment cost, increase of equipment repair cost, and additional manpower. do.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor chip by automating a COG bonding process consisting of loading, ACF attachment, bonding, and unloading by sequencing an ACF process and a COG bonding process. It is to provide a COG bonding apparatus that can bond to glass more efficiently and efficiently.

Another object of the present invention is to provide a COG bonding apparatus capable of simultaneously working by a plurality of chip heads by applying a rotary index method to a preliminary bonding unit, thereby reducing tack time.

Another object of the present invention is to provide a COG bonding apparatus capable of maximizing the productivity of the COG bonding operation by separating and recognizing the LCD panel and the chip with each camera in order to reduce the time required for each process.

It is still another object of the present invention to provide a COG bonding apparatus capable of precisely centering and preventing chip breakage by automating the chip centering process in an image recognition manner rather than in a mechanical manner.

Still another object of the present invention is to provide a COG bonding apparatus capable of preventing contamination by minimizing the contact area between the glass and the conveyor belt by applying a conveyor having a split variable width control conveyor for loading the glass.

Still another object of the present invention is to provide a COG bonding apparatus capable of improving the mark recognition rate by preventing the misrecognition of the pattern by improving the shape of the aligning mark M1.

Still another object of the present invention is to apply the chip to the automatic chip inversion device by the driving motor can supply the chip in the inverted or electrostatic state regardless of the position of the chip bump (BUMP Surface) surface work during contamination and manual reversal of the chip The present invention provides a semiconductor bonding apparatus that can reduce chip loss caused by mistakes.

Still another object of the present invention is to provide a COG bonding apparatus capable of minimizing replacement time by changing a method of replacing a rubber sheet for improving flatness during ACF bonding.

It is still another object of the present invention to provide a COG bonding apparatus capable of coping with a variety of small quantity production systems by allowing a variety of varieties to be converted in a short time from a FOG bonding operation in a COG bonding operation or a COG bonding operation in a FOG bonding operation.

In order to realize the object of the present invention, the present invention is a loading unit (Loader) is loaded glass; ACF is automatically attached onto the glass supplied from the loading unit, the semiconductor chip is centered, the semiconductor chip is supplied onto the glass by a rotary method, aligned, prebonded, and main bonding is performed. Main body; An unloading unit (Un-Loader) comprising a conveyor for discharging the glass on which the semiconductor chip supplied from the main body is mounted to the outside; A transfer unit provided between the loading unit, the main body unit, and the unloading unit to transfer chips to each section; And it provides a semiconductor chip bonding apparatus including a control unit for controlling the loading unit, the main body unit, the unloading unit.

Hereinafter, a structure of a semiconductor bonding apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a semiconductor bonding apparatus according to a preferred embodiment of the present invention, FIG. 2 is a structural diagram showing its internal structure, and FIG. 3 is a perspective view showing a loading portion.

As illustrated, the semiconductor bonding apparatus includes a case (Case) 1 and a loading unit (Loader) 3 provided on one side of the case 1 to load an LCD panel L (hereinafter, referred to as “glass”) by a conveyor method. And a main body portion 5 in which the ACF automatic attachment process and the bonding process of the semiconductor chip are performed on the glass supplied from the loading portion 3, and the glass L supplied from the main body portion 5 by a conveyor method. It consists of an unloader 7 for discharging to the outside, and a control unit 9 for controlling the loading unit 3, the main body 5, and the unloading unit 7.

In addition, a transfer 22 is provided between the loading part 3, the main body part 5, and the unloading part 7 to transfer the chip C by operating at a constant pitch.

In the COG bonding apparatus having such a structure, the loading part 3 includes a two-part width variable conveyor.

That is, the conveyor is supported by a drive motor 11, a plurality of rotary shafts 12 connected to the drive motor 11, and the rotary shaft 12, and consists of two parts of glass (L) at the top thereof. It includes a belt 13 is seated.

The belt 13 may be composed of two parts, and may be attached to both sides of the rotating shaft 12 of the conveyor to supply the glass L necessary for COG bonding to the main body 5. In addition, the two-piece belt 13 applies a conventionally known variable type that can adjust its spacing if necessary.

Therefore, the glass L supplied by the loading part 3 can minimize the contact area with the belt 13, thereby reducing the defect rate by reducing the adhesion of foreign matter.

In this way, the glass L is loaded by the loading unit 3, picked up by the suction method by the first transfer arm T1 (Fig. 6) of the transfer 22 (Fig. 6), and the main body part 5 By supplying to the post-process may proceed.

The main body portion 5 includes an ACF bonding portion 17 for automatically attaching an anisotropic conductive film onto glass L, preferably glass, and a semiconductor chip C on glass L to which ACF is attached. Pre Bonding Portion 19 which is pre-mounted by a rotary method, and Main Bonding which finally mounts the semiconductor chip C on the glass L supplied from the preliminary bonding unit 19. Portion; 21).

In the main body portion having such a structure, the ACF bonding portion 17 is shown in more detail in Figs.

That is, the ACF bonding unit 17 includes a frame 21, a pair of heads 26a and 26b provided at one side of the frame 21 and capable of vertically reciprocating movement, and a pair of heads A pair of reels 28 are provided at adjacent side positions 26a and 26b for winding an ACF required for bonding, and the glass L is transferred to the pair of heads 26a and 26b. It is made of a conveying member (30).

At this time, the lower portion of the head (26a, 26b) is provided with a cutter 40 for cutting the ACF.

That is, when the cutter 40 has a structure capable of moving up and down, the cutter 40 contacts the bottom surface of the stopper 41 and forms cutting cuts on the ACF surface positioned therebetween.

In addition, the transfer member 30 allows the ACF to be attached by placing the glass L on the loading base 32 and moving in the head direction.

The conveying member 30 is mounted on an X-axis conveying unit X that is movable in the X-axis direction, a Y-axis conveying unit Y that is movable in the Y-axis direction, and mounted on an upper surface of the Y-axis conveying unit Y, and is vacuum It consists of the mounting base 32 which fixes the glass L to the upper surface by a suction method.

The X-axis feeder (X) and the Y-axis feeder (Y) are respectively connected to the servo motor can be moved properly when driving the servo motor.

Therefore, when the servomotors are driven, the X-axis feeder X and the Y-axis feeder Y move properly so that the glass L seated on the loading base 32 is moved or detached in the head direction.

In the case of attaching the ACF on the glass L by the ACF bonding portion 17, as shown in Figs. 4 and 5, first, the ACF wound on the pair of rolls 28 (Fig. 3) is intermediate. It is arrange | positioned across the cutter 40 and the stopper 41 via the roll r.

In this state, the cutter 40 is raised to press the ACF to the bottom surface of the stopper 41 to form cutting scratches on the bottom surface of the ACF. In this case, since the ACF has a structure attached to the protective film (not shown) so as to be detachable, a cut scratch is formed only on the surface of the ACF, and the cut film is not formed on the protective film.

In this state, the loading stand 32 of the transfer member 30 moves in the Y-axis direction to the lower end of the pair of heads 26a and 26b so that the glass L is lower than the heads 26a and 26b. It is located at. At this time, the cutter 40 and the stopper 41 also move together in the Y-axis direction.

Therefore, the glass L seated on the loading stand 32 is positioned under the heads 26a and 26b, and in this state, the heads 26a and 26b are lowered so that the lower end 25 of the glass 25 is protected. Only the ACF on the image is pressed to compress the predetermined position of the glass L, that is, the electrode unit.

At this time, since the ACF is already formed by the cutter 40, the cut may be easily separated and attached to the glass (L).

Then, the lower end portions 25 of the pair of heads 26a and 26b are attached to the glass L by transferring heat of a predetermined temperature to the ACF.

At this time, one side of the head 26a, as shown in Figure 5, is provided with a seating table 33, the rubber plate 39 is disposed below the seating table 33, the rubber plate 39 is Have adequate elastic force.

Therefore, when the glass L is arrange | positioned at the lower surface of this rubber plate 39, and the bottom face of the rubber plate 39 pressurizes the ACF of glass L by the head 26a descend | falling, the rubber plate 39 will respond to elastic force. As a result, the flatness of the loading stand 32 may be compensated.

At this time, the rubber plate 39 may be fixed to the seating plate 33 by a magnetic detachable method. That is, since it is a magnet type, when the rubber plate 39 is attached to or detached from the seating plate 33, it is possible by a simple one-touch method.

As described above, after the attachment of the ACF to the glass L is completed, the glass L is picked up by the second transfer arm T2 (Fig. 6) and transferred to the preliminary bonding unit 19, thereby providing the semiconductor chip C. Is primarily bonded. In this case, since the first and second transfer arms T1 and T2 are driven at regular time intervals, the glass L may be supplied to the ACF bonding unit 17 or discharged from the ACF bonding unit 17, respectively. .

As shown in FIGS. 7 to 9, the preliminary bonding unit 19 applies a DD motor driving rotary index method to load the chip C, recognize the pattern coordinates of the chip C, and preliminary bonding. The work, the removal work of the defective chip (C) will proceed sequentially.

In more detail, the preliminary bonding unit 19 includes a frame 41, a DD motor-driven rotary 42 rotatably provided in the frame 41, and the rotary 42. The chip head 43 attached to the chip), the chip supply unit 20 sequentially supplying the semiconductor chip C to the chip head 43, and the glass L are transferred to the bonding position and frozen. The cut includes an alignment stage 45 and a vision unit 46 for recognizing alignment marks of the chip C and the glass L supplied to the preliminary bonding position.

In the preliminary bonding portion, the frame 41 supports the horizontal plate 47 having the rotary 42 and both ends of the horizontal plate 47, and moves the alignment stage 45 therebetween. It consists of a pair of legs 48 provided.

In addition, the horizontal plate 47 is provided with a rotary 42 rotating 360 degrees by a predetermined angle, preferably by 90 degrees, so that the chip C is supplied to the ACF to be preliminarily bonded.

The rotary 42 is a stepping motor 49 provided on an upper portion of the horizontal plate 47, a disc 50 connected to the stepping motor 49 and rotatable, and movable up and down on the disc 50. It includes a chip head 43 to pick up the chip (C) or to bond on the ACF.

In more detail, the disc 50 is connected to the stepping motor 49, so that the stepping motor 49 may be rotated 360 degrees by dividing by a predetermined angle when the stepping motor 49 is driven.

In addition, a plurality of chip heads 43 are provided at the edge of the disc 50 to pick up the chips C or to supply the chips C on the glass L. That is, the chip head 43 is provided with at least one, preferably four (H1, H2, H3, H4) on the disc 50, when the disc 50 rotates at an angle of 90 degrees, Each chip head 43 sequentially reaches the preliminary bonding position by rotating along the rotational trajectory of the disc 50.

In addition, the chip head 43 is a structure capable of lifting up and down along the Z-axis direction by the servo motor.

Accordingly, the chip head 43 is raised and lowered by the driving of the servomotor during chip pick-up or preliminary bonding.

Then, the semiconductor chip C is transferred by the chip supply unit 20 provided separately, and picked up by the chip head 43 and then preliminarily bonded onto the glass L.

11 to 13, the chip supply unit 20 is provided on the rear side of the preliminary bonding unit 19 to supply the chip (C).

The chip supply means 20 is a tray supply unit 57 for sequentially transporting a plurality of chip trays (not shown) transferred by the cassette lift 56, and transfers the chips C one by one from the tray supply unit 57. Pick-up of the chip holder 58, the inversion unit 59 for inverting the chip C transferred by the chip holder 58, and the chip C inverted by the inversion unit 59. And a chip centering portion 62 for positioning and centering the position.

In the chip supply means having such a structure, the cassette lift 60 has a structure capable of raising and lowering up and down, so that a plurality of chip trays (not shown), preferably 60 The trays are sequentially transported upwards.

That is, the cassette lift 60 descends and picks up the chip tray from the chip tray box (not shown) to raise.

In addition, the plurality of transferred chip trays may be separated by the tray supply unit 57 and transferred to each tray in the lateral direction so that the chip holders 58 may pick up.

As described above, the chip holder 58 sucks the chips C one by one by vacuum, moves them laterally a predetermined distance, and then transfers them to the inversion unit 59 to invert the chips at an angle of 180 degrees.

As shown in FIG. 12, the inverting unit 59 includes an inverting motor 64 and an inverting jig 65 connected to the inverting motor 64 to suck and invert the chip C on its upper surface. .

The reversing jig 65 is cylindrical in shape, and its upper surface 66 has a flat shape. In this flat top surface 66, a vacuum hole 67 is formed and connected to a vacuum apparatus (not shown).

Therefore, the chip C seated on the upper surface of the inversion jig 65 does not fall even when the inversion jig 65 is rotated halfway by being sucked by the vacuum hole 67.

In this way, the inverting jig 65 on which the chip is mounted reaches the position of the chip stage 62 by moving along the X-axis adjusting shaft 69.

When the inversion motor 64 is driven, the inversion jig 65 having reached the position of the chip stage 62 is inverted to freely drop the chip C and rest on the stage plate 68.

At this time, when the interval between the inverting jig 65 and the chip centering portion 62 is wide or narrow, the height is appropriately adjusted by the driving of the θ adjustment shaft 71.

Therefore, regardless of the position of the bump surface of the chip C, the chip C can be supplied to the chip centering part 62 in an inverted or electrostatic state, so that the operation of transferring the chip C is performed manually. It is possible to prevent the occurrence of defects such as foreign matter adhered to the chip (C) in the process.

As described above, when the chip C is seated on the chip centering unit 62, the chip centering unit 62 performs a chip centering process.

The chip centering unit 62 has a chip centering stage 68 for centering the chip C transferred from the reversing jig 65 at an accurate position, and an external shape of the chip C for centering the chip C. It includes a vision camera 72 to capture and align the chip (C).

In the chip centering unit having such a structure, the chip centering stage 68 is connected to the X, Y, θ control shaft (S1, S2, S3) driven by the servo motor to move to an appropriate position.

That is, when the chip (C) is seated on the chip centering stage 68, the X-axis adjusting axis (S1) proceeds to move the chip centering stage 68 a certain distance in the X-axis direction to the vision camera 72 do.

In this state, the chip centering vision camera 72 captures the external shape of the chip C and aligns the captured left and right external to be horizontal to each other. In this case, the vision camera 72 has a structure similar to the vision unit 46 described later.

Then, by appropriately operating the X, Y, θ axis adjusting axis (S1, S2, S3) of the chip centering stage 68, the center of the chip (C) is automatically centered by moving the chip centering stage (68) to the registered coordinates. Will be performed.

Therefore, it is possible to prevent the chip C from being broken due to mechanical external force during chip centering, and accurate chip centering can prevent the occurrence of bad chips and minimize the chip centering time. ) Is significantly shortened and productivity is high.

As described above, after the centering process for the chip is completed, the preliminary bonding operation is performed by being picked up by the chip head 43.

That is, as shown in FIGS. 13 and 14, when the chip C is seated on the chip centering portion 62, the disc 50 is rotated to move the first head H1 to the first position P1, namely, Move to the pickup position.

The first head H1, which has reached the pickup position, descends and picks up the chip by a suction method. When the chip is picked up by the first head H1, the disc 50 is rotated at an angle of 90 degrees so that the chip C reaches the second position P2 of the vision portion 46. At this time, the vision unit 46 is disposed at the second position P2 to recognize the alignment mark of the chip C. FIG.

Such a vision unit 46 is disposed at the second position P2 and is disposed at the first camera 73 and the third position P3 that recognize images of the alignment marks M1 of the crisscross shape of the chip C. FIG. And a second camera 74 arranged to recognize images of the alignment marks M2 of the cross shape of the glass L, respectively, and the first and second cameras 73 and 74 are the control unit 9; ), Preferably by connecting to a personal computer (PC) to process the image information.

15 will be described in more detail with reference to FIG. 15. Since the first and second cameras 73 and 74 have the same structure, the first camera will be described below.

The first camera 73 is provided with a pair of support shafts, a pair of cameras 75 respectively provided at the ends of the support shafts to recognize images of the semiconductor chip C and the LCD, and a pair of cameras 75. ) Is composed of an X-axis adjusting shaft 76 for moving in the X-axis direction, a Y-axis adjusting shaft 77 for moving in the Y-axis direction, and a Z-axis adjusting shaft 78 for moving in the Z-axis direction.

The first camera 73 having such a structure can move the first camera 73 to an appropriate position by controlling the X, Y, Z adjustment shafts 76, 77, 78 driven by the stepping motor.

At this time, the Z-axis adjusting shaft 78 to select the appropriate focus by reciprocating the first camera 73 up and down.

The first camera 73 is composed of two cameras, and as shown in FIG. 12, the alignment mark M1 of the chip C is recognized. The chip C is provided with an aligning mark M1 for aligning the pattern. The aligning mark M1 can be edited by the camera to obtain image information edited in two colors, black and white. . And the image information about the alignment mark M1 of the chip C1 is transmitted to a personal computer.

And the 2nd camera 74 is arrange | positioned in 3rd position P3, The image recognizes the aligning mark M2 of the glass conveyed to the preliminary bonding position by the alignment stage 45. As shown in FIG.

In this case, the second camera 74 is composed of two cameras, and the image information of the alignment mark M2 of the glass L recognized by the two cameras is transmitted to the personal computer.

As such, the image information transmitted from the first and second cameras 73 and 74 is processed by the personal computer to control the alignment stage 45 so that the chip C is preliminarily bonded to the correct position on the glass L. To be possible.

In more detail, the personal computer includes a built-in alignment of the alignment marks M1 and M2 of the chip C and the glass L transmitted by the first camera 73 and the second camera 74. Processing by the mark editing program makes it possible to recognize a more accurate position.

That is, the alignment mark editing program adjusts the resolution by editing the image in two colors, black and white, when the mark outline is not clear.

Therefore, the recognition rate of the aligning mark M1 can be improved by automatically removing unnecessary images around the aligning mark M1 of the semiconductor chip C. FIG.

In the case of the aligning mark M2 of the glass, the aligning operation is automatically performed by a program based on a distance away from the original mark by a predetermined distance.

On the other hand, as a result of image recognition, the chip C, which is determined to be defective, is picked up by the fourth head chip H4 of the disc 50 and moved to the fourth position P4, and is disposed at the fourth position P4. Can be removed by the defective chip tray collector.

As described above, the personal computer properly moves the alignment stage 45 by the processed image information so that the chip can be pre-bonded to the correct position on the LCD.

Referring again to FIG. 8, the alignment stage 45 includes an X-axis feeder 54 that can move in the X-axis direction, a Y-axis feeder 53 that can move in the Y-axis direction, and an X-axis feeder ( 54 is provided on the mounting table 51, the glass (L) is seated.

In the alignment stage having such a structure, the X-axis feeder 54 and the Y-axis feeder 53 preferably employ a cable chain method.

Therefore, when power is applied, the seating plate 51 can be moved to the correct position by appropriately moving the X-axis feeder 54 and the Y-axis feeder 53.

In this case, the seating stand 51 may be transported at least one glass (L) at the same time by having at least one, preferably four seating stand 51. Of course, the number of seating posts may vary depending on production capacity and product.

As described above, when the alignment stage 45 on which the glass L is seated reaches the home position by the control signal of the controller 9 (Fig. 1), the chip C is removed at the third position P3 (Fig. 14). The chip head 47 in the picked-up state is lowered to place the chip C on the glass L to perform preliminary bonding.

In more detail, the heating device of the chip head 47 heats the bonding tip to generate heat of a predetermined temperature, thereby thermally compressing the semiconductor chip C. At this time, the temperature of the heat is preferably about 60 degrees, the pressing time is 0.1-60 seconds.

Through this process, the semiconductor chip C may be preliminarily bonded onto the glass L. FIG.

In addition, during the preliminary bonding, the semiconductor chip C may be automatically aligned at the correct position of the glass L. This is due to the interaction between the vision unit 46 and the alignment stage 45. It is possible through the alignment work of C).

On the other hand, while the COG bonding method of receiving a chip from the chip supply unit has been described above, the present invention is not limited thereto. In another preferred embodiment, the FOG bonding method is also provided by receiving an FPC from the FPC supply unit instead of the chip supply unit. It is possible.

That is, as shown in FIG. 16, the FPC supply unit 80 supplies a frame 81 and an FPC tray lift 82 installed in the frame 81 to supply an FPC tray (not shown) on which the FPC is loaded. And a tray holder 83 for transporting the FPC trays one by one from the FPC tray lift 82, a tray supply unit 84 for extracting the FPC from the FPC tray and fixing the FPC tray at a predetermined position, and picking up and moving the FPC trays. The FPC holder 85, an alignment portion 86 for supplying the FPC to the preliminary bonding position, and a tray unloader 87 for returning the empty FPC tray used up of the FPC to the original position.

In the FPC supply unit having such a structure, the FPC tray lift 82 can be transported up and down on the frame 81 and the uppermost FPC after the FPC tray for working on the tray lift 82 in the lowered state is placed. The tray holder 83 raises the FPC tray lift 82 in order to pick up one tray.

The tray holder 83 includes a pair of conversion guides 88 and a pair of conversion guides 88 that are transportably mounted on a rail r disposed in the Y-axis direction on an upper portion of the frame 81. It is provided at the lower end of the jig J to pick up the FPC tray by vacuum.

The pair of conversion guides 88 has a structure in which each guide is arranged to be transported along the rail r so that each guide may be transferred and fixed after adjusting the position of the stacked FPC tray if necessary.

 Thus, by appropriately adjusting the spacing of the conversion guide 88, FPC trays of various sizes can be used.

Then, the tray holder 83 sucks one uppermost tray by the vacuum from the raised FPC tray and lowers all remaining trays.

In addition, two jigs J are provided in each conversion guide, and are connected to a vacuum apparatus (not shown) to suck the FPC tray by vacuum.

The tray supply part 84 is mounted on the frame 81 so as to be transportable on the rail r2 arranged in the X-axis direction.

In addition, while the tray holder 83 is picking up the FPC tray, the tray supply portion 84 moves to the lower side of the FPC tray, and seats the FPC tray on its upper surface.

Accordingly, the tray supply unit 84 can move the FPC tray to an appropriate position by appropriately moving the rail r2 according to the input coordinate value, and the FPC holder 85 moves the FPC loaded on the FPC tray. You will be picked up.

The FPC holder 85 is mounted to be transported on the FPC transfer 89 capable of Y-axis movement, and has a structure capable of moving up and down.

In addition, since the pad is provided at the lower end of the FPC holder 85, the FPC can be adsorbed by vacuum.

As a result, the FPC holder 85 picks up the FPC by using the pad in the process of conveying in the Y-axis direction by the FPC transferr 89, and transfers the picked-up FPC to the FPC preliminary alignment unit 86. Can be.

The FPC preliminary alignment unit 86 includes a stage 94 on which the FPC transferred by the FPC holder 85 is seated, and a transfer unit 91 and 92 for transferring the stage 94 to the X, Y, and θ axes. 95).

Accordingly, the FPC seated on the stage 94 can be transferred to the preliminary bonding unit 19 (Fig. 8) by appropriately transferring the transfer units 91, 92 and 95 in the X, Y and θ axis directions. .

On the other hand, the tray unloader 87 is provided in the other direction of the FPC transfer 89 to discharge the empty FPC tray to the outside.

That is, after the FPC is picked up by the FPC holder 85, the empty FPC tray is moved back to the position of the tray unloader 87 when the tray supply unit 84 moves backward, and the tray unloader 87 is lowered to form a vacuum method. As a result, the empty FPC tray is absorbed and picked up. The empty FPC tray is then discharged to the outside.

As described above, the FPC transferred from the FPC supply unit 80 to the preliminary bonding unit 19 is picked up by the first head H1 at the first position P1 shown in FIG. Since the preliminary bonding is performed by the process, detailed description thereof will be omitted.

As such, the glass L to which the semiconductor chip C is preliminarily bonded is transferred to the main bonding part 21 by the fourth transfer arm T4 of the transfer 22 to be bonded secondarily. Can be.

In more detail, as shown in FIG. 17, the main bonding part 21 is provided on the frame 100 and on one side of the frame 100 to bond the semiconductor chip C. FIG. Head (Bonding Head) 101, and the transfer member 104 for moving the pre-bonded glass (L) to the bonding position.

In the main bonding portion having such a structure, the bonding head 101 is composed of a plurality, preferably four, the bonding operation is performed by the four bonding heads 101 to move up and down.

That is, the driving motors 102 are respectively provided on the upper portion of the bonding heads 101, and when the driving motors 102 are driven, the connecting heads 103 may move up and down so that the bonding heads 101 may move up and down. have.

In addition, a bonding tip 106 is provided below the bonding head 101 to generate a predetermined heat. Therefore, the bonding operation can be performed by placing the semiconductor chip C on the glass L and heating the bonding tip 106.

Both sides of the bonding head 101 are provided with a pair of winding reels 107 for supplying a buffer film.

The pair of winding reel 107 winds up a buffer film, preferably Teflon Tape, and attaches the buffer film to the bonding site after the bonding operation to improve the cracking of the ACF and to prevent foreign substances and scratches. Can be.

On the other hand, the glass L, the bonding operation is completed as described above is picked up by the fifth transfer arm (T5; Fig. 6) of the transfer 22 (Fig. 6) when the transfer member 104 is reversed to reach a predetermined position It can be discharged to the outside through the unloader 7 provided on the exit side.

This unloader 7 comprises a conveying mechanism of a conventional conveyor type, as shown.

Meanwhile, as shown in FIGS. 1 and 6, the transfer 22 (FIG. 6) has a constant pitch provided between the loading part 3, the main body part 5, and the unloading part 7. By operating the chip C can be transferred between the sections.

This transfer 22 is made of two sets, as shown in Figure 6, it is possible to transfer the chip between each section. That is, the transfer 22 is composed of a set consisting of the first and second transfer arms T1, T2 and a set consisting of the third to fifth transfer arms T3, T4, T5.

At this time, the first transfer arm T1 transfers the chip C between the ACF bonding unit T1 in the loading unit 3, and the second transfer arm T2 is the ACF bonding unit 17 and the main body unit. The chip C is transferred between (5). When the second transfer arm T2 transfers the chip C to a position adjacent to the preliminary bonding unit 19, the third transfer arm T3 picks up the transfer unit 45 of the preliminary bonding unit 19. To feed.

In addition, the fourth transfer arm T4 is disposed between the preliminary bonding unit 19 and the main bonding unit 21 to transfer the chip C, and the fifth transfer arm T5 is the main bonding unit 21. Disposed between and the unloading portion 7 to transfer the chip (C).

In this case, the first to fifth transfer arms T1, T2, T3, T4, and T5 may pick up chips by a vacuum suction method.

Hereinafter, an operation process of a semiconductor bonding apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 10, in order to bond the semiconductor chip C to the glass L using the semiconductor bonding apparatus proposed by the present invention, the glass L is first used by using the loading unit 3 of the conveyor method. ) Is transferred into the bonding apparatus.

That is, when driving the drive motor 11 of the loading unit 3, the belt 13 connected to the drive motor 11 is advanced, the glass placed on the belt 13 is the preliminary bonding unit 19 Will be moved to.

In this case, the belt 13 may be formed of two parts, so that the contact area with the glass may be minimized, thereby preventing the adhesion of foreign matters.

The glass L supplied by the loading unit 3 is picked up in a vacuum manner by the first transfer arm T1 of the transfer 22 and supplied to the transfer member 30 to the ACF bonding unit 17. Transferred.

Referring to the process of the ACF bonding unit 17 in more detail, the transfer member 30 that can be moved in the X, Y, Z axis direction is the glass (L) on the loading table 32 by the vacuum suction method It will be fixed at.

In addition, the transfer member 30 on which the glass L is seated is positioned in the lower ends of the heads 26a and 26b by moving in the Y-axis direction.

In this state, after the glass L is aligned in position, the reel 28 is rotated so that the ACF wound on the reel 28 is unwound to a predetermined length and passes through a plurality of intermediate reels r to pass the glass L. Located at the top of the cut to a predetermined length (Cutter; 40) is then transported.

The lower ends of the heads 26a and 26b pressurize the ACF by lowering the heads 26a and 26b of the ACF bonding portion 17. Preferably, the electrode of the glass (L) is pressed.

In addition, the pair of heads 26a and 26b attaches to the glass L by transferring a constant temperature of heat to the ACF.

After attaching the ACF on the glass L, the cutter 40 cuts the ACF tape. Then, the separation (Separater) is separated from the ACF and the protective film portion (not shown), the ACF is attached to the glass (L).

Then, after the process is completed, the length and adhesion of the ACF is inspected by the sensor.

As described above, after the ACF attaching process is completed, the glass L is transferred to the preliminary bonding unit 19 by the second transfer arm T2 of the transfer 22 in the state of being seated on the loading stand 32, and thus the semiconductor chip. (C) is primarily bonded.

In more detail, the glass L to which the ACF is pressed is seated on the transfer member 45 of the preliminary bonding portion 19 and moved in the Y-axis direction to reach the preliminary bonding position.

At this time, the head 43 provided in the rotary 42 receives the chip from the chip supply unit 20 and is positioned on the glass.

That is, as shown in Figs. 11 to 14, the rotary 42 rotates at an angle, preferably at an angle of 90 degrees to reach the first position P1 along the circular trajectory.

At this time, the chip C is supplied to the chip head 43 at the first position P1 because the chip C is supplied through the chip supply unit 20. The process of supplying the chip C to the chip head 43 will now be described.

That is, the cassette lift 60 descends and picks up the chip tray from the chip tray box (not shown) to raise.

In addition, the plurality of transferred chip trays may be separated by the tray supply unit 57 and transferred to each tray in the lateral direction so that the chip holders 58 may pick up. As described above, the chip holder 58 sucks the chips C one by one by vacuum, moves them laterally a predetermined distance, and then transfers them to the inversion unit 59 to invert the chips at an angle of 180 degrees.

The chip C seated on the upper surface of the reverse jig 65 does not fall even when the reverse jig 65 is rotated halfway by being sucked by the vacuum hole 67.

In this way, the inverting jig 65 on which the chip is seated moves along the X-axis adjusting shaft 69 to reach the position of the chip centering part 62.

When the inversion motor 64 is driven, the inversion jig 65 having reached the position of the chip centering portion 62 is inverted to freely drop the chip C and rest on the stage plate 68.

At this time, when the interval between the inverting jig 65 and the chip centering portion 62 is wide or narrow, the height is appropriately adjusted by the driving of the θ adjustment shaft 71.

Therefore, regardless of the position of the bump surface of the chip C, the chip C can be supplied to the chip centering part 62 in an inverted or electrostatic state, so that the operation of transferring the chip C is performed manually. It is possible to prevent the occurrence of defects such as foreign matter adhered to the chip (C) in the process.

As described above, when the chip C is seated on the chip centering part 62, the preliminary bonding operation is performed by being picked up by the first head H1.

That is, as shown in Fig. 14, after the first head H1 picks up the chip at the first position P1, the rotary rotates by 90 degrees to reach the second position P2.

The alignment mark M1 of the chip C is recognized by the first camera 73 at the second position P2. In this case, an aligning mark M1 is provided to align the chip C, and the aligning mark M1 can be edited by the camera to obtain image information edited in two colors, black and white. . The video information on the alignment mark of the chip is transmitted to the personal computer.

The disc 50 continues to rotate so that the first head H1 reaches the third position P3, ie the preliminary bonding position.

The 2nd camera 74 is arrange | positioned at 3rd position P3, and the alignment mark M2 of the glass L conveyed to the preliminary bonding position by the alignment stage 45 is image-recognized. The recognized image information is transmitted to the personal computer.

As such, the image information transmitted from the first and second cameras 73 and 74 is processed by the personal computer to control the alignment stage 45 so that the chip C is preliminarily bonded to the correct position on the glass L. To be possible.

In more detail, the personal computer includes a built-in alignment of alignment marks M1 and M2 of the chip C and the glass L transmitted by the first camera 73 and the second camera 74. Processing by the mark editing program makes it possible to recognize a more accurate position.

That is, the alignment mark editing program adjusts the resolution by editing the image in two colors, black and white, when the mark outline is not clear.

Therefore, the recognition rate of the aligning mark M1 can be improved by automatically removing unnecessary images around the aligning mark M1 of the semiconductor chip C. FIG.

In the case of the aligning mark M2 of the glass L, the aligning mark M2 is automatically aligned by arithmetic processing based on a distance away from the original mark by a predetermined distance.

On the other hand, as a result of image recognition, the chip determined to be defective is moved to the fourth position P4 by the rotation of the original plate 50, and is removed by the defective chip tray collection device disposed at the fourth position P4. Can be.

As described above, the personal computer properly moves the alignment stage by the processed image information so that the chip can reach the correct position on the LCD.

As described above, when the alignment stage 45 on which the glass L is seated reaches the home position by the control signal of the personal computer, the chip head 47 in the state of picking up the chip at the third position P3 is The preliminary bonding is performed by lowering and placing the chip C on the glass L. FIG.

In more detail, the heating device of the chip head 47 heats the bonding tip to generate heat of a predetermined temperature, thereby thermally compressing the semiconductor chip C. At this time, the temperature of the heat is preferably about 60 degrees, the pressing time is 0.1-60 seconds.

Through this process, the semiconductor chip C may be preliminarily bonded onto the glass L. FIG.

The glass L to which the chip C is pre-bonded is transferred to the main bonding part 21 by the fourth transfer arm T4 of the transfer 22 to perform main bonding.

That is, as shown in FIG. 17, the four bonding heads 101 perform the bonding operation by sequentially raising and lowering the movement.

At this time, the lower portion of the bonding head 101 is provided with a bonding tip 106 for generating a constant heat. Therefore, the bonding operation can be performed by placing the semiconductor chip C on the glass L and heating the bonding tip 106.

In addition, a buffer film wound around a pair of winding reels 107 provided at both sides of the bonding head 101 is supplied to the bonding portion.

Therefore, by adhering the buffer film to the bonding site, it is possible to improve the cracking of the ACF and to prevent foreign substances and scratches.

On the other hand, when the bonding operation is completed, the glass (L) as described above, when the transfer member 104 is reversed to reach a predetermined position, the fifth transfer arm (T5; Fig. 6) of the transfer 22 is picked up and provided on the exit side It may be discharged to the outside through the unloader (7).

As described above, the COG bonding apparatus according to the preferred embodiment of the present invention has the following advantages.

First, since ACF work and COG bonding work are performed by a single device, each process of loading, ACF bonding, COG bonding, and unloading can be automatically performed, thereby reducing the bonding time and improving work efficiency.

       Second, in the case of preliminary bonding, the alignment mark coordinates of the chip are transmitted through the control PC immediately after recognition, so that the alignment time between the chip and the glass is already completed before the chip arrives at the preliminary bonding stage. In addition, preliminary bonding of semiconductor chip and glass is carried out by four heads in the rotary method, so preliminary bonding work, chip pick-up, pattern recognition of semiconductor chip and other work can be performed in parallel, and four work can be done simultaneously. As a result, the Tact Time is significantly shortened and productivity is high.

Third, at the time of preliminary bonding, two cameras are provided to simultaneously recognize the patterns of the semiconductor chip and the glass, so that the pattern recognition time is shortened, thereby reducing the tac time and improving productivity.

Fourth, in the case of centering the semiconductor chip, the chip is changed from the mechanical centering method to the image recognition method so that the chip is inserted into the jig to move the chip head and the centering is performed, thereby preventing the chip from colliding with the centering mechanism jig and breaking the edge. can do.

Fifth, since the glass is loaded by a two-part width variable conveyor, the contact area between the conveyor belt and the glass can be minimized, thereby preventing defects from adhering to the glass, thereby reducing defects.

Sixth, in order to reverse the direction of the bump surface of the chip, the process of inverting and transferring the chip mounted on the chip tray to another chip tray is automatically performed, thereby preventing foreign matter from being attached to the chip during this process. Can prevent the worker's work error.

Seventh, by developing a program that can edit images such as adjusting the contrast of the alignment marks and removing afterimages during pattern aligning operations of semiconductor chips and glasses, the afterimages can be removed by editing the marks for pattern alignment using a program. By improving the matching ratio of the aligning mark (M1) to prevent the occurrence of aligning defects, it is possible to improve the quality by increasing the pattern alignment degree of the glass and chip.

Eighth, since a plurality of semiconductor chips are attached to the glass at a time by an automatic alignment method, productivity can be high and bonding efficiency can be improved.

Ninth, by applying the automatic chip reversing device can reduce the chip loss due to the operation error during manual reversal can improve the bonding work efficiency.

Tenth, by applying the rubber sheet fixing method to improve the flatness of the ACF bonding stage by the one-touch detachable method using magnets, it is possible to prevent the occurrence of bubbles and to change the rubber plate time by improving the flatness during ACF bonding. As it can be reduced, it is effective to increase the utilization rate and productivity.

Eleventh, the COG bonder main body of the device is the same as the main body of the FOG bonder, so it is possible to easily switch the work from COG bonding to FOG bonding or FOG bonding to COG bonding as replacement of the chip supply or FPC supply only. Maximize the utilization of the equipment.

The present invention can be variously changed by those skilled in the art without departing from the gist of the present invention claimed in the claims, and is not limited to the specific preferred embodiments described above. .

Claims (16)

A loading unit in which glass is loaded; ACF is automatically attached onto the glass supplied from the loading unit, the semiconductor chip is centered, the semiconductor chip is supplied onto the glass by a rotary method, aligned, prebonded, and main bonding is performed. Main body; An unloading unit (Un-Loader) comprising a conveyor for discharging the glass on which the semiconductor chip supplied from the main body is mounted to the outside; A transfer unit provided between the loading unit, the main body unit, and the unloading unit to transfer chips to each section; And Inline automatic COG bonding apparatus including a control unit for controlling the loading unit, the main body unit, the unloading unit. The belt of claim 1, wherein the loading unit comprises a drive motor, two split belts rotated by the drive motor, and the glass is seated on an upper surface thereof, the belt being adjustable and a plurality of supporting belts. Inline automatic COG bonding apparatus comprising a conveyor consisting of two rotating shafts. The preliminary assembly of claim 1, wherein the main body unit includes an ACF bonding unit for automatically attaching an anisotropic conductive film onto glass, and a plurality of semiconductor chips mounted in the order of loading, pattern recognition, and preliminary bonding on an ACF-attached glass. An inline automatic COG bonding apparatus comprising a bonding portion and a main bonding portion for finally pressing and mounting the semiconductor chip on the glass supplied from the preliminary bonding portion. The method of claim 3, wherein the ACF bonding portion is provided at a frame, a pair of heads provided on one side of the frame and capable of vertically reciprocating movement, and adjacent side positions of the pair of heads for bonding operation. A pair of reels for winding the ACF required for the transfer, a transfer member for transferring glass to the pair of heads, a cutter provided at a lower end of the head, and a cutter for cutting the ACF to a predetermined length. ACF is Inline automatic COG bonding device with ACF checker to check whether it is attached. The method of claim 4, wherein the head of the pair of seats provided by the magnet detachable to the head, and the seating table provided in the seat can be used to improve the flatness of the ACF attachment by using elastic when attaching the ACF to the glass Inline automatic COG bonding apparatus including an elastic member. The method of claim 3, wherein the preliminary bonding unit is a frame, a DD motor-driven index rotary (Rotary) rotatably provided in the frame, a chip head attached to each of the rotary, A chip supply unit for sequentially supplying semiconductor chips to the chip head, an alignment stage for transferring glass to a bonding position, and a vision unit for recognizing patterns and positions of chips and glasses supplied to the preliminary bonding unit; When the rotary is rotated by an angle, the chip head is sequentially positioned at the positions of the chip supply unit, the vision unit, and the alignment stage, thereby performing four processes of chip loading, chip alignment, preliminary bonding, and bad chip accumulation. Inline automatic COG bonding device that allows each task to proceed sequentially and simultaneously. The method of claim 6, wherein the rotary is a stepping motor provided on the upper portion of the horizontal plate, the disc is connected to the stepping motor rotatable, and is provided to be movable up and down on the disc to bond the chip on the ACF of the glass surface Inline automatic COG bonding apparatus comprising a chip head. The chip supply unit of claim 6, wherein the chip supply unit comprises a tray supply unit for sequentially transferring a plurality of chip trays transferred by a cassette lift, a chip holder for transferring chips one by one from the tray supply unit, and a chip transferred by the chip holder. An inline automatic COG bonding apparatus comprising an inverting unit for inverting as necessary and a chip centering unit for transferring the chip inverted by the inverting unit to a pickup position and centering the chip. The inline automatic COG bonding apparatus of claim 8, wherein the inversion unit comprises a inversion motor for generating a rotational force, and an inversion jig connected to the inversion motor to suck and invert a chip on an upper surface thereof. The FPC supply unit of claim 6, wherein the chip supply unit comprises an FPC supply unit, wherein the FPC supply unit supplies a frame, an FPC tray lift configured to supply an FPC tray loaded with the FPC, and an FPC tray from the FPC tray lift. A tray holder for transferring the FPC tray, a tray supply unit for extracting the FPC from the FPC tray and fixing it at a predetermined position, an FPC holder for picking up and moving the FPCs of the FPC tray, an alignment unit for supplying the FPC to the preliminary bonding position, and an FPC Inline automatic COG bonding device including a tray unloader for returning a used empty FPC tray to its original position. The apparatus of claim 8, wherein the vision unit comprises: a vision camera for recognizing a chip of the chip centering unit, a first camera disposed at a second position on a rotational trajectory of the rotary, and an image recognizing an alignment mark of the chip; And a control unit configured to receive and process image information from the first and second cameras, the second camera being disposed in the image and recognizing the alignment mark of the glass, respectively. The camera of claim 11, wherein the first and second cameras of the vision unit are provided at a pair of support shafts and a tip of the support shafts, respectively, to recognize images of the semiconductor chip and the LCD, and to move the cameras in the X-axis direction. An inline automatic COG bonding apparatus comprising an X-axis adjusting shaft to move, a Y-axis adjusting shaft to move in the Y-axis direction, and a Z-axis adjusting shaft to move in the Z-axis direction. 12. The ITO pattern of glass according to claim 11, wherein the control unit recognizes a position on the semiconductor chip and the glass by the image information transmitted from the first and second cameras, and processes the image information of the alignment mark by a program. In-line automatic COG bonding device with a program for semiconductor chip pattern aligning that can increase the coincidence of alignment marks with the bump surface of the chip. 7. The alignment stage of claim 6, wherein the alignment stage includes an X-axis feeder that is movable in the X-axis direction, a Y-axis feeder that is movable in the Y-axis direction, and an adhering table provided on the X-axis feeder for mounting the glass. Inline automatic COG bonding device. The bonding method of claim 3, wherein the main bonding unit is configured to perform a vertical reciprocating motion on one side of the frame, a variable pitch bonding head, and a lower end of the bonding head to transfer heat to a glass on which chips are bonded. An inline automatic COG bonding apparatus including a tip and a winding reel provided at an adjacent position of the bonding head to wind a buffer film.        The method of claim 1, wherein the transfer is made of a first to fifth transfer arm, the first transfer arm transfers the chip between the ACF bonding portion in the loading portion, the second transfer arm is the ACF bonding portion and the main body portion The chip is transferred between the feeder, the third transfer arm is supplied to the preliminary bonding portion, and the fourth transfer arm is disposed between the preliminary bonding portion and the main bonding portion to transfer the chip, and the fifth transfer arm is connected to the main bonding portion. It is disposed between the loading section to transfer the chip Inline automatic COG bonding device.

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