JPS5844640Y2 - Electronic parts automatic assembly equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component automatic assembly device for automatically assembling electronic components onto a board.

As a conventional electronic component automatic assembly apparatus, there is known an NC automatic insertion machine that inserts electronic components such as IC9 resistors and diodes into printed circuit boards, as shown in FIG.

This device includes a Y-table 6 that moves in the Y-axis direction on a base 7 by driving a Y-axis circumferential motor 5 via a feed screw mechanism, and a feed screw mechanism that moves above the Y-table 6 by driving an X-axis circumferential motor 4. An X-table 2 is provided that moves in the X-axis direction via the The built-in bed 1 is mounted on a frame 8 extending upward from a base 7, which is held by the user and inserted into the hole drilled at a predetermined position in the printed circuit board 3 by moving from the top to the bottom.

However, in the above device, when inserting and assembling electronic components into a board that has holes for inserting electronic component leads, even if the printed circuit board is moved and positioned using an X-Y table, the electronic components that have already been installed are positioned by the holes mentioned above, and the problem of misalignment does not occur. However, it is possible to form a conductor in a predetermined pattern on a ceramic substrate, and then attach electronic components to the substrate, etc., with solder paste etc. attached to the conductor part. When assembling, the positioning is done simply by the adhesive force of solder paste, etc., so when the above-mentioned board is moved at high speed on an X-Y table for positioning, the electronic components that have been assembled first may shift out of position. There was a drawback.

The purpose of this invention is to eliminate the above-mentioned conventional drawbacks, and to quickly place electronic components in the specified position on the board without causing any misalignment, even for boards that do not have holes for inserting the electronic component leads. An object of the present invention is to provide an automatic electronic component assembly device that can be incorporated into a computer.

That is, in the present invention, a substrate on which an adhesive material is formed is fixedly positioned at a predetermined position, and a built-in head holding an electronic component at the tip is moved three-dimensionally relative to the substrate to attach the substrate to a predetermined position. The above-mentioned electronic components are placed in a position and assembled by gluing them, and of the three-dimensional movement of the above-mentioned assembly head, a linear motor is used to move in two dimensions along the X-Y axes along the board. This is an electronic component automatic assembly device characterized by being equipped with a numerical control device for controlling the electronic components.

The present invention will be specifically described below based on embodiments shown in the drawings.

That is, the board 10 on which the electronic components 14 such as ICs, transistors, resistors, etc. are mounted and assembled is, for example, a ceramic board with a conductor of a predetermined pattern formed thereon, and a solder paste or the like attached to the conductor parts. There are no holes for inserting leads of electronic components.

That is, the board 10 is transported from a magazine (not shown) to a position where the electronic component 14 is installed by a transport means (not shown) such as a conveyor, and is levitated from the transport means and placed above the table 13 for board positioning. It is positioned and fixed by the device 11.

Four pillars 15 are installed on this table 13, and a ceiling 7 is attached to the upper end of each pillar 15.

9 is a built-in head equipped with a vacuum chuck 16 for vacuum-chucking and releasing electronic components 14 at the tip;
A drive source (not shown) for moving the vacuum chuck 16 in the vertical direction (Z-axis direction) is provided, and is attached to the sliding portion 8 facing downward.

This sliding portion 8 is constructed of linear pulse smoke that can scan in two axial directions between the sliding portion 8 and the lower end surface of the ceiling 7 so that the sliding portion 8 scans two-dimensionally in the X-axis and Y-axis directions.

That is, the lower end surface of the ceiling 7 corresponds to the stator of a normal pulse motor, and the sliding portion 8 corresponds to the rotor.

Furthermore, the built-in head 9 sets an origin in the X-axis, Y-axis, and Z-axis directions, and with this origin as a reference, the X-axis and Y-axis directions are determined according to commands from the NC control device (not shown). A linear pulse motor is used for displacement and positioning in the Z-axis direction by a cylinder mechanism (not shown) connected to a drive source.

Therefore, the built-in head 9 moves to the ceiling 7 according to a command from the NC control device.
can be taken to any position.

Reference numeral 12 denotes a feeder that transports electronic components 14 of different shapes and types to the side of the installation position, positions them at a predetermined end position, and stops them.

The built-in head 9 also has conductors formed at predetermined positions on the substrate 10 and connected to each other to establish electrical continuity.
A position detection sensor (not shown) consisting of two conductive pins is provided to confirm the position of the board.

After the substrate 10 is set at a predetermined position by the substrate positioning device 11, the assembly head 9 is positioned at a predetermined reference position in the X and Y axis directions by a command from an NC control device (not shown). In this state, the assembly head is lowered, and the position detection sensor is brought into contact with the conductor formed on the substrate 10 to establish continuity, thereby confirming the position of the substrate 10.

After this confirmation, the mounting head 9 holds at the tip of the electronic components 14 that have been conveyed and positioned by the feeder 12 and are predetermined by a command from the NC control device.

This held electronic component is moved to a predetermined position on the board 10 by operating a linear pulse motor and a drive source in accordance with a command from the NC control device so that the origin is displaced in each axis direction, and the electronic component is held at a predetermined position on the board 10. is opened and the electronic component 14 is slightly pressed against the board 10 to be mounted and assembled on the board 10.

Subsequently, the above operations are repeated to form a board on which a large number of electronic components are mounted and assembled.

Since the board 10 is not moved until one board is completed in this way, it is possible to eliminate misalignment of electronic components during assembly, and the assembly head 9 can be assembled up to the maximum speed at which it can respond to commands from the NC control device. can increase the loading speed,
It is possible to speed up the installation.

Moreover, since there is no need to move the board positioning device 11 during the above-mentioned assembly operation, the already installed production line,
For example, the present device can be easily installed in a production line in which electronic components are assembled into a ceramic substrate and soldered in a reheating furnace.

As explained above, according to the present invention, it is possible to accurately and quickly incorporate electronic components into a board, etc. that does not have holes for inserting and positioning the leads of electronic components without causing any misalignment. This has the effect of improving productivity and saving labor.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the overall general structure of a conventional electronic parts automatic assembly apparatus, and FIG. 2 is a perspective view showing the overall general structure of an embodiment of the electronic parts automatic assembly apparatus according to the present invention. Explanation of symbols 7... Ceiling, 8... Sliding part, 9... Built-in head, 10... Board, 11... Board positioning device, 12...
・Feeder, 14...Electronic parts, 16...
...Vacuum suction head.

Claims (1)

[Scope of utility model registration request] A positioning means for positioning a board formed to have adhesive properties in a predetermined position is provided on the part on which electronic components are placed, and a positioning means is provided for positioning the board formed to have adhesive properties in a predetermined position, and a stator provided on the base and facing the stator are arranged in the X-Y axis direction. A linear pulse motor consisting of a sliding part that moves in the two-dimensional direction of the X-Y axis along the substrate is provided, and a driving means for moving the sliding part of the linear pulse motor in the Z-axis direction is provided. A holding means is provided at the tip of the driving means, a numerical control device is provided for controlling the linear pulse motor, the holding means holds the electronic component supplied to the supply position, and the electronic component is held at the feeding position by the commands of the numerical control device. The holding means is positioned at a position facing a predetermined mounting portion by controlling the running of the linear pulse motor, and the electronic component held by the holding means is pressed against the mounting portion by the driving means and assembled by adhering it. An electronic component automatic assembly device characterized in that it is configured to attach.