JP2017034153A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To implement a series of processes of component mounting by one device.SOLUTION: A component mounting device (100) comprises: a component inserting robot (1) which inserts a terminal (L) of a component (P) into a through-hole (H) and holds the terminal with respect to a board (B); a soldering robot (2) which solders the terminal of the component inserted into the board, onto the board; control means (3) which controls actions of the component inserting robot; and inspection means (30) which inspects a finish of the soldered component and the board. The component inserting robot includes first imaging means (C1) that images the board, and the soldering robot includes second imaging means (C2) that images the board. The control means controls the actions of the component inserting robot based on an image captured by the first imaging means. The inspection means inspects the finish of soldering based on an image captured by the second imaging means.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus for mounting an electronic component having terminals.

  Conventionally, as a component mounting apparatus that arranges electronic components at predetermined positions on a printed circuit board, for example, devices described in Patent Document 1 and Patent Document 2 have been proposed. In the component supply apparatuses described in Patent Document 1 and Patent Document 2, a component transfer robot picks up an electronic component supplied from a parts feeder and arranges the electronic component at a predetermined position on a substrate. The substrate on which the electronic component is arranged at a predetermined position is conveyed to another soldering apparatus, and the electronic component is soldered to the substrate through a predetermined process.

  Moreover, the board after soldering is conveyed to a dedicated inspection device, and the finish of soldering is inspected (see, for example, Patent Document 3). In the inspection apparatus described in Patent Document 3, the surface displacement of a soldered portion is measured, and the quality of soldering is determined by comparison with a preset reference value of the surface displacement.

JP 2003-318599 A JP2013-105820A JP 2012-098230 A

  However, in the above apparatus, the component placement, soldering, and inspection processes for the substrate are performed by separate apparatuses, and thus a series of component mounting processes is complicated. Furthermore, since a dedicated device is required for each process, there has been a problem that the device introduction cost becomes enormous.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a component mounting apparatus capable of performing a series of component mounting processes with one apparatus.

  A component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate, and the terminal of the component is connected to the substrate with respect to the through hole. A component insertion robot that is inserted into and held in a hole; a control unit that controls an operation of the component insertion robot; a soldering robot that solders the terminal of the component inserted into the substrate to the substrate; and the solder An inspection unit that inspects the finish of the component soldered by the attachment robot and the substrate, and the component insertion robot includes a first imaging unit that images the substrate, and the soldering robot includes: A second imaging unit configured to image the board; and the control unit moves the component insertion robot based on a captured image captured by the first imaging unit. Controls, the test means is characterized by examining the finished soldering based on the captured image captured by the second imaging means.

  According to this configuration, the insertion position (the position of the through hole) of the component with respect to the substrate is specified by the first imaging unit, and the component is inserted at a predetermined position. Further, since the component is held in a state where the component is inserted at a predetermined position by the component insertion robot, it is possible to perform soldering without shifting the position of the component with respect to the substrate. Further, after the soldering, the image of the substrate is picked up by the second image pickup means, so that the soldering finish can be inspected. In this way, a series of steps of component insertion, soldering, and inspection with respect to the substrate can be performed with one apparatus. Therefore, it is not necessary to prepare a dedicated device for each process, and the device introduction cost for component mounting can be suppressed.

  In addition, the component mounting apparatus according to the present invention further includes a third imaging unit that images the component held by the component insertion robot, and the control unit captures an image captured by the third imaging unit. It is preferable to adjust the insertion position of the component with respect to the board based on the above. According to this configuration, the holding position of the component held by the component insertion robot can be recognized from the captured image captured by the third imaging unit. Then, by adjusting the insertion position of the component based on the holding position, the component can be inserted at an appropriate position.

  The component mounting apparatus according to the present invention further includes a calculation unit that calculates an insertion position of the component, and the calculation unit inserts the component based on a captured image captured by the third imaging unit. It is preferable to calculate the position. According to this configuration, even when the component holding position is shifted each time the component insertion robot holds the component, the component insertion position is calculated based on the captured image, so that the component can be positioned at an appropriate position. Can be inserted into.

  The component mounting apparatus according to the present invention associates the type of the component with a component identification code provided on the board, and stores the insertion position of the component with respect to the board for each type of the component. And a control unit that recognizes the type of the component from the component identification code included in the captured image captured by the first imaging unit, and that corresponds to the type of the component. It is preferable to control the operation of the component insertion robot based on the insertion position. According to this configuration, the component insertion position corresponding to the component type is stored in advance, so that the component type can be recognized by recognizing the component type from the captured image captured by the first imaging unit. However, it can be inserted at a predetermined position.

  In the component mounting apparatus according to the present invention, it is preferable that the insertion position of the component includes a polarity, an insertion coordinate, and an insertion amount of the component. According to this configuration, the component can be inserted at an appropriate position according to the polarity of the component, the insertion coordinates, and the insertion amount.

  In the component mounting apparatus according to the present invention, the component insertion robot includes a gripping hand that grips the component, and a gripping hand switching mechanism that can switch the gripping hand according to the type of the component. A fourth imaging unit that images the component before being held by the component insertion robot; a second storage unit that associates and stores the type of the component and the type of the gripping hand according to the component; The control means recognizes the type of the component from the captured image captured by the fourth imaging means, and determines the gripping hand based on the type of the gripping hand corresponding to the type of the component. It is preferable to control the operation of the component insertion robot to be switched. According to this configuration, the gripping hand corresponding to the type of the part is stored in advance, so that the type of the part can be recognized from the captured image captured by the fourth imaging unit, thereby easily switching the gripping hand. Can be done.

  According to the present invention, a series of steps of component mounting can be performed with one apparatus.

It is outline | summary explanatory drawing in the 1st component mounting apparatus which concerns on this invention. It is outline | summary explanatory drawing in the 2nd component mounting apparatus which concerns on this invention. It is outline | summary explanatory drawing in the 3rd component mounting apparatus which concerns on this invention. It is a figure which shows an example of the silk pattern printed on the surface of a board | substrate. It is outline | summary explanatory drawing in the 4th component mounting apparatus which concerns on this invention. It is explanatory drawing of the component mounting apparatus which concerns on this Embodiment. It is a figure which shows an example of the components holding | grip process which concerns on this Embodiment. It is a figure which shows an example of the holding component imaging process which concerns on this Embodiment. It is a figure which shows an example of the board | substrate surface imaging process which concerns on this Embodiment. It is a figure which shows an example of the component insertion process which concerns on this Embodiment. It is a figure which shows an example of the soldering process which concerns on this Embodiment. It is a figure which shows an example of the test process which concerns on this Embodiment.

  A component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a terminal to be inserted into a through-hole formed in a substrate. The component mounting device inserts a component into the substrate, solders the component, and performs soldering. A series of component mounting processes, such as finish inspection, are performed with a single device. In the following, each feature of the component mounting apparatus according to the present invention will be described sequentially. However, the component supply apparatus according to the present invention is not limited to the configuration shown below, and can be changed as appropriate.

  First, a first feature of the component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 1 is a schematic explanatory diagram of a first component mounting apparatus according to the present invention.

  When an electronic component having a terminal is mounted on a substrate, it is necessary to insert the tip portion of the terminal into a through hole of the substrate. In this case, precision is required for positioning of the electronic component (terminal) with respect to the through hole, so that manual mounting has been the mainstream. Moreover, after inserting a terminal in a through hole, in order to solder an electronic component to a board | substrate, the board | substrate with which the electronic component is arrange | positioned is conveyed to a flow tank. The inside of the flow tank is filled with heated liquid solder, and the solder in the tank is blown up from the bottom to the top. The substrate on which the electronic components are arranged is soldered by moving the upper surface of the flow tank with the tip portion of the terminal protruding from the back surface facing downward. In this case, there is a problem that the components on the substrate are displaced due to the solder in the tank being blown up from the bottom to the top. Conventionally, the component insertion process and the soldering process are performed separately, so that the component mounting process is complicated as a whole.

  Therefore, in the present invention, it is possible to perform component insertion and soldering continuously in the same apparatus by synchronizing the operations of the component insertion robot and the soldering robot. Furthermore, it is possible to inspect the finish after soldering by providing an imaging means in the soldering robot. As a result, in the present invention, a series of component mounting steps can be performed by one apparatus.

As shown in FIG. 1, the first component mounting apparatus 100 is a component mounting apparatus that mounts a component P on a board B. Substrate B is PWB (Printed Wiring Board) or PCB (Printed Circuit)
Board). In the substrate B, a through hole H into which a terminal portion of the component P is inserted is formed so as to penetrate from the upper surface to the lower surface. The substrate B is transported to a predetermined position in the apparatus with the surface side on which the component P is inserted facing downward.

  The component P is an electronic component including a terminal L (lead wire) inserted into the through hole H. The component P shown in FIG. 1 is provided such that a pair of terminals L protrude from one surface of a rectangular parallelepiped package, for example. The shape of the part is not limited to the configuration shown in FIG. 1, and the shape of the package, the number of terminals, and the like are different depending on the type of the part P.

  The component mounting apparatus 100 performs operations of the component insertion robot 1 that inserts the component P into the board B, the soldering robot 2 that solders the component P inserted into the board B, and the operations of the component insertion robot 1 and the soldering robot 2. And control means 3 for controlling.

  The component insertion robot 1 is composed of, for example, a 6-axis articulated robot having an arm 10 connected to a plurality of links, and is provided on the surface side (downward) of the substrate B. A gripping hand 11 that grips the component P is provided at the tip of the arm 10. Although details will be described later, the component insertion robot 1 includes a gripping hand switching mechanism 12 that can switch the gripping hand 11 according to the type of the component P to be mounted. A first imaging unit C1 that images the surface of the substrate B is provided in the vicinity of the gripping hand 11 at the tip of the arm 10.

  The soldering robot 2 is composed of, for example, a 6-axis articulated robot having an arm 20 that connects a plurality of links, and is provided on the back side (upper side) of the substrate B. A soldering head 21 is attached to the tip of the arm 20. The soldering robot 2 may be configured by using the same 6-axis articulated robot as the component insertion robot 1 and attaching a soldering head 21 instead of the gripping hand 11. Further, in the vicinity of the head 21 at the tip of the arm 10, second imaging means C <b> 2 for imaging the back surface of the substrate B is provided.

  The control means 3 controls each part of the component mounting apparatus 100, and includes a processor, a memory, and the like that execute various processes. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. The captured image of the substrate B captured by the first imaging unit C1 and the second imaging unit C2 is output to the control unit 3. The control unit 3 grasps the mounting position of the component P based on the captured image captured by the first imaging unit C1, and controls the operation of the component insertion robot 1.

  Moreover, the control means 3 has the test | inspection means 30 which test | inspects the finish of the board | substrate B after soldering. The control means 3 stores in advance information that serves as a criterion for determining whether soldering is good or bad (for example, the protruding size or shape of solder). The inspection unit 30 compares the captured image captured by the second imaging unit C2 with the information stored in advance, and determines whether the soldering is good or bad.

  In the first component mounting apparatus 100 configured as described above, first, a component P is picked up from a tray (not shown) by the component insertion robot 1. And the surface of the board | substrate B is imaged using the 1st image pickup means C1, and the insertion position (position of the through hole H) with respect to the board | substrate B is recognized. The component insertion robot 1 inserts the terminal L of the component P into the through hole H with a predetermined insertion amount, and then holds it at a predetermined position. At this time, the tip of the terminal L slightly protrudes from the back surface of the substrate B. The soldering robot 2 performs soldering by bringing the head 21 closer to the tip of the terminal L. After the soldering, the second imaging means C2 is used to image the soldered portion from the back side of the substrate B, and the soldering finish is inspected.

  According to the first component mounting apparatus 100, the insertion position (the position of the through hole H) of the component P with respect to the substrate B is specified by the first imaging unit C1, and the component P is inserted into a predetermined position. Further, since the component P is held in a state where the component P is inserted at a predetermined position by the component insertion robot 1, it is possible to perform soldering without shifting the position of the component P with respect to the substrate B. Furthermore, after the soldering, the back side of the substrate B is imaged by the second imaging means C2, so that the soldering finish can be inspected. In this way, a series of steps of component insertion, soldering, and inspection with respect to the substrate B can be performed with one apparatus. Therefore, it is not necessary to prepare a dedicated device for each process, and the device introduction cost for component mounting can be suppressed.

  Next, a second feature of the component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 2 is a schematic explanatory diagram of the second component mounting apparatus according to the present invention. In FIG. 2, components having the same functions as those of the first component mounting apparatus shown in FIG.

  As described above, when a terminal is inserted into the through hole, it is necessary to ensure a predetermined distance between the component and the substrate in order to ensure insulation. For example, in the case of a package component having conductivity, electrical conduction occurs when it comes into contact with a circuit pattern on the substrate. Conventionally, this predetermined distance (insulation distance) is maintained by inserting an insulating tube at the tip of the terminal or by specially processing the tip of the terminal. However, in this case, materials and processing steps are separately required, which has been a cause of increasing costs.

  Therefore, in the present invention, as shown in FIG. 2, the gripping state (posture) of the component P is recognized by imaging the component P gripped by the component insertion robot 1, and the terminal L protruding from the component insertion robot 1 is detected. The amount of protrusion is calculated in advance. The insertion amount of the component P (terminal L) with respect to the through hole H is adjusted according to the protruding amount of the terminal L. For this reason, every time the component insertion robot 1 holds the component P, the component P can be appropriately arranged at a predetermined position even if the holding position of the component P with respect to the gripping hand 11 changes. Therefore, a configuration for maintaining the insulation distance is unnecessary, and the cost can be suppressed.

  The second component mounting apparatus 200 shown in FIG. 2 includes a third imaging unit C3. The third imaging means C3 is disposed within the movable range of the component insertion robot 1, and images the component P held by the component insertion robot 1. In addition, the control unit 3 includes a calculation unit 31 that calculates the insertion position of the component P with respect to the board B. The calculating unit 31 calculates the position of the component P based on the captured image captured by the third imaging unit C3.

  In the second component mounting apparatus 200 configured as described above, when the component P is picked up by the component insertion robot 1, the component P gripped by the gripping hand 11 is imaged by the third imaging means C3. The captured image of the component P is output to the control unit 3, and the calculation unit 31 recognizes the holding position of the component P with respect to the gripping hand 11 (for example, the protruding amount of the terminal L) based on the captured image. The control means 3 controls the component insertion robot 1 so as to adjust the insertion position of the component P with respect to the board B based on the holding position. As a result, the component P can be inserted at an appropriate position. Further, since the soldering process is performed by the soldering robot 2 (see FIG. 1) in a state where the component P is inserted at an appropriate position by the component insertion robot 1, an insulating tube and a terminal L for maintaining an insulating distance are used. No special processing is required on the tip.

  Next, a third feature of the component mounting apparatus according to the present invention will be described with reference to FIGS. FIG. 3 is a schematic explanatory diagram of the third component mounting apparatus according to the present invention. FIG. 4 is a diagram illustrating an example of a silk pattern printed on the surface of the substrate. 3, components having the same functions as those of the component mounting apparatus shown in FIG. 1 or FIG. 2 are given the same reference numerals, or the configuration is not shown and description thereof is omitted. In FIG. 4, the surface direction of the substrate is the XY direction, and the thickness direction of the substrate (the component insertion direction with respect to the substrate) is the Z direction.

  Conventionally, when a component is automatically mounted on a board, it is necessary to check the position of the through hole for each type of board, and to fully teach the component mounting apparatus (component insertion robot) side of the insertion position of the component with respect to the board. However, it is very inefficient to check the insertion position of a component each time depending on the type of substrate on which the component is to be mounted, and there is a problem that the mounting process takes time.

  Therefore, in the present invention, as shown in FIG. 3, information such as the layout of the board B (circuit pattern and position of the through hole H) on which the component P is to be mounted and the type of the component P to be mounted is stored in advance. In addition, the insertion position of the component P is determined based on the captured image of the substrate surface imaged by the first imaging means C1. Thereby, it is not necessary to check the insertion position of the component P every time the board B is changed, and the productivity is improved.

  As shown in FIG. 3, the control means 3 of the third component mounting apparatus 300 associates the type of the component P with the component identification code S3 (see FIG. 4) provided on the substrate B, and It has the 1st storage part 32 which memorizes the insertion position of P for every classification of part P.

  Here, it is assumed that the component insertion position includes the polarity (direction) of the component, the insertion coordinates (XY), and the insertion amount (Z). For example, as shown in FIG. 4, information indicating the mounting position (insertion position) of the component P is silk-printed in advance on the surface of the substrate B on which the component P (see FIG. 3) is mounted. In FIG. 4, the rectangular frame S <b> 1 indicates the schematic shape of the component P and the mounting position (insertion position). Further, one side of the rectangular frame S1 is thickly painted in a band shape. This belt-like portion represents the polarity identification information S2 indicating the polarity direction (plus or minus direction) of the component P to be mounted.

  Further, two through holes H into which the terminals L (see FIG. 3) are inserted are formed on the outer side (right side) of the rectangular frame S1. One through hole H is connected to the plus side of the component P, and the other through hole H is connected to the minus side of the component P. In FIG. 4, the portion on which the strip-shaped polarity identification information is printed indicates the negative side of the component P. The position coordinates (XY coordinates) of these through holes H are stored as insertion coordinates of the terminal L in the first storage unit 32 (see FIG. 3).

  A component identification code S3 indicating the type of the component P is printed on the right side of the rectangular frame S1. In the example shown in FIG. 4, the part described as “C4” indicates the component identification code S3. The component identification code S3 recognizes that the component P corresponding to “C4” is mounted in the frame S1. Further, the above-described insertion position includes the insulation distance of the component P (the insertion amount of the terminal L (Z coordinate)) according to the type of the component P. Thereby, the insulation distance of the component P with respect to the board | substrate B according to the classification of the component P is securable.

  Although not shown, a reference mark for recognizing the arrangement position of the board B with respect to the component mounting apparatus 300 is formed on the board B. In the present invention, when the surface of the board B is imaged, the inclination and the positional deviation of the board B with respect to the component mounting apparatus 300 can be recognized by imaging the reference mark.

  In the third component mounting apparatus 300 configured as described above, when the component insertion robot 1 inserts the component P into the substrate B, the surface of the substrate B is imaged in advance using the first imaging unit C1. As shown in FIG. 4, the captured image captured by the first imaging unit C <b> 1 includes the type of the component P, the mounting position coordinate of the component P (position coordinate of the frame S <b> 1), the polarity identification information S <b> 2, and the through hole H. Various information indicating the insertion position of the component P such as position coordinates is included. Such information (captured image) is output to the control means 3.

  The control means 3 compares the insertion position information for each component type stored in advance in the first storage unit 32 with various information obtained from the captured image, and determines the component P from the component identification code S3 included in the captured image. And the insertion position of the part P is calculated. Then, the component insertion robot 1 is controlled based on the insertion position, and the component P is inserted at a predetermined position.

  Thus, by storing the insertion position of the component P according to the type of the component P in advance, different types of components can be obtained by recognizing the type of the component P from the captured image captured by the first imaging unit C1. Even P can be inserted at a predetermined position. Further, by including the polarity, insertion coordinates, and insertion amount of the component P as the information on the insertion position of the component P, the component P can be inserted at an appropriate position according to the information on the insertion position.

  Next, a fourth feature of the component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 5 is a schematic explanatory diagram of the fourth component mounting apparatus according to the present invention. In FIG. 5, components having the same functions as those of the component mounting apparatus shown in FIGS. 1 to 3 are given the same reference numerals, or the configuration is not shown, and the description thereof is omitted.

  In the fourth component mounting apparatus 400 shown in FIG. 5, before the component insertion robot 1 picks up the component P from the tray T, the component P on the tray T is imaged and the type of the component P is recognized in advance. It is configured to switch to the gripping hand 11 corresponding to the type.

  As shown in FIG. 5, the fourth component mounting apparatus 400 switches the gripping hand 11 in accordance with the type of the component P arranged on the tray T, picks up the component P from the tray T, and the board B (FIG. 1). It is configured to be inserted at a predetermined position on the reference). The fourth component mounting apparatus 400 includes a fourth imaging unit C4 that images the component P arranged on the tray T. The fourth imaging means C4 is provided on the transport path of the tray T, and images the component P on the tray T before the component insertion robot 1 picks up the component P.

  The component insertion robot 1 includes a gripping hand 11 that grips a component, and a gripping hand switching mechanism 12 that can switch the gripping hand 11 according to the type of the component P. The gripping hand switching mechanism 12 is composed of a tool changer, for example, and is configured to be detachable by being driven by air. For example, the gripping hands 11 are prepared in advance for each type of component P, and a plurality of gripping hands 11 are arranged at predetermined positions on a tray (not shown). As shown in FIG. 5, the gripping hand switching mechanism 12 has a plurality of gripping hands 11 (only two are shown in FIG. 5) attached to the tip of the arm 10, and the arm according to the type of the part P to be picked up. The gripping hand 11 may be switched by rotating the tip of 10.

  The control unit 3 includes a second storage unit 33 that stores the type of the component P and the type of the gripping hand 11 in association with each other. In the present invention, the type of the component P is recognized from the captured image captured by the fourth imaging unit C4, and the gripping hand 11 is switched based on the type of the gripping hand 11 corresponding to the type of the component P.

  In the fourth component mounting apparatus 400 configured as described above, when the tray T on which the plurality of components P are arranged is conveyed, the component P on the tray T is imaged by the fourth imaging unit C4. This captured image is output to the control means 3. The control unit 3 recognizes the type of the component P by comparing the information of the gripping hand 11 for each component type stored in advance in the second storage unit 33 and various information obtained from the captured image. A gripping hand 11 corresponding to the type is selected. Then, the component insertion robot 1 is controlled based on the type of the selected gripping hand 11, and the gripping hand 11 is switched.

  Thus, by storing the type of the gripping hand 11 corresponding to the type of the component P in advance, the type of the component P is recognized by recognizing the type of the component P from the captured image captured by the fourth imaging unit C4. The gripping hand 11 can be easily switched according to the type.

  Next, a series of flows of the component mounting apparatus and the component mounting process according to the present embodiment will be described with reference to FIGS. FIG. 6 is an explanatory diagram of the component mounting apparatus according to the present embodiment. FIG. 7 is a diagram illustrating an example of a component gripping process according to the present embodiment. FIG. 8 is a diagram illustrating an example of a gripping component imaging process according to the present embodiment. FIG. 9 is a diagram illustrating an example of the substrate surface imaging process according to the present embodiment. FIG. 10 is a diagram illustrating an example of a component insertion process according to the present embodiment. FIG. 11 is a diagram illustrating an example of a soldering process according to the present embodiment. FIG. 12 is a diagram illustrating an example of an inspection process according to the present embodiment.

  In the present embodiment described below, a case where all of the first to fourth component mounting apparatuses 100 to 400 described above are combined will be described. However, in the present embodiment, it is not always necessary to combine the first to fourth component mounting apparatuses 100 to 400. It is also possible to implement with only any one of the arbitrary component mounting apparatuses 100 to 400. Moreover, in this Embodiment shown below, the same code | symbol is attached | subjected about the component which has a common function with the component mounting apparatuses 100-400 shown in FIGS. 1-5 for convenience of explanation, and the detailed description is given. Omitted. Moreover, the component mounting process shown below shows an example, the order and content of each process are not limited to this, and can be changed suitably.

  As shown in FIG. 6, the component mounting apparatus 500 according to the present embodiment includes a component insertion robot 1, a soldering robot 2, first to fourth imaging units C1 to C4, and a control unit 3. Is done. The control unit 3 controls the series of operations of the component mounting apparatus 500 and includes an inspection unit 30, a calculation unit 31, a first storage unit 32, and a second storage unit 33. Each of these configurations is the same as the content described in FIGS. 1 to 5 and will not be described.

  The component mounting apparatus 500 configured as described above automatically performs a series of component mounting processes. In the mounting process of the component P, the component imaging process (see FIG. 6), the component gripping process (see FIG. 7), the gripping component imaging process (see FIG. 8), the board surface imaging process (see FIG. 9), and the component insertion process (see FIG. 10), a soldering process (see FIG. 11), and an inspection process (see FIG. 12) are performed in this order. Hereinafter, each process is demonstrated in order.

  As shown in FIG. 6, a component imaging process is first performed. In the component imaging step, when the tray T on which the plurality of components P are arranged is conveyed to the vicinity of the component insertion robot 1, the component P in the tray T is imaged from above the tray T by the fourth imaging unit C4. .

  The captured image captured by the fourth imaging unit C4 is output to the control unit 3, and the control unit 3 recognizes the type of the component P to be mounted based on the captured image. Then, the control unit 3 selects the gripping hand 11 corresponding to the type of the component P from the second storage unit 33 and uses the gripping hand switching mechanism 12 to switch to the optimal gripping hand 11 so as to switch to the component insertion robot 1. To control the operation.

  Next, a component gripping process is performed. As shown in FIG. 7, in the component gripping process, the component insertion robot 1 picks up the component P on the tray T using the gripping hand 11. The position coordinates of the component P to be picked up may be recognized from the captured image previously captured by the fourth imaging means C4 (see FIG. 6).

  Next, a gripping component imaging process is performed. As shown in FIG. 8, in the gripping part imaging step, the part P picked up from the tray T (see FIG. 7) is imaged by the third imaging means C3. At this time, the angle of the arm 10 is adjusted so that the extending direction of the terminal L is perpendicular to the imaging direction of the third imaging unit C3, so that the terminal L falls within the imaging range of the third imaging unit C3. The position of the arm 10 is adjusted.

  In the calculation means 31 (see FIG. 6), the protrusion amount of the terminal L with respect to the gripping hand 11 is recognized based on the captured image picked up by the third image pickup means C3, and the component P (terminal) corresponding to the protrusion amount of the terminal L The optimal insertion amount of L) is calculated. In the gripping component imaging process, the imaging is performed with the angle of the arm 10 adjusted so that the extending direction of the terminal L is perpendicular to the imaging direction of the third imaging unit C3. It is not limited to the configuration. The imaging direction of the component P gripped by the gripping hand 11 can be changed as appropriate. For example, the part P may be imaged in a plurality of directions to recognize not only the protruding amount of the terminal L but also the positional deviation, inclination, etc. of the part P with respect to the gripping hand 11.

  Next, a substrate surface imaging step is performed. As shown in FIG. 9, in the substrate surface imaging step, the surface of the substrate B is imaged by the first imaging means C1. The picked-up image picked up by the first image pickup means C1 includes a silk pattern and a through hole H around the mounting position of the component P (see FIG. 4). This captured image is output to the control means 3, and the control means 3 recognizes the type of the component P to be mounted based on this captured image.

  Next, a component insertion process is performed. As shown in FIG. 10, in the component insertion process, the component insertion robot 1 inserts the component P at a predetermined position on the board B. As described above, when the type of the component P is recognized in the board surface imaging step, the control means 3 (see FIG. 6), the mounting position (see FIG. 6) of the component P according to the type of the component P from the first storage unit 32 (see FIG. 6). The terminal L insertion position) is searched. Then, the control means 3 controls the operation of the component insertion robot 1 according to the retrieved mounting position of the component P. Thereby, the component P is inserted into an appropriate position while maintaining a predetermined insulation distance with respect to the board B.

  Next, a soldering process is performed. As shown in FIG. 11, in the soldering process, soldering is performed on the terminals L protruding from the back surface of the substrate B. As described above, when the terminal L is inserted into the substrate B, the tip of the terminal L slightly protrudes from the back surface of the substrate B, and the package portion of the component P is a predetermined distance (insulation distance) from the surface to the substrate B. It is held in a state separated by the amount of.

  On the back side of the substrate B, the tip of the head 21 is positioned near the tip of the terminal L by the soldering robot 2 and soldering is performed. Thereby, the component P is mounted at a predetermined position on the board B. As described above, since the component insertion robot 1 performs soldering while the terminal L is inserted and held in the through hole H, a configuration for maintaining the insulation distance becomes unnecessary.

  Next, an inspection process is performed. As shown in FIG. 12, in the inspection process, the finish of soldering is inspected. Specifically, the second image pickup unit C2 picks up an image of the soldered portion from the back side of the substrate B, and outputs the picked-up image to the control unit 3 (see FIG. 6). The inspection unit 30 determines whether the soldering is good or bad by comparing information that is stored in the control unit 3 in advance as a criterion for determining whether the soldering is good and the captured image captured by the second imaging unit C2. carry out. Thus, a series of flow of the component mounting process according to the present embodiment is completed.

  Note that while the inspection process is being performed by the soldering robot 2, the component insertion robot 1 may start picking up the component P to be mounted next (component gripping step). Since the component insertion robot 1 after soldering has a waiting time during the inspection process, the time can be effectively utilized by shifting to the next component mounting process. That is, it is preferable that the inspection process be performed before the component insertion robot 1 picks up a new component P and inserts it into the substrate B. Thereby, the time for the inspection process is not required and the tact time can be shortened.

  As described above, according to the component mounting apparatus 500 according to the present embodiment, a series of component mounting processes can be performed by one apparatus. Therefore, when a dedicated apparatus is prepared for each process. In comparison, the introduction cost of a device for component mounting can be suppressed.

  In addition, this invention is not limited to the said embodiment, It can implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited thereto, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the above-described embodiment, the component P is picked up (gripped) by the gripping hand 11, but is not limited to this configuration. For example, the component P may be picked up with a suction type hand.

  Moreover, in the said embodiment, although the component insertion robot 1 and the soldering robot 2 were comprised with the 6-axis articulated robot, it is not limited to this structure. The component insertion robot 1 and the soldering robot 2 may be constituted by, for example, a three-axis type robot.

  Moreover, in the said embodiment, although it was set as the structure which implements a board | substrate surface imaging process after the components insertion robot 1 picks up the components P from the tray T, it is not limited to this configuration. The board surface imaging process may be performed at any timing before the component P is inserted into the board B. For example, the board surface imaging process may be performed before the component gripping process.

  Moreover, in the said embodiment, although the control means 3 was set as the structure which has the 1st memory | storage part 32 or the 2nd memory | storage part 33, it is not limited to this structure. The first storage unit 32 or the second storage unit 33 may be configured to store various types of information in an external storage medium.

  As described above, the present invention has an effect that a series of component mounting steps can be performed by a single device, and is particularly useful for a component mounting device for mounting an electronic component having terminals. .

100, 200, 300, 400, 500 Component mounting apparatus 1 Component insertion robot 11 Grasping hand 12 Grasping hand switching mechanism 2 Soldering robot 3 Control unit 30 Inspection unit 31 Calculation unit 32 First storage unit 33 Second storage unit B Substrate H Through-hole P Component L Terminal C1 First imaging means C2 Second imaging means C3 Third imaging means C4 Fourth imaging means

A component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate, and the terminal of the component is connected to the substrate with respect to the through hole. comprising a component insertion robot for holding and inserted into holes, the soldering robot soldering the terminals of the component inserted into the substrate to the substrate, wherein the component insertion robot, provided below the substrate is, the soldering robot is characterized Rukoto provided above the substrate.

Moreover, in the said embodiment, although the control means 3 was set as the structure which has the 1st memory | storage part 32 or the 2nd memory | storage part 33, it is not limited to this structure. The first storage unit 32 or the second storage unit 33 may be configured to store various types of information in an external storage medium.
Here, the component mounting apparatus is a component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate, and the terminal of the component is connected to the substrate with respect to the through hole. A component insertion robot that is inserted into and held in a hole; a control unit that controls an operation of the component insertion robot; a soldering robot that solders the terminal of the component inserted into the substrate to the substrate; and the solder An inspection unit that inspects the finish of the component soldered by the attachment robot and the substrate, and the component insertion robot includes a first imaging unit that images the substrate, and the soldering robot includes: A second imaging unit configured to image the board; and the control unit moves the component insertion robot based on a captured image captured by the first imaging unit. Controls, the inspection means inspects the finished soldering based on the captured image captured by the second imaging means.
According to this configuration, the insertion position (the position of the through hole) of the component with respect to the substrate is specified by the first imaging unit, and the component is inserted at a predetermined position. Further, since the component is held in a state where the component is inserted at a predetermined position by the component insertion robot, it is possible to perform soldering without shifting the position of the component with respect to the substrate. Further, after the soldering, the image of the substrate is picked up by the second image pickup means, so that the soldering finish can be inspected. In this way, a series of steps of component insertion, soldering, and inspection with respect to the substrate can be performed with one apparatus. Therefore, it is not necessary to prepare a dedicated device for each process, and the device introduction cost for component mounting can be suppressed.
In addition, the component mounting apparatus further includes a third imaging unit that images the component held by the component insertion robot, and the control unit is configured based on a captured image captured by the third imaging unit. It is preferable to adjust the insertion position of the component with respect to the substrate. According to this configuration, the holding position of the component held by the component insertion robot can be recognized from the captured image captured by the third imaging unit. Then, by adjusting the insertion position of the component based on the holding position, the component can be inserted at an appropriate position.
The component mounting apparatus further includes a calculation unit that calculates an insertion position of the component, and the calculation unit calculates the insertion position of the component based on a captured image captured by the third imaging unit. It is preferable. According to this configuration, even when the component holding position is shifted each time the component insertion robot holds the component, the component insertion position is calculated based on the captured image, so that the component can be positioned at an appropriate position. Can be inserted into.
The component mounting apparatus associates a type of the component with a component identification code provided on the board, and stores the insertion position of the component with respect to the board for each type of the component. The control unit recognizes the type of the component from the component identification code included in the captured image captured by the first imaging unit, and sets the component insertion position corresponding to the type of the component. It is preferable to control the operation of the component insertion robot based on this. According to this configuration, the component insertion position corresponding to the component type is stored in advance, so that the component type can be recognized by recognizing the component type from the captured image captured by the first imaging unit. However, it can be inserted at a predetermined position.
In the component mounting apparatus, it is preferable that the insertion position of the component includes a polarity, an insertion coordinate, and an insertion amount of the component. According to this configuration, the component can be inserted at an appropriate position according to the polarity of the component, the insertion coordinates, and the insertion amount.
In the component mounting apparatus, the component insertion robot includes a gripping hand that grips the component, and a gripping hand switching mechanism that can switch the gripping hand according to a type of the component. A fourth imaging unit that images the part before being held by the robot; and a second storage unit that stores the type of the part and the type of the gripping hand corresponding to the part in association with each other. The control unit recognizes the type of the component from the captured image captured by the fourth imaging unit, and switches the gripping hand based on the type of the gripping hand corresponding to the type of the component. It is preferable to control the operation of the component insertion robot. According to this configuration, the gripping hand corresponding to the type of the part is stored in advance, so that the type of the part can be recognized from the captured image captured by the fourth imaging unit, thereby easily switching the gripping hand. Can be done.

A component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate, and the terminal of the component is connected to the substrate with respect to the through hole. A component insertion robot that is inserted into and held in a hole; a soldering robot that solders the terminal of the component inserted into the substrate to the substrate; and an inspection unit that inspects the soldering finish by the soldering robot. The component insertion robot is provided below the substrate, the soldering robot is provided above the substrate , the soldering robot has an arm, and images the substrate and the soldering location. A second imaging means and a soldering head are provided at a common tip of the arm, and the second arm is operated by soldering, thereby operating the second And captures an image by moving the component and the substrate the image means is soldered to the imaging position capable, characterized in that said inspecting means for inspecting the finish of soldering on the basis of the captured image.

The soldering robot 2 is composed of, for example, a 6-axis articulated robot having an arm 20 that connects a plurality of links, and is provided on the back side (upper side) of the substrate B. A soldering head 21 is attached to the tip of the arm 20. The soldering robot 2 may be configured by using the same 6-axis articulated robot as the component insertion robot 1 and attaching a soldering head 21 instead of the gripping hand 11. Further, in the vicinity of the head 21 at the tip of the arm 20 , a second imaging unit C 2 that images the back surface of the substrate B is provided.

A component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate, and the terminal of the component is connected to the substrate with respect to the through hole. A component insertion robot that is inserted into and held in a hole; a soldering robot that solders the terminals of the component inserted into the substrate to the substrate; and an inspection unit that inspects the soldering finish by the soldering robot ; The control means for controlling the operation of the component insertion robot is associated with the component type and the component identification code provided on the substrate, and the insertion position of the component with respect to the substrate is stored for each component type. and a first storage unit that, the component insertion robot comprises a first imaging means for imaging the substrate, the component insertion robot, below the substrate The soldering robot is provided above the substrate, the soldering robot has an arm, and a second imaging means for imaging the substrate and the soldering portion and a soldering head are provided. Provided at the tip of the common arm, and operating the arm after soldering, the second imaging means moves the soldered component and the board to a position where they can be imaged and captures the captured image. The inspection means inspects the soldering finish based on the captured image, and the control means controls the operation of the component insertion robot based on the captured image captured by the first imaging means. , Recognizing the type of the component from the component identification code included in the captured image captured by the first imaging unit, and based on the insertion position of the component corresponding to the type of the component. And controlling the operation of the component insertion robot Te.
The component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate, and the terminal of the component is mounted on the substrate. A component insertion robot that is inserted into and held in the through hole, a soldering robot that solders the terminals of the component inserted into the substrate to the substrate, and an inspection that inspects the soldering finish by the soldering robot Means, control means for controlling the operation of the component insertion robot, third imaging means for imaging the component held by the component insertion robot, and calculation means for calculating the insertion position of the component, The component insertion robot includes a first imaging unit that images the board and an arm, and the extension direction of the terminal is perpendicular to the imaging direction of the third imaging unit. And adjusting the angle and position of the arm so that the terminal enters the imaging range of the third imaging means, the component insertion robot is provided below the substrate, and the soldering robot is the substrate The soldering robot has an arm, and a second imaging means for imaging the substrate and the soldering location and a soldering head are provided at a common arm tip, By moving the arm after attaching, the component and the substrate to which the second imaging means is soldered are moved to a position where the imaging is possible, and a captured image is captured, and the inspection is performed based on the captured image. The means inspects the finish of soldering, and the control means controls the operation of the component insertion robot based on the captured image captured by the first imaging means, and the third imaging hand Adjusting the insertion position of the component with respect to the substrate based on the captured image captured by the third image capturing device, and the calculating means removing the component by the component insertion robot based on the captured image captured by the third imaging means. Recognizing the holding position of the component with respect to the gripping hand to be gripped, and calculating the insertion position of the component with respect to the board based on the holding position, the component insertion position includes the polarity, insertion coordinates, and insertion amount of the component. Is included.
The component mounting apparatus according to the present invention is a component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate, and the terminal of the component is mounted on the substrate. A component insertion robot that is inserted and held in the through hole, a soldering robot that solders the terminal of the component inserted into the substrate to the substrate, and an inspection that inspects the soldering finish by the soldering robot Means, control means for controlling the operation of the component insertion robot, fourth imaging means for imaging the component before being held by the component insertion robot, and the gripping hand corresponding to the type of the component and the component A second storage unit that stores the type of the first and second storage units in association with each other. The component insertion robot includes a first imaging unit that images the board and a grip that grips the component. And a gripping hand switching mechanism capable of switching the gripping hand according to the type of the component, the component insertion robot is provided below the substrate, and the soldering robot is mounted on the substrate. Provided above, the soldering robot has an arm, and a second imaging means for imaging the board and the soldering location and a soldering head are provided at a common tip of the arm, and soldering Then, by operating the arm, the component and the substrate to which the second imaging unit is soldered are moved to a position where the image can be captured, and a captured image is captured. Based on the captured image, the inspection unit Inspects the finish of soldering, and the control means controls the operation of the component insertion robot based on a captured image picked up by the first image pickup means, and the fourth image pickup means. Therefore, the type of the component is recognized from the captured image, and the operation of the component insertion robot is controlled so as to switch the gripping hand based on the type of the gripping hand corresponding to the type of the component. To do.

Claims (6)

A component mounting apparatus for mounting a component having a terminal inserted into a through hole formed in a substrate,
A component insertion robot that inserts and holds the terminal of the component into the through hole with respect to the substrate;
Control means for controlling the operation of the component insertion robot;
A soldering robot for soldering the terminal of the component inserted into the board to the board;
Inspecting means for inspecting the finish of the component and the substrate soldered by the soldering robot,
The component insertion robot has first imaging means for imaging the board,
The soldering robot has a second imaging means for imaging the substrate,
The control unit controls the operation of the component insertion robot based on a captured image captured by the first imaging unit,
The component mounting apparatus, wherein the inspection unit inspects a finish of soldering based on a captured image captured by the second imaging unit. A third imaging means for imaging the component held by the component insertion robot;
The component mounting apparatus according to claim 1, wherein the control unit adjusts an insertion position of the component with respect to the substrate based on a captured image captured by the third imaging unit. A calculation means for calculating an insertion position of the component;
The component mounting apparatus according to claim 2, wherein the calculation unit calculates an insertion position of the component based on a captured image captured by the third imaging unit. A first storage unit that associates the type of the component with a component identification code provided on the substrate, and stores the insertion position of the component with respect to the substrate for each type of the component;
The control unit recognizes the type of the component from the component identification code included in the captured image captured by the first imaging unit, and the component based on the insertion position of the component corresponding to the type of the component The component mounting apparatus according to claim 1, wherein the operation of the insertion robot is controlled.   The component mounting apparatus according to claim 3, wherein the insertion position of the component includes a polarity, an insertion coordinate, and an insertion amount of the component. The component insertion robot has a gripping hand for gripping the component, and a gripping hand switching mechanism capable of switching the gripping hand according to the type of the component,
Fourth imaging means for imaging the component before being held by the component insertion robot;
A second storage unit that stores the type of the component and the type of the gripping hand corresponding to the component in association with each other;
The control unit recognizes the type of the component from a captured image captured by the fourth imaging unit, and switches the gripping hand based on the type of the gripping hand corresponding to the type of the component. 6. The component mounting apparatus according to claim 1, wherein the operation of the insertion robot is controlled.

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