JPH0443459U - - Google Patents
Info
- Publication number
- JPH0443459U JPH0443459U JP8345890U JP8345890U JPH0443459U JP H0443459 U JPH0443459 U JP H0443459U JP 8345890 U JP8345890 U JP 8345890U JP 8345890 U JP8345890 U JP 8345890U JP H0443459 U JPH0443459 U JP H0443459U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- molten solder
- channels
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図および第2図は本考案の一実施例を示す
もので共にはんだ槽を示す部分側断面図である。
3……プリント基板、4……1次ノズル、4a
……第1の噴出し口、4b……第2の噴出し口、
5……2次ノズル、7……第1の流路、8……第
2の流路、10……ダンパー、20……電子部品
。
FIGS. 1 and 2 show an embodiment of the present invention, and both are partial side sectional views showing a solder bath. 3...Printed circuit board, 4...Primary nozzle, 4a
...first spout, 4b...second spout,
5... Secondary nozzle, 7... First channel, 8... Second channel, 10... Damper, 20... Electronic component.
Claims (1)
ズルがはんだ付けすべきプリント基板の搬送方向
に沿つて順次配設され、前記プリント基板を前記
1次ノズルおよび前記2次ノズルより噴流された
溶融はんだ上を順次接触通過させることによつて
前記プリント基板に付設された電子部品を該プリ
ント基板にはんだ付けするよう構成された噴流式
はんだ付け装置において、 前記1次ノズルの内部を少なくとも先端部にお
いて前記プリント基板の搬送方向に対して2つの
流路に分け、これら双方の流路の先端にそれぞれ
噴出し口を形成すると共に、前記各流路の少なく
とも一方に該流路を流れる溶融はんだの流量を調
整するためのダンパーを設けたことを特徴とする
噴流式はんだ付け装置。[Claims for Utility Model Registration] A primary nozzle and a secondary nozzle that jet molten solder are arranged in sequence along the conveying direction of a printed circuit board to be soldered, and the printed circuit board is In a jet soldering apparatus configured to solder electronic components attached to the printed circuit board to the printed circuit board by successively contacting and passing over molten solder jetted from a nozzle, the primary nozzle comprises: The interior is divided into two channels in the conveying direction of the printed circuit board at least at the tip, and a jetting port is formed at the tip of each of these channels, and at least one of the channels is provided with a flow channel. A jet soldering device characterized by being provided with a damper for adjusting the flow rate of molten solder flowing through the molten solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990083458U JPH0811077Y2 (en) | 1990-08-07 | 1990-08-07 | Jet soldering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990083458U JPH0811077Y2 (en) | 1990-08-07 | 1990-08-07 | Jet soldering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0443459U true JPH0443459U (en) | 1992-04-13 |
JPH0811077Y2 JPH0811077Y2 (en) | 1996-03-29 |
Family
ID=31631148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990083458U Expired - Lifetime JPH0811077Y2 (en) | 1990-08-07 | 1990-08-07 | Jet soldering equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0811077Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61289965A (en) * | 1985-06-17 | 1986-12-19 | Meisho Kk | Jet type solder tank |
JPS63199065A (en) * | 1987-02-12 | 1988-08-17 | Kenji Kondo | Jet solder tank |
-
1990
- 1990-08-07 JP JP1990083458U patent/JPH0811077Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61289965A (en) * | 1985-06-17 | 1986-12-19 | Meisho Kk | Jet type solder tank |
JPS63199065A (en) * | 1987-02-12 | 1988-08-17 | Kenji Kondo | Jet solder tank |
Also Published As
Publication number | Publication date |
---|---|
JPH0811077Y2 (en) | 1996-03-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5769305A (en) | Apparatus for wave soldering printed wiring boards | |
MY124946A (en) | Automatic wave soldering apparatus and method | |
JPH0443459U (en) | ||
JPS6113156Y2 (en) | ||
JPS6187658U (en) | ||
JPH03116259U (en) | ||
JP2785002B2 (en) | Printed circuit board soldering equipment | |
JPS63242466A (en) | Jet type soldering device | |
JPH0451022Y2 (en) | ||
JPH0447862U (en) | ||
JPS54100955A (en) | Solder equipment | |
JPS591500B2 (en) | Jet soldering equipment | |
JPS6121170Y2 (en) | ||
JPS6433366U (en) | ||
JPH0480658U (en) | ||
JPH0196260U (en) | ||
JPS63202472U (en) | ||
JPS59164270U (en) | Printed circuit board soldering equipment | |
JPH0487559U (en) | ||
JPS5973071U (en) | automatic soldering equipment | |
JPS6418569A (en) | Soldering wave former | |
JPS5954163U (en) | soldering equipment | |
JPH0376657U (en) | ||
JPS6415658U (en) | ||
JPH0160765U (en) |