JPS59164270U - Printed circuit board soldering equipment - Google Patents
Printed circuit board soldering equipmentInfo
- Publication number
- JPS59164270U JPS59164270U JP5848083U JP5848083U JPS59164270U JP S59164270 U JPS59164270 U JP S59164270U JP 5848083 U JP5848083 U JP 5848083U JP 5848083 U JP5848083 U JP 5848083U JP S59164270 U JPS59164270 U JP S59164270U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- circuit board
- soldering equipment
- board soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例を示す縦断面図、第２図は第
１図のもののハンダ吹口体を示す斜視図、第３図は第２
図のものを示す平面図、第４図はプリント基板の一例を
示す斜視図、第５図は第４図のものの一部を示す斜視図
、第６図はプリント基板が複数個のハンダ吹口体上を通
過する状態におけるハンダ吹口部を示す縦断面図、第７
図はハンダ付けされたプリント基板を示す平面図である
。
１・・・ハンダ溶解槽、２・・・チャンバー、６・・・
ハン 、ダ吹ロ部、８・・・ハンダ吹口体、９・・
・可動板、９ａ・・・可動板の長孔、１０・・・止具、
１１・・・螺ナツト、２０・・・プリント基板。Fig. 1 is a longitudinal sectional view showing one embodiment of the present invention, Fig. 2 is a perspective view showing the solder spout body of Fig.
FIG. 4 is a perspective view showing an example of a printed circuit board, FIG. 5 is a perspective view of a part of the circuit board shown in FIG. 4, and FIG. 7th longitudinal cross-sectional view showing the solder outlet in a state where it passes over the solder outlet;
The figure is a plan view showing a soldered printed circuit board. 1...Solder melting tank, 2...Chamber, 6...
Hand, solder blowing part, 8... solder blowing mouth body, 9...
・Movable plate, 9a...long hole of movable plate, 10...stop,
11...Screw nut, 20...Printed circuit board.
Claims (1)
口体の上端開口から吹上げられた溶融ハンダによりプリ
ント基板のハンダ付けすべき部分全てにハンダ付０を施
せるように、プリント基板の進行方向およびその進行方
向と交差する方向に相互に間隔をあけて並設し、各ハン
ダ吹口体にハンダ吹口体の溶融ハンダ流入部の開口面積
を可変とする可動板を設けたことを特徴とするプリント
基板のハンダ付は装置。A plurality of cylindrical solder nozzles are erected, and the printed circuit board is heated so that all the parts of the printed circuit board to be soldered can be soldered with the molten solder blown up from the upper end opening of each solder nozzle. The present invention is characterized in that movable plates are arranged in parallel at intervals in the traveling direction and the direction crossing the traveling direction, and each solder spout body is provided with a movable plate that changes the opening area of the molten solder inflow portion of the solder spout body. A device is used to solder printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5848083U JPS59164270U (en) | 1983-04-19 | 1983-04-19 | Printed circuit board soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5848083U JPS59164270U (en) | 1983-04-19 | 1983-04-19 | Printed circuit board soldering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59164270U true JPS59164270U (en) | 1984-11-02 |
Family
ID=30188759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5848083U Pending JPS59164270U (en) | 1983-04-19 | 1983-04-19 | Printed circuit board soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59164270U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4517151Y1 (en) * | 1969-07-15 | 1970-07-15 | ||
| JPS5010433U (en) * | 1973-05-29 | 1975-02-03 | ||
| JPS5437783U (en) * | 1977-08-20 | 1979-03-12 | ||
| JPS5858795A (en) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | Soldering device |
-
1983
- 1983-04-19 JP JP5848083U patent/JPS59164270U/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4517151Y1 (en) * | 1969-07-15 | 1970-07-15 | ||
| JPS5010433U (en) * | 1973-05-29 | 1975-02-03 | ||
| JPS5437783U (en) * | 1977-08-20 | 1979-03-12 | ||
| JPS5858795A (en) * | 1981-10-03 | 1983-04-07 | 石井 銀弥 | Soldering device |
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