JPS6415658U - - Google Patents
Info
- Publication number
- JPS6415658U JPS6415658U JP10950087U JP10950087U JPS6415658U JP S6415658 U JPS6415658 U JP S6415658U JP 10950087 U JP10950087 U JP 10950087U JP 10950087 U JP10950087 U JP 10950087U JP S6415658 U JPS6415658 U JP S6415658U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- utility
- model registration
- soldering
- solder liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第３図は本考案に依る半田付け装置
の実施例を示し、第１図は案田槽内のノズル配置
を示す図、第２図、第３図は半田液の流れ状態の
説明図、第４図は他の実施例の説明図、第５図は
従来装置の説明図。
２……半田液槽、４Ａ，４Ｂ……ノズル、１０
Ａ，１０Ｂ……半田液。
1 to 3 show an embodiment of the soldering device according to the present invention, FIG. 1 shows the nozzle arrangement in the soldering tank, and FIGS. 2 and 3 show the flow state of the solder liquid. FIG. 4 is an explanatory diagram of another embodiment, and FIG. 5 is an explanatory diagram of a conventional device. 2...Solder liquid tank, 4A, 4B...Nozzle, 10
A, 10B...Solder liquid.
Claims (1)
路基板を半田液槽上を通過させ半田液によつて前
記回路素子等を半田付けする装置において、 前記半田液を噴出するノズルを複数のノズル口
に分けたことを特徴とする半田付け装置。 (2) 前記ノズル口を開閉制御する開閉弁を設け
たことを特徴とする実用新案登録請求の範囲第(1
)項記載の半田付け装置。 (3) 前記複数のノズル口の少なくとも１つはノ
ズル口の周壁の移動によつてノズル面積を変更で
きるようにしたことを特徴とする実用新案登録請
求の範囲第(2)項記載の半田付け装置。 (4) 前記複数のノズル口の少なくとも一部のノ
ズル口に複数のノズル噴出開口部を設けた開口部
材を有することを特徴とする実用新案登録請求の
範囲第(1)項乃至第(3)項記載の半田付け装置。[Scope of Claim for Utility Model Registration] (1) In an apparatus for passing a circuit board on which circuit elements, etc. to be soldered are attached, over a solder liquid tank, and soldering the circuit elements, etc. with the solder liquid, the solder liquid A soldering device characterized in that a nozzle that spouts out is divided into a plurality of nozzle ports. (2) Utility model registration claim No. (1) characterized in that an on-off valve for controlling opening and closing of the nozzle opening is provided.
Soldering device described in ). (3) The soldering device according to claim (2) of the utility model registration, characterized in that at least one of the plurality of nozzle ports is configured such that the nozzle area can be changed by moving the peripheral wall of the nozzle port. Device. (4) Utility model registration claims (1) to (3) characterized in that at least some of the plurality of nozzle ports have an opening member in which a plurality of nozzle ejection openings are provided. Soldering equipment as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10950087U JPS6415658U (en) | 1987-07-16 | 1987-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10950087U JPS6415658U (en) | 1987-07-16 | 1987-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6415658U true JPS6415658U (en) | 1989-01-26 |
Family
ID=31345798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10950087U Pending JPS6415658U (en) | 1987-07-16 | 1987-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6415658U (en) |
-
1987
- 1987-07-16 JP JP10950087U patent/JPS6415658U/ja active Pending
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