JPH0439558U - - Google Patents
Info
- Publication number
- JPH0439558U JPH0439558U JP7782490U JP7782490U JPH0439558U JP H0439558 U JPH0439558 U JP H0439558U JP 7782490 U JP7782490 U JP 7782490U JP 7782490 U JP7782490 U JP 7782490U JP H0439558 U JPH0439558 U JP H0439558U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- adjusting
- port
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Molten Solder (AREA)
Description
第１図、第５図乃至第７図ａ，ｂ，ｃは本考案
の一実施例であり、第１図は半田噴流装置の斜視
図、第２図及び第３図は従来の半田噴流装置の一
例を示すもので、第２図は半田噴流装置の概略図
、第３図は第２図の−線矢視方向の拡大断面
図、第４図ａ，ｂは他の従来例の作用を示す断面
図、第５図はパルスモータの駆動制御回路を示す
ブロツク図、第６図はパルスモータの制御フロー
チヤート、第７図ａ，ｂ，ｃは本考案の作用を示
す概略図である。
図中、２……半田槽、３……噴流口、４……噴
流筒、５……ポンプ、７……幅長さ調整板、８…
…パルスモータ、９……高さ調整板、１０……リ
ンク機構、ＦＨ……噴流半田、ＩＨ……印刷配線
板、ＦＪ……噴流上面。
1, 5 to 7 a, b, and c show an embodiment of the present invention, FIG. 1 is a perspective view of a solder jet device, and FIGS. 2 and 3 are conventional solder jet devices. Fig. 2 is a schematic diagram of a solder jet device, Fig. 3 is an enlarged sectional view taken in the direction of - arrow in Fig. 2, and Fig. 4 a and b show the operation of another conventional example. 5 is a block diagram showing a drive control circuit for the pulse motor, FIG. 6 is a control flowchart for the pulse motor, and FIGS. 7a, b, and c are schematic diagrams showing the operation of the present invention. In the figure, 2... Solder tank, 3... Jet port, 4... Jet tube, 5... Pump, 7... Width/length adjusting plate, 8...
...Pulse motor, 9...Height adjustment plate, 10...Link mechanism, FH...Solder jet, IH...Printed wiring board, FJ...Top surface of jet.
Claims (1)
内に配置されかつ上端に噴流口を有する噴流筒と
、該半田槽内の溶融半田を該噴流筒を通じて該噴
流口から上方に押し出すポンプとを具備した半田
噴流装置において、 前記噴流筒の噴流口の一方の側部には、該噴流
口から押し出され前記半田槽に向かつて落下する
噴流半田の幅長さを調整する幅長さ調整板を設け
、 前記噴流口の一方の側部と対向する他方の側部
には、前記噴流半田の噴出高さを調整する高さ調
整板を設け、 前記各調整板は駆動源に連結したリンク機構を
介して連結した ことを特徴とする半田噴流装置。[Scope of Claim for Utility Model Registration] A solder tank that stores solder in a molten state, a jet tube disposed within the solder tank and having a jet port at the upper end, and a jet tube that allows the molten solder in the solder tank to flow through the jet tube. In the solder jet device equipped with a pump that pushes upward from the jet port, one side of the jet port of the jet tube has a width length of the solder jet that is pushed out from the jet port and falls toward the solder tank. a width and length adjusting plate for adjusting the height of the solder jet, and a height adjusting plate for adjusting the spouting height of the solder jet on the other side opposite to one side of the jet port, and each of the adjusting plates A solder jet device is characterized in that it is connected via a link mechanism connected to a drive source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7782490U JPH0439558U (en) | 1990-07-24 | 1990-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7782490U JPH0439558U (en) | 1990-07-24 | 1990-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0439558U true JPH0439558U (en) | 1992-04-03 |
Family
ID=31620560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7782490U Pending JPH0439558U (en) | 1990-07-24 | 1990-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0439558U (en) |
-
1990
- 1990-07-24 JP JP7782490U patent/JPH0439558U/ja active Pending
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