JPH021564U - - Google Patents
Info
- Publication number
- JPH021564U JPH021564U JP7828688U JP7828688U JPH021564U JP H021564 U JPH021564 U JP H021564U JP 7828688 U JP7828688 U JP 7828688U JP 7828688 U JP7828688 U JP 7828688U JP H021564 U JPH021564 U JP H021564U
- Authority
- JP
- Japan
- Prior art keywords
- solder melt
- jet
- tank
- solder
- storage tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図はこの考案の一実施例を示す斜視図、第
2図は第1図の―線による断面図、第3図は
第2図の動作を示す断面図、第4図は従来のはん
だ槽を示す斜視図、第5図は第4図の―線に
よる断面図、第6図は第5図の動作を示す断面図
である。
図中、1はプリント基板、11ははんだ槽、1
2ははんだ融液、12aは噴流波、12bは貯溜
部、12cは溢流波、13は噴流槽、14は噴流
口、15は貯溜槽、16は側板、17は堰板、1
8は流出部、20は調整ねじ、31は可動堰板、
32は傾斜板である。
Fig. 1 is a perspective view showing an embodiment of this invention, Fig. 2 is a sectional view taken along the - line in Fig. 1, Fig. 3 is a sectional view showing the operation of Fig. 2, and Fig. 4 is a conventional solder. FIG. 5 is a sectional view taken along the line --- in FIG. 4, and FIG. 6 is a sectional view showing the operation of FIG. 5. In the figure, 1 is a printed circuit board, 11 is a solder bath, 1
2 is solder melt, 12a is a jet wave, 12b is a reservoir, 12c is an overflow wave, 13 is a jet tank, 14 is a jet port, 15 is a storage tank, 16 is a side plate, 17 is a weir plate, 1
8 is an outflow part, 20 is an adjustment screw, 31 is a movable weir plate,
32 is an inclined plate.
Claims (1)
流槽の噴流口に、前記はんだ融液をプリント基板
の走行方向に対して反対方向へ噴出して噴流波を
形成させるとともに、前記はんだ融液を貯溜する
貯溜槽を設け、この貯溜槽内の前記はんだ融液を
溢流させて溢流波を形成する可動堰板を設けたは
んだ槽において、前記可動堰板に前記溢流するは
んだ融液を傾斜面に沿つて流下させる傾斜板を形
成し、前記可動堰板を所要の高さに設定する調整
手段を前記貯溜槽に設けたことを特徴とするはん
だ槽。 A jet tank for jetting the solder melt is provided, and the solder melt is jetted from the jet port of the jet tank in a direction opposite to the running direction of the printed circuit board to form a jet wave, and the solder melt is In a soldering tank provided with a storage tank for storing the solder melt and a movable weir plate that causes the solder melt in the storage tank to overflow and form an overflow wave, the overflowing solder melt is allowed to flow onto the movable weir plate. 1. A solder bath, characterized in that said storage tank is provided with an adjusting means for forming an inclined plate that flows down along an inclined surface and setting said movable weir plate to a required height.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7828688U JPH021564U (en) | 1988-06-15 | 1988-06-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7828688U JPH021564U (en) | 1988-06-15 | 1988-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH021564U true JPH021564U (en) | 1990-01-08 |
Family
ID=31303222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7828688U Pending JPH021564U (en) | 1988-06-15 | 1988-06-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH021564U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5327227A (en) * | 1976-08-25 | 1978-03-14 | Nisshin Kogyo Kk | Waterproofing material and heat insulating waterproof material |
-
1988
- 1988-06-15 JP JP7828688U patent/JPH021564U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5327227A (en) * | 1976-08-25 | 1978-03-14 | Nisshin Kogyo Kk | Waterproofing material and heat insulating waterproof material |