JPS63174964U - - Google Patents

Info

Publication number
JPS63174964U
JPS63174964U JP6514087U JP6514087U JPS63174964U JP S63174964 U JPS63174964 U JP S63174964U JP 6514087 U JP6514087 U JP 6514087U JP 6514087 U JP6514087 U JP 6514087U JP S63174964 U JPS63174964 U JP S63174964U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
upper edge
bath
overflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6514087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6514087U priority Critical patent/JPS63174964U/ja
Publication of JPS63174964U publication Critical patent/JPS63174964U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の自動半田付装置の中央縦断
側面図、第2図は、同上縦断側面図である。 1……半田槽、2……上昇路、2′……湧出口
、3,4,6……調整板、5……振動浴、8……
振動板。
FIG. 1 is a central longitudinal sectional side view of the automatic soldering apparatus of the present invention, and FIG. 2 is a longitudinal sectional side view of the same. 1... Solder tank, 2... Rising path, 2'... Outlet, 3, 4, 6... Adjustment plate, 5... Vibration bath, 8...
diaphragm.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半田浴槽内に縦方向の上昇路を形成して、その
上端を湧出口となし、該湧出口のプリント基板進
入側上縁を、これと相対する他側上縁より低くし
て、この部分から熔融半田をプリント基板の進行
方向に対向して溢流せしめるようにすると共に該
溢流部に振動板を浸設した振動浴を連設してなる
自動半田付装置。
A vertical ascending path is formed in the solder bath, the upper end of which is used as a gushing hole, and the upper edge of the gushing hole on the printed circuit board entry side is lower than the opposing upper edge of the other side. An automatic soldering device that causes molten solder to overflow in a direction opposite to the traveling direction of a printed circuit board, and is provided with a vibrating bath in which a vibrating plate is immersed in the overflow portion.
JP6514087U 1987-04-28 1987-04-28 Pending JPS63174964U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6514087U JPS63174964U (en) 1987-04-28 1987-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6514087U JPS63174964U (en) 1987-04-28 1987-04-28

Publications (1)

Publication Number Publication Date
JPS63174964U true JPS63174964U (en) 1988-11-14

Family

ID=30901939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6514087U Pending JPS63174964U (en) 1987-04-28 1987-04-28

Country Status (1)

Country Link
JP (1) JPS63174964U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247518B2 (en) * 1972-10-20 1977-12-02
JPS5516725A (en) * 1978-07-21 1980-02-05 Hitachi Ltd Soldering device
JPS5919156A (en) * 1982-07-23 1984-01-31 Komori Printing Mach Co Ltd Rotary valve device for printing press
JPS61293660A (en) * 1985-06-19 1986-12-24 Tamura Seisakusho Co Ltd Soldering device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247518B2 (en) * 1972-10-20 1977-12-02
JPS5516725A (en) * 1978-07-21 1980-02-05 Hitachi Ltd Soldering device
JPS5919156A (en) * 1982-07-23 1984-01-31 Komori Printing Mach Co Ltd Rotary valve device for printing press
JPS61293660A (en) * 1985-06-19 1986-12-24 Tamura Seisakusho Co Ltd Soldering device

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