JPH0160765U - - Google Patents
Info
- Publication number
- JPH0160765U JPH0160765U JP15674987U JP15674987U JPH0160765U JP H0160765 U JPH0160765 U JP H0160765U JP 15674987 U JP15674987 U JP 15674987U JP 15674987 U JP15674987 U JP 15674987U JP H0160765 U JPH0160765 U JP H0160765U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle body
- duct
- pump
- molten solder
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Description
第１図は本考案噴流はんだ槽の要部斜視図、第
２図は本考案噴流はんだ槽の正面中央断面図、第
３図は同平面図である。
１…ノズル本体、２…噴出口、３…ダクト、５
…ポンプ、１２…サブノズル。
FIG. 1 is a perspective view of a main part of the jet solder tank of the present invention, FIG. 2 is a front center sectional view of the jet solder tank of the present invention, and FIG. 3 is a plan view thereof. 1... Nozzle body, 2... Spout, 3... Duct, 5
...Pump, 12...Sub nozzle.
Claims (1)
だをノズル本体の噴出口から噴流させてプリント
基板のはんだ付けを行う噴流はんだ槽において、
ノズル本体の近傍にはノズル本体またはダクトに
接続されていてポンプで送られてくる溶融はんだ
を流入させることのできる液面測定用のサブノズ
ルが立設されていることを特徴とする噴流はんだ
槽。 In a jet soldering bath, printed circuit boards are soldered by jetting molten solder sent through a duct by a pump from the spout of the nozzle body.
A jet solder tank characterized in that a sub-nozzle for measuring the liquid level is installed in the vicinity of the nozzle body, and is connected to the nozzle body or a duct and can allow molten solder sent by a pump to flow therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15674987U JPH0421646Y2 (en) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15674987U JPH0421646Y2 (en) | 1987-10-15 | 1987-10-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160765U true JPH0160765U (en) | 1989-04-18 |
| JPH0421646Y2 JPH0421646Y2 (en) | 1992-05-18 |
Family
ID=31435567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15674987U Expired JPH0421646Y2 (en) | 1987-10-15 | 1987-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421646Y2 (en) |
-
1987
- 1987-10-15 JP JP15674987U patent/JPH0421646Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0421646Y2 (en) | 1992-05-18 |
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