JPS6024464U - soldering equipment - Google Patents

soldering equipment

Info

Publication number
JPS6024464U
JPS6024464U JP11846483U JP11846483U JPS6024464U JP S6024464 U JPS6024464 U JP S6024464U JP 11846483 U JP11846483 U JP 11846483U JP 11846483 U JP11846483 U JP 11846483U JP S6024464 U JPS6024464 U JP S6024464U
Authority
JP
Japan
Prior art keywords
solder
soldering equipment
jet
jet nozzles
molten solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11846483U
Other languages
Japanese (ja)
Inventor
奥瀬　竹宣
目片　富造
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP11846483U priority Critical patent/JPS6024464U/en
Publication of JPS6024464U publication Critical patent/JPS6024464U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半田装置の一部断面正面図、第２図は第
１図の噴流ノズルの斜視図、第３図及び第４図は第１図
のＡ−Ａ線及びＢ−Ｂ線に沿う拡大断面図、第５図は本
考案の一実施例を示す一部断面正面図、第６図及び第７
図は第６図のＣ−Ｃ線及びＤ−Ｄ線に沿う断面図である
。 １・・・半田槽、２，３・・・噴流ノズル、６・・・溶
融半田、２１・・・ポンプ、２２・・・ダンパ。Fig. 1 is a partially sectional front view of a conventional soldering device, Fig. 2 is a perspective view of the jet nozzle shown in Fig. 1, and Figs. 3 and 4 are lines AA and B-B in Fig. 1. 5 is a partially sectional front view showing an embodiment of the present invention, and FIGS. 6 and 7 are
The figure is a sectional view taken along lines CC and D-D in FIG. 6. DESCRIPTION OF SYMBOLS 1... Solder tank, 2, 3... Jet nozzle, 6... Molten solder, 21... Pump, 22... Damper.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半田槽内溶融半田を一括して循環供給するポンプ、その
溶融半田を所望形状で噴出させる複数個の噴流ノズル及
びこの噴流ノズルに対応してそれぞれ独立回転自在に配
置された噴流半田波形調整用ダンパとを具備したことを
特徴とする半田装置。A pump that circulates and supplies the molten solder in the solder tank, a plurality of jet nozzles that spray out the molten solder in a desired shape, and a damper for adjusting the jet solder waveform that is independently rotatably arranged in correspondence with the jet nozzles. A soldering device characterized by comprising:
JP11846483U 1983-07-28 1983-07-28 soldering equipment Pending JPS6024464U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11846483U JPS6024464U (en) 1983-07-28 1983-07-28 soldering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11846483U JPS6024464U (en) 1983-07-28 1983-07-28 soldering equipment

Publications (1)

Publication Number Publication Date
JPS6024464U true JPS6024464U (en) 1985-02-19

Family

ID=30272274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11846483U Pending JPS6024464U (en) 1983-07-28 1983-07-28 soldering equipment

Country Status (1)

Country Link
JP (1) JPS6024464U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60187092A (en) * 1984-03-07 1985-09-24 近藤　権士 Jet type solder tank
JP2021030256A (en) * 2019-08-21 2021-03-01 株式会社デンソーテン Soldering device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60187092A (en) * 1984-03-07 1985-09-24 近藤　権士 Jet type solder tank
JP2021030256A (en) * 2019-08-21 2021-03-01 株式会社デンソーテン Soldering device

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