JPS60187092A - Jet type solder tank - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a jet-flow solder bath in which the shape of jet waves of solder melt can be easily changed.

[Prior art]

Conventionally, when chip parts such as resistors and capacitors are temporarily attached with adhesive etc. and then soldered with a constant jet of solder melt on a fixed printed circuit board, the part behind the chip parts in the running direction of the printed circuit board, or each Areas where chip components are close to each other have a concave-like shape where air and other gases accumulate, preventing the solder melt from flowing in. K-metal solder either does not adhere, or even if it does adhere, a cavity forms and the solder is completely removed. Sometimes it didn't stick. Moreover, if bubbles are generated during one soldering process, there is a drawback that the bubbles cannot be removed even if a jet of solder melt is applied for a long time.

For this reason, the shape of the jet wave 3a of the solder melt 3 can be changed by changing the size of the jet port 2 of the jet tank 1, as shown in FIG. 1(g) Vl, or as shown in FIG. 1(b). In t'1k, a jet type soldering pot is proposed in which a jet plate 6° laminar 3a is formed to form a jet wave 3a of the solder melt 3 jetted from a jet port 5 of a jet tank 4 into a desired shape.

By the way, the jet flow tank 1 in FIG. 1(a) is different from the jet flow port 2 due to the size of the jet flow port 2, and the jet flow s4 in FIG. 1(b) is different from the jet flow plate 6.7.
The shape of the jet wave 3a is determined by this.

To change the shape of the jet wave 3a depending on the type of printed circuit board P, it is necessary to adjust the size of the jet port 2 each time, or select and replace the optimal jet plate 6゜1. Unfortunately, I have a lot of time and means to do these things.
There were such drawbacks.

[Summary of the invention]

The present invention has been made to solve the above-mentioned drawbacks, and provides a jet tank in which the shape of jet waves can be easily changed by providing a rotatable flow divider plate inside the jet port of the jet tank. It is something. This invention will be explained below.

[Embodiments of the invention]

FIG. 2 is a perspective view showing an embodiment of the present invention, in which reference numeral 11 denotes a solder bath, showing the main parts thereof. 12 is an outer tank of the solder tank 11; 13 is a jet tank installed in the outer tank 12; 14 is a jet port of the jet tank 13; 15 is a solder melt;
Reference numeral 16 denotes a flow divider plate, which is formed in a long shape and is connected to the jet outlet 14.
It is rotatably attached to the inside of the board P in a direction perpendicular to the conveyance direction (direction of the arrow) of the printed circuit board P by means of a hinge pole 17. As shown in FIG. 3, the hinge port 17 has a round shaft ITaK at its tip.

This round shaft ITm is formed in the flow dividing plate 16 and fits into a bearing hole 16m, and the threaded portion 17b is fixed to the jet N13 by screwing into the threaded hole 13a of the jet tank 13. Reference numeral 1B denotes a long hole formed in the jet tank 13, which is formed in an arc shape with the ζ njibor M7 as the center. 19 is a side plate that is closed to prevent the solder melt 15 in the jet tank 13 from spouting out from the elongated hole 18; 20 is the flow dividing plate 16;
After the is installed in the required position, the through hole 19a of the side plate 19 is fixed with a lock bolt to be fixed to the jet tank 13 together with the side plate 19.
and tl formed in the flow divider plate 16 after being pushed through the elongated hole 18,
7. , screw into screw hole 16bK.

Next, the operation will be explained.

To rotate the flow divider plate 16 and set it at a predetermined position, loosen the lock port 20, move it along the elongated hole 18, set it to the desired position together with the side plate 1B, and then tighten the lock port 20. n is good.

FIG. 4(a) shows the case where the flow dividing plate 16 is set vertically at the center position of the jet tank 13, and FIG. 4(b) shows the flow dividing plate 16
6 is tilted and fixed with respect to the transport direction of the printed circuit board P (direction of arrow A), so that its lower part is backward and forward.If the flow dividing plate 16 is tilted backward, the flow dividing The plate 16 is in the position shown by the dotted line, and the side plate 19 is in the position shown by the solid line, and when the flow dividing plate 16 is tilted forward, both the flow dividing plate 16 and the side plate 19 are in the position shown by the two-dot chain line. The side plate 19 is formed to a size that blocks the elongated hole 18 and prevents it from being exposed, no matter where the flow dividing plate 16 is located.

FIGS. 5(a) and 5(b) Ac) are explanatory diagrams showing the state in which the shape of the jet wave 15m of the solder melt 15 changes when the position of the flow dividing plate 16 is changed. In these figures, the printed circuit board P is transported at an upward angle θ with respect to the transport direction (direction of arrow A). In addition, the white arrow in the figure indicates the solder melt 15.
Indicates the direction of flow.

FIG. 5(a) shows a case where the flow dividing plate 16 is tilted backward in the direction of arrow A, and the jet wave 15a of the solder melt 15 &
'X front IC? i&<lower to the rear.

Therefore, the upper surface of the jet wave ISa becomes almost parallel to the conveyance direction of the printed circuit board P, so that the immersion distance 18 of the printed circuit board P is the longest.

FIG. 5(b) shows a case where the flow divider plate 16 is set in the vertical direction, and the jet wave 15a is ejected in a symmetrical manner slightly higher at the center, so the immersion distance 12 of the printed circuit board P is the same as in FIG. 5(a). Immersion distance! , will be shorter than .

FIG. 5(c) shows a case where the flow divider plate 16 is tilted forward in the direction of the arrow, and the jet wave 15a is higher toward the rear and lower toward the front.

The immersion distance 1j of the kth printed circuit board P is shown in Fig. 5 (b
) is even shorter than the immersion distance l.

This is 5K, the flow divider plate 16 according to type a of the printed circuit board P.
can be set at the optimal position.

If you want to change the slope of the flow divider plate 16, the printed circuit board P
If the immersion distance is long (for example, 1.Kf'n), it can be transported at a normal speed and immersed for the same time as the niblint substrate P.

〔Effect of the invention〕

As explained above, the present invention is such that the longitudinal direction of the flow divider plate is arranged inside the jet port of the jet tank in a direction perpendicular to the conveyance direction of the printed circuit board, and the flow divider plate is rotatably attached. Since we have provided a means to fix it in the desired position, it is easy to adjust the shape of the jet wave of the solder melt, the amount of jets before and after the direction of transport of the printed circuit board, and the jet flow width depending on the type of printed circuit board and the transport speed. , and can be set to the optimal condition.

Since it is easy to set the tilt position of the diversion plate,
This has the advantage of contributing to improved productivity because it saves time and effort in setting operations.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are side sectional views showing the shape of the cold jet port in a conventional jet tank, FIG. The figure is a partially cutaway side view showing how the flow divider plate is attached to the jet tank, Figures 4 (a) and (b) are explanatory diagrams showing the operation of the flow divider plate, and Figures 5 (a) and (b).
(c) is an explanatory diagram showing a state in which the shape of the jet wave differs depending on the position of the flow dividing plate. In the figure, 11 is a solder tank, 12 is an outer tank, 13 is a jet tank, 1
4 is a jet port, 15 is a solder melt, Ij aGt injection m
wave, 16 is a flow divider plate, 17 is a hinge bolt, 18 is a long hole,
11 is a side plate, and 20 is a lock bolt. (a) (c) Figure 5 (b)

Claims (1)

[Claims] In a soldering device equipped with a jet flow PL for spouting solder melt into a solder tank, a flow divider plate whose longitudinal direction is arranged perpendicular to the conveyance direction of the printed circuit board inside the jet port of the jet tank is rotated. 1. A jet-flow type solder bath, characterized in that the flow divider plate can be mounted in a desired position, and further provided with means for fixing the flow divider plate in a desired position.