JPS62202958U - - Google Patents
Info
- Publication number
- JPS62202958U JPS62202958U JP9000686U JP9000686U JPS62202958U JP S62202958 U JPS62202958 U JP S62202958U JP 9000686 U JP9000686 U JP 9000686U JP 9000686 U JP9000686 U JP 9000686U JP S62202958 U JPS62202958 U JP S62202958U
- Authority
- JP
- Japan
- Prior art keywords
- fluxer
- printed circuit
- nozzle
- automatic soldering
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims 2
- 230000004907 flux Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は自動半田付装置の正面図、第２図は同
じく側面図、第３図はフラクサー及び飛散噴霧液
捕集装置の一部を切欠した平面図、第４図は同じ
く一部を切欠した部分正面図、第５図は同じく一
部を切欠した部分側面図である。
２〜フラクサー、８〜コンベア、１４〜飛散噴
霧液捕集装置、１８〜プリント基板、２２ａ，２
２ｂ，２２ｃ〜ノズル、２６〜排気ダクト、２７
〜吸入口、２８〜送風機、２９〜フイルター、３
０〜排気口。
Fig. 1 is a front view of the automatic soldering device, Fig. 2 is a side view, Fig. 3 is a partially cutaway plan view of the fluxer and spray liquid collection device, and Fig. 4 is a partially cutaway plan. FIG. 5 is a partially cutaway side view. 2-Fluxer, 8-Conveyor, 14-Scattered spray liquid collection device, 18-Printed circuit board, 22a, 2
2b, 22c ~ nozzle, 26 ~ exhaust duct, 27
~Suction port, 28~Blower, 29~Filter, 3
0~Exhaust port.
Claims (1)
半田槽の前段に設けられ、プリント基板の下面に
フラツクス液をノズルより噴霧する自動半田付装
置のフラクサーに於て、前記フラクサーのノズル
の上部で前記コンベアの下部の高さ位置で、かつ
ノズルを囲んで排気ダクトの吸入口を設け、該排
気ダクト内の途中にフイルターを配設するととも
に、自動半田付装置の外部へ導いた端部に送風機
及び排気口を設けたことを特徴とするプリント基
板の自動半田付装置に於けるフラクサーの飛散噴
霧液捕集装置。 In the fluxer of an automatic soldering device, which is installed at the lower part of the conveyor that transfers the printed circuit board and before the molten solder bath, and which sprays flux liquid from a nozzle onto the lower surface of the printed circuit board, the fluxer is installed at the upper part of the nozzle of the fluxer and before the molten solder bath. An intake port for the exhaust duct is provided at a lower height position surrounding the nozzle, a filter is provided halfway inside the exhaust duct, and a blower and an exhaust port are provided at the end leading to the outside of the automatic soldering device. 1. A fluxer spray liquid collection device for an automatic soldering device for printed circuit boards, characterized in that it is provided with:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9000686U JPH0312448Y2 (en) | 1986-06-14 | 1986-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9000686U JPH0312448Y2 (en) | 1986-06-14 | 1986-06-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62202958U true JPS62202958U (en) | 1987-12-24 |
| JPH0312448Y2 JPH0312448Y2 (en) | 1991-03-25 |
Family
ID=30949503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9000686U Expired JPH0312448Y2 (en) | 1986-06-14 | 1986-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0312448Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04108960U (en) * | 1991-03-08 | 1992-09-21 | 権士 近藤 | Flux coating equipment |
-
1986
- 1986-06-14 JP JP9000686U patent/JPH0312448Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04108960U (en) * | 1991-03-08 | 1992-09-21 | 権士 近藤 | Flux coating equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312448Y2 (en) | 1991-03-25 |