JPH0362663U - - Google Patents
Info
- Publication number
- JPH0362663U JPH0362663U JP12364689U JP12364689U JPH0362663U JP H0362663 U JPH0362663 U JP H0362663U JP 12364689 U JP12364689 U JP 12364689U JP 12364689 U JP12364689 U JP 12364689U JP H0362663 U JPH0362663 U JP H0362663U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder melt
- wave
- overflow
- weir plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
Description
第１図ａ〜ｃはこの考案の一実施例を示すもの
で、第１図ａは斜視図、第１図ｂは、第１図ａの
要部を拡大して示した側断面図、第１図ｃは、第
１図ｂの矢印方向から見た一部破断正面図、第
２図ａ，ｂは従来のはんだ槽の一例を示すもので
、第２図ａは要部の正面図、第２図ｂは、第２図
ａの−線による断面図である。
図中、１……プリント基板、２……電子部品、
３……リード線、４……搬送チエーン、１１……
はんだ槽、１２……はんだ融液、１２ａ……噴流
波、１２ｂ……溢流波、１３……噴流槽、１４…
…噴流口、１５……貯溜部、１６……側板、１８
……流出部、３１……可動堰板、３１ａ……支点
、３１ｂ……先端部、３１ｃ……傾斜面、３３…
…調整ねじである。
Figures 1a to 1c show one embodiment of this invention, in which Figure 1a is a perspective view, Figure 1b is a side sectional view showing an enlarged main part of Figure 1a, and Figure 1b is a side sectional view showing an enlarged main part of Figure 1a. 1c is a partially cutaway front view seen from the direction of the arrow in FIG. 1b, FIGS. 2a and 2b show an example of a conventional solder tank, and FIG. 2a is a front view of the main parts. FIG. 2b is a sectional view taken along the - line in FIG. 2a. In the figure, 1... printed circuit board, 2... electronic components,
3... Lead wire, 4... Conveyance chain, 11...
Solder bath, 12... Solder melt, 12a... Jet wave, 12b... Overflow wave, 13... Jet tank, 14...
... Jet port, 15 ... Reservoir, 16 ... Side plate, 18
...Outflow portion, 31...Movable weir plate, 31a...Fully point, 31b...Tip, 31c...Slope, 33...
...It is an adjustment screw.
Claims (1)
流槽の噴流口に前記はんだ融液をプリント基板の
走行方向に対して反対方向へ流出して噴流波を形
成させるとともに、前記はんだ融液を貯留する貯
溜部を設けたはんだ槽において、前記貯溜部内の
前記はんだ融液を溢流して所要の溢流波を形成さ
せるために下端部を支点とする回動可能の可動堰
板を設け、この可動堰板を回動して所要の位置に
固定することにり、前記溢流波を所要の形状に設
定する調整手段を設けたことを特徴とするはんだ
槽。 A jet tank for jetting the solder melt is provided, and the solder melt flows out from the jet port of the jet tank in a direction opposite to the running direction of the printed circuit board to form a jet wave, and the solder melt is stored. A movable weir plate is provided which is rotatable with its lower end as a fulcrum in order to cause the solder melt in the reservoir to overflow and form a desired overflow wave. 1. A soldering bath characterized by comprising an adjusting means for setting the overflow wave to a desired shape by rotating and fixing a weir plate at a desired position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12364689U JPH0362663U (en) | 1989-10-24 | 1989-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12364689U JPH0362663U (en) | 1989-10-24 | 1989-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0362663U true JPH0362663U (en) | 1991-06-19 |
Family
ID=31671612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12364689U Pending JPH0362663U (en) | 1989-10-24 | 1989-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0362663U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6329662B2 (en) * | 1980-11-07 | 1988-06-14 | Fuji Heavy Ind Ltd |
-
1989
- 1989-10-24 JP JP12364689U patent/JPH0362663U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6329662B2 (en) * | 1980-11-07 | 1988-06-14 | Fuji Heavy Ind Ltd |
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