JPH01104072U - - Google Patents
Info
- Publication number
- JPH01104072U JPH01104072U JP20067787U JP20067787U JPH01104072U JP H01104072 U JPH01104072 U JP H01104072U JP 20067787 U JP20067787 U JP 20067787U JP 20067787 U JP20067787 U JP 20067787U JP H01104072 U JPH01104072 U JP H01104072U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flat part
- soldered
- electronic component
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Molten Solder (AREA)
Description
第１図は本考案の一実施例である回路基板を設
けてなる駆動ユニツトの一部切截斜視図、第２図
は集積回路が回路基板に仮止めされた状態を示す
図、第３図は集積回路が仮止めされた回路基板を
半田デイツプ槽に浸漬した状態を示す図、第４図
は第３図に示す状態より回路基板を引き上げた状
態を示す図、第５図乃至第８図は従来の回路基板
の一例を説明するための図である。
４……回路基板、４ａ……半田処理面、９……
集積回路、９ａ……平面部、１０……穴、１２…
…半田デイツプ槽。
FIG. 1 is a partially cutaway perspective view of a drive unit equipped with a circuit board according to an embodiment of the present invention, FIG. 2 is a diagram showing an integrated circuit temporarily attached to the circuit board, and FIG. Figure 4 shows the state in which the circuit board to which the integrated circuit is temporarily attached is immersed in the solder dip tank, Figure 4 shows the state in which the circuit board is pulled up from the state shown in Figure 3, and Figures 5 to 8. 1 is a diagram for explaining an example of a conventional circuit board. 4... Circuit board, 4a... Soldering surface, 9...
Integrated circuit, 9a...plane part, 10...hole, 12...
...Solder dip tank.
Claims (1)
る回路基板において、上記平面部と対向する位置
に穴を形成してなる構成の回路基板。 A circuit board to which an electronic component having a flat part is soldered, the circuit board having a hole formed at a position facing the flat part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20067787U JPH01104072U (en) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20067787U JPH01104072U (en) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104072U true JPH01104072U (en) | 1989-07-13 |
Family
ID=31491073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20067787U Pending JPH01104072U (en) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104072U (en) |
-
1987
- 1987-12-28 JP JP20067787U patent/JPH01104072U/ja active Pending