JPS6228472U - - Google Patents
Info
- Publication number
- JPS6228472U JPS6228472U JP12006285U JP12006285U JPS6228472U JP S6228472 U JPS6228472 U JP S6228472U JP 12006285 U JP12006285 U JP 12006285U JP 12006285 U JP12006285 U JP 12006285U JP S6228472 U JPS6228472 U JP S6228472U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- wiring board
- insertion hole
- immersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案にかかる電子部品取付用の配線
基板の一実施例を示す平面図、第２図は本考案の
挿通孔の一例を示す断面構成図、第３図は従来の
電子部品取付用の配線基板の挿通孔の断面構成図
である。
１０……配線基板、１１……挿通孔、１２……
コンデンサ、１５……端子、１６……支持部、１
７……空隙、１９……ハンダ液。
Fig. 1 is a plan view showing an embodiment of the wiring board for mounting electronic components according to the present invention, Fig. 2 is a cross-sectional configuration diagram showing an example of the insertion hole of the present invention, and Fig. 3 is a conventional electronic component mounting diagram. FIG. 3 is a cross-sectional configuration diagram of an insertion hole of a wiring board for use in the present invention. 10... Wiring board, 11... Insertion hole, 12...
Capacitor, 15...Terminal, 16...Support part, 1
7...Void, 19...Solder liquid.
Claims (1)
孔が貫通形成され、前記表面は電子部品を搭載す
る搭載面とされ、前記裏面はハンダ液に浸漬され
る浸漬面とされる電子部品取付用の配線基板にお
いて、 前記表面には、前記表面と対向する前記電子部
品の底面を前記表面から間隔を開けて支持する支
持部が前記表面に突出して形成され、前記表面と
前記電子部品の前記底面との間は、前記ハンダ液
への浸漬の際前記挿通孔内の気体を外方に排出す
る空隙となつていることを特徴とする電子部品取
付用の配線基板。[Claims for Utility Model Registration] An insertion hole for a terminal of an electronic component is formed from the front surface to the back surface, the front surface is a mounting surface on which the electronic component is mounted, and the back surface is an immersion surface that is immersed in solder liquid. In the wiring board for mounting electronic components, the surface is provided with a supporting portion protruding from the surface and supporting a bottom surface of the electronic component facing the surface at a distance from the surface; A wiring board for mounting an electronic component, characterized in that a gap is formed between the bottom surface of the electronic component and the bottom surface of the electronic component to discharge gas in the insertion hole to the outside when immersed in the solder liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12006285U JPS6228472U (en) | 1985-08-05 | 1985-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12006285U JPS6228472U (en) | 1985-08-05 | 1985-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6228472U true JPS6228472U (en) | 1987-02-20 |
Family
ID=31008027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12006285U Pending JPS6228472U (en) | 1985-08-05 | 1985-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228472U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0287694A (en) * | 1988-09-26 | 1990-03-28 | Nippon Chemicon Corp | Structure and method for packaging of electronic part |
| JP2019096687A (en) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | Resin molding substrate and mounting structure for capacitor |
-
1985
- 1985-08-05 JP JP12006285U patent/JPS6228472U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0287694A (en) * | 1988-09-26 | 1990-03-28 | Nippon Chemicon Corp | Structure and method for packaging of electronic part |
| JP2019096687A (en) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | Resin molding substrate and mounting structure for capacitor |
| US10984949B2 (en) | 2017-11-21 | 2021-04-20 | Fanuc Corporation | Resin molded substrate and mounting structure for capacitor |
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