JPS6237960U - - Google Patents
Info
- Publication number
- JPS6237960U JPS6237960U JP13059485U JP13059485U JPS6237960U JP S6237960 U JPS6237960 U JP S6237960U JP 13059485 U JP13059485 U JP 13059485U JP 13059485 U JP13059485 U JP 13059485U JP S6237960 U JPS6237960 U JP S6237960U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- casing
- electronic component
- wiring board
- solder liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案にかかる電子部品の筐体構造の
第１実施例を示す側面構成図、第２図は第１実施
例の筐体の底面図、第３図は本考案にかかる電子
部品の筐体構造の第２実施例を示す側面構成図、
第４図は第２実施例の筐体の底面図、第５図は従
来の筐体の側面構成図、第６図は従来の筐体の底
面図である。
１６…端子取付用孔、１８…筐体、１９…底面
、２０，２２…突起、２１，２３…隙間。
FIG. 1 is a side configuration diagram showing a first embodiment of the electronic component housing structure according to the present invention, FIG. 2 is a bottom view of the housing of the first embodiment, and FIG. 3 is an electronic component according to the present invention. a side configuration diagram showing a second embodiment of the housing structure;
FIG. 4 is a bottom view of the casing of the second embodiment, FIG. 5 is a side view of the conventional casing, and FIG. 6 is a bottom view of the conventional casing. 16...Terminal mounting hole, 18...Housing, 19...Bottom surface, 20, 22...Protrusion, 21, 23...Gap.
Claims (1)
ンダ液の浸漬面とされると共に、該裏面と該表面
との間を貫通して電子部品の端子取付用孔が形成
された電子部品取付用配線基板に搭載される電子
部品の筐体構造において、 前記電子部品取付用配線基板がハンダ液に浸漬
される際に前記端子取付用孔内の気体を排出する
隙間が形成されるように、前記筐体の底面を配線
基板の前記搭載面から間隔をあけて支持する突起
が前記筐体の底面に形成されていることを特徴と
する電子部品の筐体構造。[Claims for Utility Model Registration] The front surface is used as a mounting surface for mounting electronic components, the back surface is used as a surface for immersing solder liquid, and holes for mounting terminals of electronic components are provided through the space between the back surface and the front surface. In the housing structure of an electronic component mounted on a wiring board for mounting an electronic component, the wiring board for mounting an electronic component is immersed in solder liquid, a gap for discharging gas in the terminal mounting hole. A casing structure for an electronic component, characterized in that a protrusion is formed on the bottom surface of the casing to support the bottom surface of the casing at a distance from the mounting surface of the wiring board so that the bottom surface of the casing is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13059485U JPS6237960U (en) | 1985-08-26 | 1985-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13059485U JPS6237960U (en) | 1985-08-26 | 1985-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237960U true JPS6237960U (en) | 1987-03-06 |
Family
ID=31028241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13059485U Pending JPS6237960U (en) | 1985-08-26 | 1985-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237960U (en) |
-
1985
- 1985-08-26 JP JP13059485U patent/JPS6237960U/ja active Pending
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