JPS6356967U - - Google Patents
Info
- Publication number
- JPS6356967U JPS6356967U JP15097586U JP15097586U JPS6356967U JP S6356967 U JPS6356967 U JP S6356967U JP 15097586 U JP15097586 U JP 15097586U JP 15097586 U JP15097586 U JP 15097586U JP S6356967 U JPS6356967 U JP S6356967U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal frame
- jig
- protruding wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
及び第３図は従来例を示し、第２図は側断面図、
第３は斜視図を示す。第４図及び第５図は本考案
の前提となる治具の側断面図及び斜視図である。
１…プリント基板、２…金属枠体、３″…治具
、３ｅ…突壁。
FIG. 1 is a perspective view showing an embodiment of the present invention, FIGS. 2 and 3 show a conventional example, and FIG. 2 is a side sectional view.
The third shows a perspective view. FIGS. 4 and 5 are a side sectional view and a perspective view of the jig which is the premise of the present invention. 1... Printed circuit board, 2... Metal frame, 3''... Jig, 3e... Projection wall.
Claims (1)
し、金属枠体の一端を溶融半田に浸漬してプリン
ト基板の裏面及びプリント基板と金属枠体面を一
括して半田付けするための治具において、上記金
属枠体の溶融半田に浸漬される部分を囲む突壁を
設けかつ突壁と隣接する治具下面とプリント基板
の下面を面一に配置したことを特徴とする半田付
け用治具。 In a jig for supporting a metal frame surrounding the outer periphery of a printed circuit board and immersing one end of the metal frame in molten solder to solder the back surface of the printed circuit board and the printed circuit board and the surface of the metal frame all at once, A soldering jig characterized in that a protruding wall surrounds a portion of the metal frame to be immersed in molten solder, and the lower surface of the jig adjacent to the protruding wall and the lower surface of the printed circuit board are arranged flush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15097586U JPS6356967U (en) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15097586U JPS6356967U (en) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6356967U true JPS6356967U (en) | 1988-04-16 |
Family
ID=31067607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15097586U Pending JPS6356967U (en) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356967U (en) |
-
1986
- 1986-09-30 JP JP15097586U patent/JPS6356967U/ja active Pending