JPS6318877U - - Google Patents
Info
- Publication number
- JPS6318877U JPS6318877U JP11299586U JP11299586U JPS6318877U JP S6318877 U JPS6318877 U JP S6318877U JP 11299586 U JP11299586 U JP 11299586U JP 11299586 U JP11299586 U JP 11299586U JP S6318877 U JPS6318877 U JP S6318877U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- mounting structure
- electronic component
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007598 dipping method Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図Ａはこの考案の実施例である回路基板取
付構造を示す図であり、同図Ｂはカバー取付前の
底面図である。また第２図Ａは従来の回路基板取
付構造を示し、同図Ｂはカバー取付前のその底面
図を示している。
１……フレーム、１ａ……膨出部、２……回路
基板、４……カバー、５……電子部品。
FIG. 1A is a diagram showing a circuit board mounting structure according to an embodiment of this invention, and FIG. 1B is a bottom view before the cover is attached. Further, FIG. 2A shows a conventional circuit board mounting structure, and FIG. 2B shows a bottom view thereof before the cover is attached. DESCRIPTION OF SYMBOLS 1...Frame, 1a...Bulging part, 2...Circuit board, 4...Cover, 5...Electronic component.
Claims (1)
後半田デイツピングするものにおいて、少なくと
も回路基板の端部に実装されている電子部品に対
向するフレーム部を外側に膨出させたことを特徴
とする回路基板取付構造。 A circuit board temporarily fixed in a rectangular frame for solder dipping, characterized in that at least a portion of the frame facing an electronic component mounted on an end of the circuit board is bulged outward. Circuit board mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11299586U JPS6318877U (en) | 1986-07-22 | 1986-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11299586U JPS6318877U (en) | 1986-07-22 | 1986-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6318877U true JPS6318877U (en) | 1988-02-08 |
Family
ID=30994376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11299586U Pending JPS6318877U (en) | 1986-07-22 | 1986-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6318877U (en) |
-
1986
- 1986-07-22 JP JP11299586U patent/JPS6318877U/ja active Pending
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