JPS6418701U - - Google Patents
Info
- Publication number
- JPS6418701U JPS6418701U JP11262887U JP11262887U JPS6418701U JP S6418701 U JPS6418701 U JP S6418701U JP 11262887 U JP11262887 U JP 11262887U JP 11262887 U JP11262887 U JP 11262887U JP S6418701 U JPS6418701 U JP S6418701U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- insulating cover
- component body
- close contact
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図乃至第6図はこの考案の一実施例に係り
、第1図は絶縁カバーが装着された電子部品の断
面図、第2図は第1図の上面図、第3図は電子部
品単体の正面図、第4図は第3図の上面図、第5
図は絶縁カバーの断面図、第6図は第5図の上面
図、第7図は絶縁カバーの他の例を示す断面図、
第8図は絶縁カバーの更に他の例を示す断面図、
第9図乃至第12図は従来例に係り、第9図は絶
縁カバーが装着された電子部品の断面図、第10
図は第9図の上面図、第11図は第9図の下面図
、第12図は電子部品がプリント基板に実装され
た状態を示す説明図である。
図において、1は電子部品本体、2は絶縁カバ
ー、2aは側壁部、2bは底部、7は突起である
。なお、図中同一符号は同一、または相当部を示
す。
Figures 1 to 6 relate to one embodiment of this invention, in which Figure 1 is a sectional view of an electronic component with an insulating cover attached, Figure 2 is a top view of Figure 1, and Figure 3 is an electronic component. The front view of the unit, Figure 4 is the top view of Figure 3, and Figure 5 is the top view of Figure 3.
6 is a top view of FIG. 5, and FIG. 7 is a sectional view of another example of the insulating cover.
FIG. 8 is a sectional view showing still another example of the insulating cover;
9 to 12 relate to the conventional example, FIG. 9 is a cross-sectional view of an electronic component with an insulating cover attached, and FIG.
FIG. 11 is a top view of FIG. 9, FIG. 11 is a bottom view of FIG. 9, and FIG. 12 is an explanatory diagram showing a state in which electronic components are mounted on a printed circuit board. In the figure, 1 is an electronic component main body, 2 is an insulating cover, 2a is a side wall portion, 2b is a bottom portion, and 7 is a projection. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
設けた電子部品本体の周囲に密着する側壁部と、
電子部品の底面に密着する底部とを有する絶縁カ
バーを、前記電子部品本体に装着したことを特徴
とする電子部品の絶縁カバー取付構造。 a side wall portion that is provided with a protrusion around the electronic component body and that is in close contact with the periphery of the electronic component body provided with the protrusion;
1. An insulating cover mounting structure for an electronic component, characterized in that an insulating cover having a bottom portion that is in close contact with a bottom surface of the electronic component is attached to the electronic component body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11262887U JPS6418701U (en) | 1987-07-24 | 1987-07-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11262887U JPS6418701U (en) | 1987-07-24 | 1987-07-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6418701U true JPS6418701U (en) | 1989-01-30 |
Family
ID=31351737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11262887U Pending JPS6418701U (en) | 1987-07-24 | 1987-07-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6418701U (en) |
-
1987
- 1987-07-24 JP JP11262887U patent/JPS6418701U/ja active Pending