JPH0348282U - - Google Patents
Info
- Publication number
- JPH0348282U JPH0348282U JP10789389U JP10789389U JPH0348282U JP H0348282 U JPH0348282 U JP H0348282U JP 10789389 U JP10789389 U JP 10789389U JP 10789389 U JP10789389 U JP 10789389U JP H0348282 U JPH0348282 U JP H0348282U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- protection frame
- main body
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 230000000873 masking effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図ａとｂは本考案の一実施例を示す斜視図
とその−線断面図、第２図ａとｂとｃは本考
案による基板保護枠の製造工程を工程順に示した
要部側断面図、第３図は従来の基板保護枠の構成
を示す斜視図、第４図はプリント基板と基板保護
枠の接合工程を示す要部側断面図である。
図において、１……基板保持部、２……外周壁
部、３……フランジ部、４……実装用孔、５……
本体部、９……マスキングゾル、１０……プリン
ト基板、１１……半田層（半田）、１５……メツ
キ層、１８……マスキングテープ、Ｎ……半田付
け不可域、をそれぞれ示す。
Figures 1 a and b are a perspective view and a cross-sectional view taken along the line 1-2, showing an embodiment of the present invention, and Figures 2 a, b, and c are main parts side showing the manufacturing process of the board protection frame according to the present invention in order of process. 3 is a perspective view showing the structure of a conventional board protection frame, and FIG. 4 is a side sectional view of a main part showing a process of joining the printed circuit board and the board protection frame. In the figure, 1... Board holding part, 2... Outer peripheral wall part, 3... Flange part, 4... Mounting hole, 5...
Main body, 9... masking sol, 10... printed circuit board, 11... solder layer (solder), 15... plating layer, 18... masking tape, N... non-soldering area, respectively.
Claims (1)
構成された本体部５を額縁状に組み合わせてなる
プリント基板保護枠であつて、 半田付けが不可能な材料を用いて前記本体部５
を構成すると共に、前記外周壁部２の内周面に半
田付け不可域Ｎを形成し、それ以外の部分に半田
付けが可能な金属材料よりなるメツキ層１５を形
成してなることを特徴とするプリント基板保護枠
。[Claims for Utility Model Registration] A printed circuit board protection frame formed by combining a main body part 5 consisting of a board holding part 1, an outer peripheral wall part 2, and a flange part 3 into a frame shape, which cannot be soldered. The main body part 5 using the material
In addition, a non-solderable area N is formed on the inner peripheral surface of the outer peripheral wall portion 2, and a plating layer 15 made of a metal material that can be soldered is formed on the other part. Printed circuit board protection frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989107893U JPH0729669Y2 (en) | 1989-09-14 | 1989-09-14 | Printed circuit board protection frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989107893U JPH0729669Y2 (en) | 1989-09-14 | 1989-09-14 | Printed circuit board protection frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0348282U true JPH0348282U (en) | 1991-05-08 |
| JPH0729669Y2 JPH0729669Y2 (en) | 1995-07-05 |
Family
ID=31656558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989107893U Expired - Lifetime JPH0729669Y2 (en) | 1989-09-14 | 1989-09-14 | Printed circuit board protection frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0729669Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103382807A (en) * | 2013-07-22 | 2013-11-06 | 国家电网公司 | Multifunctional safe insulation ladder |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140600A (en) * | 1986-12-01 | 1988-06-13 | 株式会社村田製作所 | Manufacture of radio frequency equipment |
-
1989
- 1989-09-14 JP JP1989107893U patent/JPH0729669Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63140600A (en) * | 1986-12-01 | 1988-06-13 | 株式会社村田製作所 | Manufacture of radio frequency equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103382807A (en) * | 2013-07-22 | 2013-11-06 | 国家电网公司 | Multifunctional safe insulation ladder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729669Y2 (en) | 1995-07-05 |