JPS6165774U - - Google Patents

Info

Publication number
JPS6165774U
JPS6165774U JP15093484U JP15093484U JPS6165774U JP S6165774 U JPS6165774 U JP S6165774U JP 15093484 U JP15093484 U JP 15093484U JP 15093484 U JP15093484 U JP 15093484U JP S6165774 U JPS6165774 U JP S6165774U
Authority
JP
Japan
Prior art keywords
hole
mounting seat
printed circuit
circuit board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15093484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15093484U priority Critical patent/JPS6165774U/ja
Publication of JPS6165774U publication Critical patent/JPS6165774U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案によるPWBを示す断面図、第
2図は、本考案によるPWBに部品リードをはん
だ付けした状態を示す断面図、第3図及び第4図
は従来のPWBを示す断面図である。 1…スルホール、2…隣接回路、3…回路間隔
、4…コーナー部、5…部品取付座。
Fig. 1 is a cross-sectional view showing a PWB according to the present invention, Fig. 2 is a cross-sectional view showing a state in which component leads are soldered to the PWB according to the present invention, and Figs. 3 and 4 are cross-sectional views showing a conventional PWB. It is. 1...Through hole, 2...Adjacent circuit, 3...Circuit spacing, 4...Corner part, 5...Component mounting seat.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面スルホール印刷回路基板の部品取付座及び
該取付座に続くスルホール内壁の一部を座ぐり加
工等により除去してその表面積を基板の板厚方向
に増加し、該スルホールに隣接する回路との絶縁
間隔を拡大させたことを特徴とする印刷回路基板
The component mounting seat of a double-sided through-hole printed circuit board and a part of the inner wall of the through-hole following the mounting seat are removed by counterbore processing, etc. to increase the surface area in the thickness direction of the board, and to insulate the circuit adjacent to the through-hole. A printed circuit board characterized by increased spacing.
JP15093484U 1984-10-05 1984-10-05 Pending JPS6165774U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15093484U JPS6165774U (en) 1984-10-05 1984-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15093484U JPS6165774U (en) 1984-10-05 1984-10-05

Publications (1)

Publication Number Publication Date
JPS6165774U true JPS6165774U (en) 1986-05-06

Family

ID=30709064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15093484U Pending JPS6165774U (en) 1984-10-05 1984-10-05

Country Status (1)

Country Link
JP (1) JPS6165774U (en)

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