JPH0247081U - - Google Patents
Info
- Publication number
- JPH0247081U JPH0247081U JP12642088U JP12642088U JPH0247081U JP H0247081 U JPH0247081 U JP H0247081U JP 12642088 U JP12642088 U JP 12642088U JP 12642088 U JP12642088 U JP 12642088U JP H0247081 U JPH0247081 U JP H0247081U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electronic components
- lead
- wiring pattern
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例の上面図
及び下面図、第２図ａ〜ｃは第１の実施例におけ
る電子部品交換を説明するための上面図、斜視図
及び上面図、第３図は本考案の第２の実施例の上
面図、第４図は従来の電子部品実装用基板の下面
図、第５図は電子部品を搭載した実装用基板の斜
視図である。
１……実装用基板、２，３……配線パターン、
４……リード半田付用穴、５，５ａ……電子部品
、６……リード、７……半田、８……スリツト、
９……リード半田付用パターン、１０……リード
挿入用穴。
Figures 1 a and b are top and bottom views of the first embodiment of the present invention, and Figures 2 a to c are top views, perspective views, and top views for explaining electronic component replacement in the first embodiment. 3 is a top view of a second embodiment of the present invention, FIG. 4 is a bottom view of a conventional electronic component mounting board, and FIG. 5 is a perspective view of a mounting board on which electronic components are mounted. . 1... Mounting board, 2, 3... Wiring pattern,
4... Lead soldering hole, 5, 5a... Electronic component, 6... Lead, 7... Solder, 8... Slit,
9... Pattern for lead soldering, 10... Hole for lead insertion.
Claims (1)
れ、該配線パターンの端部に電子部品のリード挿
入半田付用穴が形成されている電子部品実装用基
板において、前記穴の近傍に交換のための電子部
品のリード挿入用の穴またはスリツトを設けたこ
とを特徴とする電子部品実装用基板。 In a board for mounting electronic components, in which a wiring pattern is formed on the upper and lower surfaces of an insulating plate, and a hole for inserting and soldering a lead of an electronic component is formed at the end of the wiring pattern, there is a hole for replacing a lead in the vicinity of the hole. A board for mounting electronic components, characterized by having holes or slits for inserting leads of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12642088U JPH0247081U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12642088U JPH0247081U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247081U true JPH0247081U (en) | 1990-03-30 |
Family
ID=31377928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12642088U Pending JPH0247081U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247081U (en) |
-
1988
- 1988-09-27 JP JP12642088U patent/JPH0247081U/ja active Pending