JPH0284362U - - Google Patents
Info
- Publication number
- JPH0284362U JPH0284362U JP16314188U JP16314188U JPH0284362U JP H0284362 U JPH0284362 U JP H0284362U JP 16314188 U JP16314188 U JP 16314188U JP 16314188 U JP16314188 U JP 16314188U JP H0284362 U JPH0284362 U JP H0284362U
- Authority
- JP
- Japan
- Prior art keywords
- small substrates
- parts
- soldered
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は本考案の一実施例に係るプリント基板
の斜視図、第2図は第1図の―断面図、第3
図は分割前のプリント基板を説明するための斜視
図、第4図はプリント基板に取付けられるリード
線の斜視図、第5図はリード線がプリント基板に
取付けられた状態を示す説明図、第6図はプリン
ト基板より分割された小基板が取付部材に取付け
られた状態を示す説明図である。
1……基板、2,3……小基板、5,6……リ
ード線挿入孔、7……分割用切欠き、8……取付
用孔、9……リード線、9a……屈曲部、20…
…プリント基板。
FIG. 1 is a perspective view of a printed circuit board according to an embodiment of the present invention, FIG. 2 is a sectional view of FIG.
The figure is a perspective view for explaining the printed circuit board before division, FIG. 4 is a perspective view of the lead wire attached to the printed circuit board, FIG. FIG. 6 is an explanatory diagram showing a state in which small boards divided from a printed circuit board are attached to a mounting member. 1... Board, 2, 3... Small board, 5, 6... Lead wire insertion hole, 7... Division notch, 8... Mounting hole, 9... Lead wire, 9a... Bent part, 20...
…Printed board.
Claims (1)
れており且つ、前記複数の小基板には挿入孔が形
成され、同一の線材にて形成された複数の半田付
け部がそれぞれ異なつた小基板の挿入孔に挿入さ
れて半田付けされたプリント基板において、前記
線材の半田付け部と半田付け部との間には複数の
屈曲部が形成されていることを特徴とするプリン
ト基板。 A plurality of small substrates that are separated from each other are integrally formed, insertion holes are formed in the plurality of small substrates, and a plurality of soldered parts formed of the same wire are connected to different small substrates. 1. A printed circuit board inserted into an insertion hole and soldered thereto, wherein a plurality of bent parts are formed between the soldering parts of the wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16314188U JPH0284362U (en) | 1988-12-16 | 1988-12-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16314188U JPH0284362U (en) | 1988-12-16 | 1988-12-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0284362U true JPH0284362U (en) | 1990-06-29 |
Family
ID=31447601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16314188U Pending JPH0284362U (en) | 1988-12-16 | 1988-12-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0284362U (en) |
-
1988
- 1988-12-16 JP JP16314188U patent/JPH0284362U/ja active Pending
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