JPS63185269U - - Google Patents
Info
- Publication number
- JPS63185269U JPS63185269U JP7579187U JP7579187U JPS63185269U JP S63185269 U JPS63185269 U JP S63185269U JP 7579187 U JP7579187 U JP 7579187U JP 7579187 U JP7579187 U JP 7579187U JP S63185269 U JPS63185269 U JP S63185269U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- insertion hole
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案になるプリント基板の好適な一
実施例を示す一部拡大断面図、第２図は本考案の
プリント基板を用いた実装状態を示す外観斜視図
、第３図は従来のプリント基板における実装状態
を示す外観斜視図、第４図は従来のプリント基板
の一部拡大断面図、第５図は電子部品をプリント
基板に実装するための工程図である。
１……電子部品、２……リード線、７……プリ
ント基板、９……ガイドピン、１１……パターン
、１２……挿入孔。
FIG. 1 is a partially enlarged cross-sectional view showing a preferred embodiment of the printed circuit board of the present invention, FIG. 2 is an external perspective view showing a mounting state using the printed circuit board of the present invention, and FIG. 3 is a conventional FIG. 4 is a partially enlarged sectional view of a conventional printed circuit board, and FIG. 5 is a process diagram for mounting electronic components on a printed circuit board. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Lead wire, 7... Printed circuit board, 9... Guide pin, 11... Pattern, 12... Insertion hole.
Claims (1)
た電子部品のリード線挿入孔を、電子部品を実装
する表面側に比べて裏面側を大としたことを特徴
とするプリント基板。 1. A printed circuit board having a predetermined pattern in which a lead wire insertion hole for an electronic component is made larger on the back side than on the front side where the electronic component is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7579187U JPS63185269U (en) | 1987-05-20 | 1987-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7579187U JPS63185269U (en) | 1987-05-20 | 1987-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63185269U true JPS63185269U (en) | 1988-11-29 |
Family
ID=30922260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7579187U Pending JPS63185269U (en) | 1987-05-20 | 1987-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63185269U (en) |
-
1987
- 1987-05-20 JP JP7579187U patent/JPS63185269U/ja active Pending
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