JPH0325276U - - Google Patents
Info
- Publication number
- JPH0325276U JPH0325276U JP8630889U JP8630889U JPH0325276U JP H0325276 U JPH0325276 U JP H0325276U JP 8630889 U JP8630889 U JP 8630889U JP 8630889 U JP8630889 U JP 8630889U JP H0325276 U JPH0325276 U JP H0325276U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- printed circuit
- component device
- rectangular hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Description
第１図ないし第６図は本考案の第１実施例を示
し、第１図は電子部品装置の部分斜視図、第２図
は電子部品実装部の斜視図、第３図はリード線の
折り曲げ部分を示す斜視図、第４図および第５図
はリード線折り曲げの説明図、第６図は電子部品
の実装状態を示す部分断面図である。第７，８図
は本考案の第２実施例を示し、第７図はリード線
の折り曲げ部分を示す斜視図、第８図はリード線
の折り曲げ部分を示す部分断面図である。第９図
は従来例の電子部品の実装状態を示す部分断面図
である。
１……プリント基板、２……電子部品、３……
リード線、ａ……パターン、ｂ……リード線挿通
孔。
1 to 6 show a first embodiment of the present invention, FIG. 1 is a partial perspective view of an electronic component device, FIG. 2 is a perspective view of an electronic component mounting section, and FIG. 3 is a bending of lead wires. FIGS. 4 and 5 are perspective views showing the parts, FIGS. 4 and 5 are explanatory views of bending the lead wires, and FIG. 6 is a partial sectional view showing the state in which electronic components are mounted. 7 and 8 show a second embodiment of the present invention, FIG. 7 being a perspective view showing the bent portion of the lead wire, and FIG. 8 being a partial sectional view showing the bent portion of the lead wire. FIG. 9 is a partial sectional view showing a mounting state of a conventional electronic component. 1...Printed circuit board, 2...Electronic components, 3...
Lead wire, a...pattern, b...lead wire insertion hole.
Claims (1)
リード線を挿通しその挿通部分をプリント基板の
パターンに半田付けして成る電子部品装置におい
て、前記挿通部分を矩形孔の短辺方向両側へ折り
曲げてあることを特徴とする電子部品装置。 In an electronic component device in which a lead wire having a rectangular cross section is inserted into a rectangular hole formed in a printed circuit board and the inserted portion is soldered to the pattern of the printed circuit board, the inserted portion is bent to both sides in the short side direction of the rectangular hole. An electronic component device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8630889U JPH0325276U (en) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8630889U JPH0325276U (en) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325276U true JPH0325276U (en) | 1991-03-15 |
Family
ID=31635809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8630889U Pending JPH0325276U (en) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325276U (en) |
-
1989
- 1989-07-21 JP JP8630889U patent/JPH0325276U/ja active Pending