JPH03110854U - - Google Patents
Info
- Publication number
- JPH03110854U JPH03110854U JP2064390U JP2064390U JPH03110854U JP H03110854 U JPH03110854 U JP H03110854U JP 2064390 U JP2064390 U JP 2064390U JP 2064390 U JP2064390 U JP 2064390U JP H03110854 U JPH03110854 U JP H03110854U
- Authority
- JP
- Japan
- Prior art keywords
- board
- flat package
- lead terminal
- lead terminals
- bent part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
Description
第１図ａ及びｂは本考案の一実施例を説明する
ためのフラツトパツケージＩＣの全体の斜視図お
よび平面図、第２図ａ及びｂは第１図に示した屈
曲部のあるリード端子の基板への取付構造の詳細
を示す断面図及び斜視図、第３図は従来のフラツ
トパツケージＩＣの一例の斜視図である。
１，６……フラツトパツケージＩＣ、２，２ａ
，２ｂ，２ｃ，２ｄ，９……リード端子、３……
屈曲部、４，８……基板、５，７……銅箔パツト
、６……取付用孔。
1A and 1B are an overall perspective view and a plan view of a flat package IC for explaining an embodiment of the present invention, and FIGS. 2A and 2B are lead terminals with bent portions shown in FIG. 1. FIG. 3 is a perspective view of an example of a conventional flat package IC. 1, 6...Flat package IC, 2, 2a
, 2b, 2c, 2d, 9...Lead terminal, 3...
Bent portion, 4, 8... Board, 5, 7... Copper foil part, 6... Mounting hole.
Claims (1)
パツケージＩＣのリード端子のうち、方形の各頂
点に近い特定の少数のリード端子の先端部に水平
方向から基板側に折れ曲がつ屈曲部を設け、基板
上に設けられ前記フラツトパツケージＩＣの各リ
ード端子と電気的接続を行うパツトのうち、前記
屈曲部を有するリード端子と対応するパツトに前
記屈曲部が圧接状態で挿入される取付用孔を設け
たことを特徴とするフラツトパツケージＩＣの取
付構造。 Among the lead terminals of a surface-mounted flat package IC mounted horizontally on the board, a small number of specific lead terminals near each vertex of the rectangle have bent portions that bend from the horizontal direction toward the board. For mounting, the bent part is inserted in a press-contact state into a part corresponding to the lead terminal having the bent part among the parts provided on the board and electrically connected to each lead terminal of the flat package IC. A mounting structure for a flat package IC characterized by having holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2064390U JPH03110854U (en) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2064390U JPH03110854U (en) | 1990-02-28 | 1990-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110854U true JPH03110854U (en) | 1991-11-13 |
Family
ID=31523730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2064390U Pending JPH03110854U (en) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110854U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007033546A (en) * | 2005-07-22 | 2007-02-08 | Shinwa Kk | Food container and its related article as advertising means |
-
1990
- 1990-02-28 JP JP2064390U patent/JPH03110854U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007033546A (en) * | 2005-07-22 | 2007-02-08 | Shinwa Kk | Food container and its related article as advertising means |
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