JPS6333664U - - Google Patents
Info
- Publication number
- JPS6333664U JPS6333664U JP12691086U JP12691086U JPS6333664U JP S6333664 U JPS6333664 U JP S6333664U JP 12691086 U JP12691086 U JP 12691086U JP 12691086 U JP12691086 U JP 12691086U JP S6333664 U JPS6333664 U JP S6333664U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- printed circuit
- wiring pattern
- fixing portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の第１の実施例を示す半導体装
置の実装構造断面図、第２図は従来のＤＩＰ形半
導体装置の実装構造の一例を示す断面図、第３図
、第４図および第５図はそれぞれ本考案の第２の
実施例、第３の実施例および第４の実施例を示す
半導体装置の実装構造断面図である。
２１，４３，５２……半導体装置、２２，４４
，５３……パツケージ、２３，４１，５１……リ
ード、２４，４２……固定部、２５，２９，３２
……プリント基板、２６……開口部、２７……電
極部、２８……はんだ、３０，３１……板間コネ
クタ、４５……突出部。
FIG. 1 is a sectional view of a mounting structure of a semiconductor device showing a first embodiment of the present invention, FIG. 2 is a sectional view of an example of a mounting structure of a conventional DIP type semiconductor device, FIGS. FIG. 5 is a sectional view of a mounting structure of a semiconductor device showing a second embodiment, a third embodiment, and a fourth embodiment of the present invention, respectively. 21, 43, 52...Semiconductor device, 22, 44
, 53... Package cage, 23, 41, 51... Lead, 24, 42... Fixed part, 25, 29, 32
... Printed circuit board, 26 ... Opening, 27 ... Electrode section, 28 ... Solder, 30, 31 ... Interboard connector, 45 ... Protrusion.
Claims (1)
突出する複数本のリードを有するＤＩＰ形の半導
体装置と、少なくとも一方の面に配線パターンが
形成されたプリント基板とを備え、前記プリント
基板の半導体装置搭載予定箇所に前記半導体装置
を固着した半導体装置の実装構造において、 前記各リードを前記プリント基板とほぼ平行か
つ外方向に折曲して固定部を形成すると共に、 前記半導体装置搭載予定箇所に前記半導体装置
のパツケージよりも大きな開口部を形成し、 この開口部に前記半導体装置を収容し、かつ前
記固定部を前記配線パターンに固着したことを特
徴とする半導体装置の実装構造。[Claims for Utility Model Registration] A DIP type semiconductor device having a plurality of leads projecting downward from a package housing a semiconductor element, and a printed circuit board having a wiring pattern formed on at least one surface, In a semiconductor device mounting structure in which the semiconductor device is fixed to a portion of the printed circuit board where the semiconductor device is to be mounted, each lead is bent substantially parallel to the printed circuit board and outward to form a fixing portion, and the semiconductor device is mounted on the printed circuit board. A mounting of a semiconductor device, characterized in that an opening larger than the package of the semiconductor device is formed at a location where the device is to be mounted, the semiconductor device is housed in the opening, and the fixing portion is fixed to the wiring pattern. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12691086U JPS6333664U (en) | 1986-08-20 | 1986-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12691086U JPS6333664U (en) | 1986-08-20 | 1986-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6333664U true JPS6333664U (en) | 1988-03-04 |
Family
ID=31021159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12691086U Pending JPS6333664U (en) | 1986-08-20 | 1986-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6333664U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6218928B2 (en) * | 1979-12-31 | 1987-04-25 | Pentel Kk | |
| JPS631377B2 (en) * | 1983-08-31 | 1988-01-12 | Kobe Steel Ltd |
-
1986
- 1986-08-20 JP JP12691086U patent/JPS6333664U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6218928B2 (en) * | 1979-12-31 | 1987-04-25 | Pentel Kk | |
| JPS631377B2 (en) * | 1983-08-31 | 1988-01-12 | Kobe Steel Ltd |
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